Microchips Market Size to Worth USD 181.26 Billion By 2034

Chapter 1. Introduction

1.1. Research Objective

1.2. Scope of the Study

1.3. Definition

Chapter 2. Research Methodology (Premium Insights)

2.1. Research Approach

2.2. Data Sources

2.3. Assumptions & Limitations

Chapter 3. Executive Summary

3.1. Market Snapshot

Chapter 4. Market Variables and Scope

4.1. Introduction

4.2. Market Classification and Scope

4.3. Industry Value Chain Analysis

4.3.1. Raw Material Procurement Analysis

4.3.2. Sales and Distribution Channel Analysis

4.3.3. Downstream Buyer Analysis

Chapter 5. COVID 19 Impact on Microchips Market

5.1. COVID-19 Landscape: Microchips Industry Impact

5.2. COVID 19 - Impact Assessment for the Industry

5.3. COVID 19 Impact: Global Major Government Policy

5.4. Market Trends and Opportunities in the COVID-19 Landscape

Chapter 6. Market Dynamics Analysis and Trends

6.1. Market Dynamics

6.1.1. Market Drivers

6.1.2. Market Restraints

6.1.3. Market Opportunities

6.2. Porter’s Five Forces Analysis

6.2.1. Bargaining power of suppliers

6.2.2. Bargaining power of buyers

6.2.3. Threat of substitute

6.2.4. Threat of new entrants

6.2.5. Degree of competition

Chapter 7. Competitive Landscape

7.1.1. Company Market Share/Positioning Analysis

7.1.2. Key Strategies Adopted by Players

7.1.3. Vendor Landscape

7.1.3.1. List of Suppliers

7.1.3.2. List of Buyers

Chapter 8. Global Microchips Market, By Product Type

8.1. Microchips Market Revenue and Volume, by Product Type

8.1.1. Integrated Device

8.1.1.1. Market Revenue and Volume Forecast

8.1.2. Fabless

8.1.2.1. Market Revenue and Volume Forecast

8.1.3. Foundry

8.1.3.1. Market Revenue and Volume Forecast

8.1.4. Memory

8.1.4.1. Market Revenue and Volume Forecast

8.1.5. Analog

8.1.5.1. Market Revenue and Volume Forecast

8.1.6. Logic

8.1.6.1. Market Revenue and Volume Forecast

8.1.7. Microcontroller

8.1.7.1. Market Revenue and Volume Forecast

Chapter 9. Global Microchips Market, By Substrate Material

9.1. Microchips Market Revenue and Volume, by Substrate Material

9.1.1. Silicon

9.1.1.1. Market Revenue and Volume Forecast

9.1.2. Compound Semiconductor

9.1.2.1. Market Revenue and Volume Forecast

Chapter 10. Global Microchips Market, By End-User

10.1. Microchips Market Revenue and Volume, by End-User

10.1.1. Consumer Electronics

10.1.1.1. Market Revenue and Volume Forecast

10.1.2. Automotive

10.1.2.1. Market Revenue and Volume Forecast

10.1.3. Healthcare

10.1.3.1. Market Revenue and Volume Forecast

10.1.4. Military & Civil Aerospace

10.1.4.1. Market Revenue and Volume Forecast

10.1.5. Industrial

10.1.5.1. Market Revenue and Volume Forecast

10.1.6. Telecommunications

10.1.6.1. Market Revenue and Volume Forecast

10.1.7. Data Processing

10.1.7.1. Market Revenue and Volume Forecast

Chapter 11. Global Microchips Market, By Manufacturing Process

11.1. Microchips Market Revenue and Volume, by Manufacturing Process

11.1.1. Planar

11.1.1.1. Market Revenue and Volume Forecast

11.1.2. FinFET

11.1.2.1. Market Revenue and Volume Forecast

11.1.3. FD-SOI

11.1.3.1. Market Revenue and Volume Forecast

Chapter 12. Global Microchips Market, By Wafer Size

12.1. Microchips Market Revenue and Volume, by Wafer Size

12.1.1. 6-inch

12.1.1.1. Market Revenue and Volume Forecast

12.1.2. 8-inch

