1.1. Research Objective
1.2. Scope of the Study
1.3. Definition
2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations
3.1. Market Snapshot
4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis
4.3.1. Raw Material Procurement Analysis
4.3.2. Sales and Distribution Channel Analysis
4.3.3. Downstream Buyer Analysis
5.1. COVID-19 Landscape: Wide Band Gap (WBG) Semiconductors Industry Impact
5.2. COVID 19 - Impact Assessment for the Industry
5.3. COVID 19 Impact: Global Major Government Policy
5.4. Market Trends and Opportunities in the COVID-19 Landscape
6.1. Market Dynamics
6.1.1. Market Drivers
6.1.2. Market Restraints
6.1.3. Market Opportunities
6.2. Porter’s Five Forces Analysis
6.2.1. Bargaining power of suppliers
6.2.2. Bargaining power of buyers
6.2.3. Threat of substitute
6.2.4. Threat of new entrants
6.2.5. Degree of competition
7.1.1. Company Market Share/Positioning Analysis
7.1.2. Key Strategies Adopted by Players
7.1.3. Vendor Landscape
7.1.3.1. List of Suppliers
7.1.3.2. List of Buyers
8.1. Wide Band Gap (WBG) Semiconductors Market Revenue and Volume, by Material Type
8.1.1. Silicon Carbide (SiC)
8.1.1.1. Market Revenue and Volume Forecast
8.1.2. Gallium Nitride (GaN)
8.1.2.1. Market Revenue and Volume Forecast
8.1.3. Diamond
8.1.3.1. Market Revenue and Volume Forecast
8.1.4. Zinc Oxide (ZnO)
8.1.4.1. Market Revenue and Volume Forecast
8.1.5. Gallium Oxide (GaâOâ)
8.1.5.1. Market Revenue and Volume Forecast
8.1.6. Aluminum Nitride (AlN)
8.1.6.1. Market Revenue and Volume Forecast
8.1.7. Others (BN, etc.)
8.1.7.1. Market Revenue and Volume Forecast
9.1. Wide Band Gap (WBG) Semiconductors Market Revenue and Volume, by Device Type
9.1.1. Power Devices
9.1.1.1. Market Revenue and Volume Forecast
9.1.2. RF Devices
9.1.2.1. Market Revenue and Volume Forecast
9.1.3. Optoelectronic Devices
9.1.3.1. Market Revenue and Volume Forecast
10.1. Wide Band Gap (WBG) Semiconductors Market Revenue and Volume, by Wafer Size
10.1.1. 2-inch
10.1.1.1. Market Revenue and Volume Forecast
10.1.2. 4-inch
10.1.2.1. Market Revenue and Volume Forecast
10.1.3. 6-inch
10.1.3.1. Market Revenue and Volume Forecast
10.1.4. 8-inch
10.1.4.1. Market Revenue and Volume Forecast
10.1.5. 12-inch
10.1.5.1. Market Revenue and Volume Forecast
11.1. Wide Band Gap (WBG) Semiconductors Market Revenue and Volume, by Application
11.1.1. Power Electronics
11.1.1.1. Market Revenue and Volume Forecast
11.1.2. RF & Microwave
11.1.2.1. Market Revenue and Volume Forecast
11.1.3. Lighting & Display
11.1.3.1. Market Revenue and Volume Forecast
11.1.4. Electric Vehicles (EV) & Charging Infrastructure
11.1.4.1. Market Revenue and Volume Forecast
11.1.5. Aerospace & Defense
11.1.5.1. Market Revenue and Volume Forecast
11.1.6. Consumer Electronics
11.1.6.1. Market Revenue and Volume Forecast
11.1.7. Others
11.1.7.1. Market Revenue and Volume Forecast
12.1. Wide Band Gap (WBG) Semiconductors Market Revenue and Volume, by End-use Industry
12.1.1. Automotive
12.1.1.1. Market Revenue and Volume Forecast
12.1.2. Industrial
12.1.2.1. Market Revenue and Volume Forecast
12.1.3. Consumer Electronics
12.1.3.1. Market Revenue and Volume Forecast
12.1.4. Telecommunications
12.1.4.1. Market Revenue and Volume Forecast
12.1.5. Energy & Utility
12.1.5.1. Market Revenue and Volume Forecast
12.1.6. Aerospace & Defense
12.1.6.1. Market Revenue and Volume Forecast
12.1.7. Healthcare
12.1.7.1. Market Revenue and Volume Forecast
13.1. North America
13.1.1. Market Revenue and Volume Forecast, by Material Type
13.1.2. Market Revenue and Volume Forecast, by Device Type
13.1.3. Market Revenue and Volume Forecast, by Wafer Size
13.1.4. Market Revenue and Volume Forecast, by Application
13.1.5. Market Revenue and Volume Forecast, by End-use Industry
13.1.6. U.S.
13.1.6.1. Market Revenue and Volume Forecast, by Material Type
13.1.6.2. Market Revenue and Volume Forecast, by Device Type
13.1.6.3. Market Revenue and Volume Forecast, by Wafer Size
13.1.6.4. Market Revenue and Volume Forecast, by Application
13.1.6.5. Market Revenue and Volume Forecast, by End-use Industry
13.1.7. Rest of North America
13.1.7.1. Market Revenue and Volume Forecast, by Material Type
13.1.7.2. Market Revenue and Volume Forecast, by Device Type
13.1.7.3. Market Revenue and Volume Forecast, by Wafer Size
13.1.7.4. Market Revenue and Volume Forecast, by Application
13.1.7.5. Market Revenue and Volume Forecast, by End-use Industry
13.2. Europe
13.2.1. Market Revenue and Volume Forecast, by Material Type
13.2.2. Market Revenue and Volume Forecast, by Device Type
13.2.3. Market Revenue and Volume Forecast, by Wafer Size
13.2.4. Market Revenue and Volume Forecast, by Application
13.2.5. Market Revenue and Volume Forecast, by End-use Industry
13.2.6. UK
13.2.6.1. Market Revenue and Volume Forecast, by Material Type
13.2.6.2. Market Revenue and Volume Forecast, by Device Type
13.2.6.3. Market Revenue and Volume Forecast, by Wafer Size
13.2.7. Market Revenue and Volume Forecast, by Application
13.2.8. Market Revenue and Volume Forecast, by End-use Industry
13.2.9. Germany
13.2.9.1. Market Revenue and Volume Forecast, by Material Type
13.2.9.2. Market Revenue and Volume Forecast, by Device Type
13.2.9.3. Market Revenue and Volume Forecast, by Wafer Size
13.2.10. Market Revenue and Volume Forecast, by Application
13.2.11. Market Revenue and Volume Forecast, by End-use Industry
13.2.12. France
13.2.12.1. Market Revenue and Volume Forecast, by Material Type
13.2.12.2. Market Revenue and Volume Forecast, by Device Type
13.2.12.3. Market Revenue and Volume Forecast, by Wafer Size
13.2.12.4. Market Revenue and Volume Forecast, by Application
13.2.13. Market Revenue and Volume Forecast, by End-use Industry
13.2.14. Rest of Europe
13.2.14.1. Market Revenue and Volume Forecast, by Material Type
13.2.14.2. Market Revenue and Volume Forecast, by Device Type
13.2.14.3. Market Revenue and Volume Forecast, by Wafer Size
13.2.14.4. Market Revenue and Volume Forecast, by Application
13.2.15. Market Revenue and Volume Forecast, by End-use Industry
13.3. APAC
13.3.1. Market Revenue and Volume Forecast, by Material Type
13.3.2. Market Revenue and Volume Forecast, by Device Type
13.3.3. Market Revenue and Volume Forecast, by Wafer Size
13.3.4. Market Revenue and Volume Forecast, by Application
13.3.5. Market Revenue and Volume Forecast, by End-use Industry
13.3.6. India
13.3.6.1. Market Revenue and Volume Forecast, by Material Type
13.3.6.2. Market Revenue and Volume Forecast, by Device Type
13.3.6.3. Market Revenue and Volume Forecast, by Wafer Size
13.3.6.4. Market Revenue and Volume Forecast, by Application
13.3.7. Market Revenue and Volume Forecast, by End-use Industry
13.3.8. China
13.3.8.1. Market Revenue and Volume Forecast, by Material Type
13.3.8.2. Market Revenue and Volume Forecast, by Device Type
13.3.8.3. Market Revenue and Volume Forecast, by Wafer Size
13.3.8.4. Market Revenue and Volume Forecast, by Application
13.3.9. Market Revenue and Volume Forecast, by End-use Industry
13.3.10. Japan
13.3.10.1. Market Revenue and Volume Forecast, by Material Type
13.3.10.2. Market Revenue and Volume Forecast, by Device Type
13.3.10.3. Market Revenue and Volume Forecast, by Wafer Size
13.3.10.4. Market Revenue and Volume Forecast, by Application
13.3.10.5. Market Revenue and Volume Forecast, by End-use Industry
13.3.11. Rest of APAC
13.3.11.1. Market Revenue and Volume Forecast, by Material Type
13.3.11.2. Market Revenue and Volume Forecast, by Device Type
13.3.11.3. Market Revenue and Volume Forecast, by Wafer Size
13.3.11.4. Market Revenue and Volume Forecast, by Application
13.3.11.5. Market Revenue and Volume Forecast, by End-use Industry
13.4. MEA
13.4.1. Market Revenue and Volume Forecast, by Material Type
13.4.2. Market Revenue and Volume Forecast, by Device Type
13.4.3. Market Revenue and Volume Forecast, by Wafer Size