12.1.2.1. Market Revenue and Volume Forecast

12.1.3. 12-inch

12.1.3.1. Market Revenue and Volume Forecast

12.1.4. 18-inch

12.1.4.1. Market Revenue and Volume Forecast

Chapter 13. Global Microchips Market, Regional Estimates and Trend Forecast

13.1. North America

13.1.1. Market Revenue and Volume Forecast, by Product Type

13.1.2. Market Revenue and Volume Forecast, by Substrate Material

13.1.3. Market Revenue and Volume Forecast, by End-User

13.1.4. Market Revenue and Volume Forecast, by Manufacturing Process

13.1.5. Market Revenue and Volume Forecast, by Wafer Size

13.1.6. U.S.

13.1.6.1. Market Revenue and Volume Forecast, by Product Type

13.1.6.2. Market Revenue and Volume Forecast, by Substrate Material

13.1.6.3. Market Revenue and Volume Forecast, by End-User

13.1.6.4. Market Revenue and Volume Forecast, by Manufacturing Process

13.1.6.5. Market Revenue and Volume Forecast, by Wafer Size

13.1.7. Rest of North America

13.1.7.1. Market Revenue and Volume Forecast, by Product Type

13.1.7.2. Market Revenue and Volume Forecast, by Substrate Material

13.1.7.3. Market Revenue and Volume Forecast, by End-User

13.1.7.4. Market Revenue and Volume Forecast, by Manufacturing Process

13.1.7.5. Market Revenue and Volume Forecast, by Wafer Size

13.2. Europe

13.2.1. Market Revenue and Volume Forecast, by Product Type

13.2.2. Market Revenue and Volume Forecast, by Substrate Material

13.2.3. Market Revenue and Volume Forecast, by End-User

13.2.4. Market Revenue and Volume Forecast, by Manufacturing Process

13.2.5. Market Revenue and Volume Forecast, by Wafer Size

13.2.6. UK

13.2.6.1. Market Revenue and Volume Forecast, by Product Type

13.2.6.2. Market Revenue and Volume Forecast, by Substrate Material

13.2.6.3. Market Revenue and Volume Forecast, by End-User

13.2.7. Market Revenue and Volume Forecast, by Manufacturing Process

13.2.8. Market Revenue and Volume Forecast, by Wafer Size

13.2.9. Germany

13.2.9.1. Market Revenue and Volume Forecast, by Product Type

13.2.9.2. Market Revenue and Volume Forecast, by Substrate Material

13.2.9.3. Market Revenue and Volume Forecast, by End-User

13.2.10. Market Revenue and Volume Forecast, by Manufacturing Process

13.2.11. Market Revenue and Volume Forecast, by Wafer Size

13.2.12. France

13.2.12.1. Market Revenue and Volume Forecast, by Product Type

13.2.12.2. Market Revenue and Volume Forecast, by Substrate Material

13.2.12.3. Market Revenue and Volume Forecast, by End-User

13.2.12.4. Market Revenue and Volume Forecast, by Manufacturing Process

13.2.13. Market Revenue and Volume Forecast, by Wafer Size

13.2.14. Rest of Europe

13.2.14.1. Market Revenue and Volume Forecast, by Product Type

13.2.14.2. Market Revenue and Volume Forecast, by Substrate Material

13.2.14.3. Market Revenue and Volume Forecast, by End-User

13.2.14.4. Market Revenue and Volume Forecast, by Manufacturing Process

13.2.15. Market Revenue and Volume Forecast, by Wafer Size

13.3. APAC

13.3.1. Market Revenue and Volume Forecast, by Product Type

13.3.2. Market Revenue and Volume Forecast, by Substrate Material

13.3.3. Market Revenue and Volume Forecast, by End-User

13.3.4. Market Revenue and Volume Forecast, by Manufacturing Process

13.3.5. Market Revenue and Volume Forecast, by Wafer Size

13.3.6. India