13.4.4. Market Revenue and Volume Forecast, by Application
13.4.5. Market Revenue and Volume Forecast, by End-use Industry
13.4.6. GCC
13.4.6.1. Market Revenue and Volume Forecast, by Material Type
13.4.6.2. Market Revenue and Volume Forecast, by Device Type
13.4.6.3. Market Revenue and Volume Forecast, by Wafer Size
13.4.6.4. Market Revenue and Volume Forecast, by Application
13.4.7. Market Revenue and Volume Forecast, by End-use Industry
13.4.8. North Africa
13.4.8.1. Market Revenue and Volume Forecast, by Material Type
13.4.8.2. Market Revenue and Volume Forecast, by Device Type
13.4.8.3. Market Revenue and Volume Forecast, by Wafer Size
13.4.8.4. Market Revenue and Volume Forecast, by Application
13.4.9. Market Revenue and Volume Forecast, by End-use Industry
13.4.10. South Africa
13.4.10.1. Market Revenue and Volume Forecast, by Material Type
13.4.10.2. Market Revenue and Volume Forecast, by Device Type
13.4.10.3. Market Revenue and Volume Forecast, by Wafer Size
13.4.10.4. Market Revenue and Volume Forecast, by Application
13.4.10.5. Market Revenue and Volume Forecast, by End-use Industry
13.4.11. Rest of MEA
13.4.11.1. Market Revenue and Volume Forecast, by Material Type
13.4.11.2. Market Revenue and Volume Forecast, by Device Type
13.4.11.3. Market Revenue and Volume Forecast, by Wafer Size
13.4.11.4. Market Revenue and Volume Forecast, by Application
13.4.11.5. Market Revenue and Volume Forecast, by End-use Industry
13.5. Latin America
13.5.1. Market Revenue and Volume Forecast, by Material Type
13.5.2. Market Revenue and Volume Forecast, by Device Type
13.5.3. Market Revenue and Volume Forecast, by Wafer Size
13.5.4. Market Revenue and Volume Forecast, by Application
13.5.5. Market Revenue and Volume Forecast, by End-use Industry
13.5.6. Brazil
13.5.6.1. Market Revenue and Volume Forecast, by Material Type
13.5.6.2. Market Revenue and Volume Forecast, by Device Type
13.5.6.3. Market Revenue and Volume Forecast, by Wafer Size
13.5.6.4. Market Revenue and Volume Forecast, by Application
13.5.7. Market Revenue and Volume Forecast, by End-use Industry
13.5.8. Rest of LATAM
13.5.8.1. Market Revenue and Volume Forecast, by Material Type
13.5.8.2. Market Revenue and Volume Forecast, by Device Type
13.5.8.3. Market Revenue and Volume Forecast, by Wafer Size
13.5.8.4. Market Revenue and Volume Forecast, by Application
13.5.8.5. Market Revenue and Volume Forecast, by End-use Industry
14.1. Infineon Technologies AG
14.1.1. Company Overview
14.1.2. Product Offerings
14.1.3. Financial Performance
14.1.4. Recent Initiatives
14.2. IQE plc
14.2.1. Company Overview
14.2.2. Product Offerings
14.2.3. Financial Performance
14.2.4. Recent Initiatives
14.3. MACOM Technology Solutions
14.3.1. Company Overview
14.3.2. Product Offerings
14.3.3. Financial Performance
14.3.4. Recent Initiatives
14.4. Navitas Semiconductor
14.4.1. Company Overview
14.4.2. Product Offerings
14.4.3. Financial Performance
14.4.4. Recent Initiatives
14.5. NXP Semiconductors
14.5.1. Company Overview
14.5.2. Product Offerings
14.5.3. Financial Performance
14.5.4. Recent Initiatives
14.6. ON Semiconductor (onsemi)
14.6.1. Company Overview
14.6.2. Product Offerings
14.6.3. Financial Performance
14.6.4. Recent Initiatives
14.7. Power Integrations, Inc.
14.7.1. Company Overview
14.7.2. Product Offerings
14.7.3. Financial Performance
14.7.4. Recent Initiatives
14.8. Qorvo, Inc.
14.8.1. Company Overview
14.8.2. Product Offerings
14.8.3. Financial Performance
14.8.4. Recent Initiatives
14.9. ROHM Semiconductor
14.9.1. Company Overview
14.9.2. Product Offerings
14.9.3. Financial Performance
14.9.4. Recent Initiatives
14.10. Wolfspeed, Inc.
14.10.1. Company Overview
14.10.2. Product Offerings
14.10.3. Financial Performance
14.10.4. Recent Initiatives
15.1. Primary Research
15.2. Secondary Research
15.3. Assumptions
16.1. About Us
16.2. Glossary of Terms
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