13.3.6.1. Market Revenue and Volume Forecast, by Product Type

13.3.6.2. Market Revenue and Volume Forecast, by Substrate Material

13.3.6.3. Market Revenue and Volume Forecast, by End-User

13.3.6.4. Market Revenue and Volume Forecast, by Manufacturing Process

13.3.7. Market Revenue and Volume Forecast, by Wafer Size

13.3.8. China

13.3.8.1. Market Revenue and Volume Forecast, by Product Type

13.3.8.2. Market Revenue and Volume Forecast, by Substrate Material

13.3.8.3. Market Revenue and Volume Forecast, by End-User

13.3.8.4. Market Revenue and Volume Forecast, by Manufacturing Process

13.3.9. Market Revenue and Volume Forecast, by Wafer Size

13.3.10. Japan

13.3.10.1. Market Revenue and Volume Forecast, by Product Type

13.3.10.2. Market Revenue and Volume Forecast, by Substrate Material

13.3.10.3. Market Revenue and Volume Forecast, by End-User

13.3.10.4. Market Revenue and Volume Forecast, by Manufacturing Process

13.3.10.5. Market Revenue and Volume Forecast, by Wafer Size

13.3.11. Rest of APAC

13.3.11.1. Market Revenue and Volume Forecast, by Product Type

13.3.11.2. Market Revenue and Volume Forecast, by Substrate Material

13.3.11.3. Market Revenue and Volume Forecast, by End-User

13.3.11.4. Market Revenue and Volume Forecast, by Manufacturing Process

13.3.11.5. Market Revenue and Volume Forecast, by Wafer Size

13.4. MEA

13.4.1. Market Revenue and Volume Forecast, by Product Type

13.4.2. Market Revenue and Volume Forecast, by Substrate Material

13.4.3. Market Revenue and Volume Forecast, by End-User

13.4.4. Market Revenue and Volume Forecast, by Manufacturing Process

13.4.5. Market Revenue and Volume Forecast, by Wafer Size

13.4.6. GCC

13.4.6.1. Market Revenue and Volume Forecast, by Product Type

13.4.6.2. Market Revenue and Volume Forecast, by Substrate Material

13.4.6.3. Market Revenue and Volume Forecast, by End-User

13.4.6.4. Market Revenue and Volume Forecast, by Manufacturing Process

13.4.7. Market Revenue and Volume Forecast, by Wafer Size

13.4.8. North Africa

13.4.8.1. Market Revenue and Volume Forecast, by Product Type

13.4.8.2. Market Revenue and Volume Forecast, by Substrate Material

13.4.8.3. Market Revenue and Volume Forecast, by End-User

13.4.8.4. Market Revenue and Volume Forecast, by Manufacturing Process

13.4.9. Market Revenue and Volume Forecast, by Wafer Size

13.4.10. South Africa

13.4.10.1. Market Revenue and Volume Forecast, by Product Type

13.4.10.2. Market Revenue and Volume Forecast, by Substrate Material

13.4.10.3. Market Revenue and Volume Forecast, by End-User

13.4.10.4. Market Revenue and Volume Forecast, by Manufacturing Process

13.4.10.5. Market Revenue and Volume Forecast, by Wafer Size

13.4.11. Rest of MEA

13.4.11.1. Market Revenue and Volume Forecast, by Product Type

13.4.11.2. Market Revenue and Volume Forecast, by Substrate Material

13.4.11.3. Market Revenue and Volume Forecast, by End-User

13.4.11.4. Market Revenue and Volume Forecast, by Manufacturing Process

13.4.11.5. Market Revenue and Volume Forecast, by Wafer Size

13.5. Latin America

13.5.1. Market Revenue and Volume Forecast, by Product Type

13.5.2. Market Revenue and Volume Forecast, by Substrate Material

13.5.3. Market Revenue and Volume Forecast, by End-User

13.5.4. Market Revenue and Volume Forecast, by Manufacturing Process

13.5.5. Market Revenue and Volume Forecast, by Wafer Size

13.5.6. Brazil

13.5.6.1. Market Revenue and Volume Forecast, by Product Type

13.5.6.2. Market Revenue and Volume Forecast, by Substrate Material

13.5.6.3. Market Revenue and Volume Forecast, by End-User

13.5.6.4. Market Revenue and Volume Forecast, by Manufacturing Process

13.5.7. Market Revenue and Volume Forecast, by Wafer Size

13.5.8. Rest of LATAM

13.5.8.1. Market Revenue and Volume Forecast, by Product Type

13.5.8.2. Market Revenue and Volume Forecast, by Substrate Material

13.5.8.3. Market Revenue and Volume Forecast, by End-User

13.5.8.4. Market Revenue and Volume Forecast, by Manufacturing Process

13.5.8.5. Market Revenue and Volume Forecast, by Wafer Size

Chapter 14. Company Profiles

14.1. Intel Corporation

14.1.1. Company Overview

14.1.2. Product Offerings

14.1.3. Financial Performance

14.1.4. Recent Initiatives

14.2. Samsung Electronics Co., Ltd.

14.2.1. Company Overview

14.2.2. Product Offerings

14.2.3. Financial Performance

14.2.4. Recent Initiatives

14.3. Taiwan Semiconductor Manufacturing Company Limited (TSMC)

14.3.1. Company Overview

14.3.2. Product Offerings

14.3.3. Financial Performance

14.3.4. Recent Initiatives

14.4. Qualcomm Incorporated

14.4.1. Company Overview

14.4.2. Product Offerings

14.4.3. Financial Performance

14.4.4. Recent Initiatives

14.5. NVIDIA Corporation

14.5.1. Company Overview

14.5.2. Product Offerings

14.5.3. Financial Performance

14.5.4. Recent Initiatives

14.6. Advanced Micro Devices, Inc. (AMD)

14.6.1. Company Overview

14.6.2. Product Offerings

14.6.3. Financial Performance

14.6.4. Recent Initiatives

14.7. Texas Instruments Incorporated

14.7.1. Company Overview

14.7.2. Product Offerings

14.7.3. Financial Performance

14.7.4. Recent Initiatives

14.8. Micron Technology, Inc.

14.8.1. Company Overview

14.8.2. Product Offerings

14.8.3. Financial Performance

14.8.4. Recent Initiatives

14.9. SK hynix Inc.

14.9.1. Company Overview

14.9.2. Product Offerings

14.9.3. Financial Performance

14.9.4. Recent Initiatives

14.10. Broadcom Inc.

14.10.1. Company Overview

14.10.2. Product Offerings

14.10.3. Financial Performance

14.10.4. Recent Initiatives

Chapter 15. Research Methodology

15.1. Primary Research

15.2. Secondary esearch

15.3. Assumptions

Chapter 16. Appendix

16.1. About Us

16.2. Glossary of Terms

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Frequently Asked Questions

The global microchips market size is expected to increase USD 181.26 billion by 2034 from USD 86.26 billion in 2024.

The global microchips market will register growth rate of 7.71% between 2025 and 2034.

The major players operating in the microchips market are Intel Corporation, Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company Limited, Qualcomm Incorporated, NVIDIA Corporation, Advanced Micro Devices, Inc., Texas Instruments Incorporated, Micron Technology, Inc., SK hynix Inc., Broadcom Inc., STMicroelectronics N.V., NXP Semiconductors N.V., Applied Materials, Inc., ASML Holding N.V., Renesas Electronics Corporation, and Others.

The driving factors of the microchips market are the increasing demand for consumer electronics and rise of the internet of things (IoT).

North America region will lead the global microchips market during the forecast period 2025 to 2034.