Semiconductor Capital Equipment Market Size to Hit USD 210.58 Billion by 2034

Chapter 1. Introduction

1.1. Research Objective

1.2. Scope of the Study

1.3. Definition

Chapter 2. Research Methodology

2.1. Research Approach

2.2. Data Sources

2.3. Assumptions & Limitations

Chapter 3. Executive Summary

3.1. Market Snapshot

Chapter 4. Market Variables and Scope

4.1. Introduction

4.2. Market Classification and Scope

4.3. Industry Value Chain Analysis

4.3.1. Raw Material Procurement Analysis

4.3.2. Sales and Distribution Analysis

4.3.3. Downstream Buyer Analysis

Chapter 5. COVID 19 Impact on Semiconductor Capital Equipment Market

5.1. COVID-19 Landscape: Semiconductor Capital Equipment Industry Impact

5.2. COVID 19 - Impact Assessment for the Industry

5.3. COVID 19 Impact: Global Major Government Policy

5.4. Market Trends and Opportunities in the COVID-19 Landscape

Chapter 6. Market Dynamics Analysis and Trends

6.1. Market Dynamics

6.1.1. Market Drivers

6.1.2. Market Restraints

6.1.3. Market Opportunities

6.2. Porter’s Five Forces Analysis

6.2.1. Bargaining power of suppliers

6.2.2. Bargaining power of buyers

6.2.3. Threat of substitute

6.2.4. Threat of new entrants

6.2.5. Degree of competition

Chapter 7. Competitive Landscape

7.1.1. Company Market Share/Positioning Analysis

7.1.2. Key Strategies Adopted by Players

7.1.3. Vendor Landscape

7.1.3.1. List of Suppliers

7.1.3.2. List of Buyers

Chapter 8. Global Semiconductor Capital Equipment Market, By Equipment Type

8.1. Semiconductor Capital Equipment Market Revenue and Volume, by Equipment Type

8.1.1. Front-End Equipment

8.1.1.1. Market Revenue and Volume Forecast

8.1.2. Back-End Equipment

8.1.2.1. Market Revenue and Volume Forecast

8.1.3. Metrology and Inspection Tools

8.1.3.1. Market Revenue and Volume Forecast

Chapter 9. Global Semiconductor Capital Equipment Market, By Application

9.1. Semiconductor Capital Equipment Market Revenue and Volume, by Application

9.1.1. Logic IC Manufacturing

9.1.1.1. Market Revenue and Volume Forecast

9.1.2. Memory (DRAM, NAND) Manufacturing

9.1.2.1. Market Revenue and Volume Forecast

9.1.3. Foundry Operations

9.1.3.1. Market Revenue and Volume Forecast

9.1.4. Integrated Device Manufacturers (IDMs)

9.1.4.1. Market Revenue and Volume Forecast

9.1.5. Outsourced Semiconductor Assembly and Testing (OSAT)

9.1.5.1. Market Revenue and Volume Forecast

Chapter 10. Global Semiconductor Capital Equipment Market, By Technology Node

10.1. Semiconductor Capital Equipment Market Revenue and Volume, by Technology Node

10.1.1. ≥28nm

10.1.1.1. Market Revenue and Volume Forecast

10.1.2. 14nm – 22nm

10.1.2.1. Market Revenue and Volume Forecast

10.1.3. 7nm – 10nm

10.1.3.1. Market Revenue and Volume Forecast

10.1.4. 5nm

10.1.4.1. Market Revenue and Volume Forecast

10.1.5. 3nm and below

10.1.5.1. Market Revenue and Volume Forecast

Chapter 11. Global Semiconductor Capital Equipment Market, By Wafer Size

11.1. Semiconductor Capital Equipment Market Revenue and Volume, by Wafer Size

11.1.1. 150 mm

11.1.1.1. Market Revenue and Volume Forecast

11.1.2. 200 mm

11.1.2.1. Market Revenue and Volume Forecast

11.1.3. 300 mm

11.1.3.1. Market Revenue and Volume Forecast

11.1.4. 300 mm and 450 mm

11.1.4.1. Market Revenue and Volume Forecast

11.1.5. ≥450 mm (Emerging R&D)

11.1.5.1. Market Revenue and Volume Forecast

Chapter 12. Global Semiconductor Capital Equipment Market, By End-Use Industry

12.1. Semiconductor Capital Equipment Market Revenue and Volume, by End-Use Industry

12.1.1. Consumer Electronics

12.1.1.1. Market Revenue and Volume Forecast

12.1.2. Automotive

12.1.2.1. Market Revenue and Volume Forecast

12.1.3. Industrial Automation

12.1.3.1. Market Revenue and Volume Forecast

12.1.4. Telecommunications (5G)

12.1.4.1. Market Revenue and Volume Forecast

12.1.5. Healthcare & Life Sciences

12.1.5.1. Market Revenue and Volume Forecast

12.1.6. Aerospace & Defense

12.1.6.1. Market Revenue and Volume Forecast

12.1.7. Data Centers & HPC

12.1.7.1. Market Revenue and Volume Forecast

Chapter 13. Global Semiconductor Capital Equipment Market, By Distribution Channel

13.1. Semiconductor Capital Equipment Market Revenue and Volume, by Distribution Channel

13.1.1. Direct Sales

13.1.1.1. Market Revenue and Volume Forecast

13.1.2. System Integrators

13.1.2.1. Market Revenue and Volume Forecast

13.1.3. Distributors/VARs (Value-Added Resellers)

13.1.3.1. Market Revenue and Volume Forecast

Chapter 14. Global Semiconductor Capital Equipment Market, Regional Estimates and Trend Forecast

14.1. North America

14.1.1. Market Revenue and Volume Forecast, by Equipment Type

14.1.2. Market Revenue and Volume Forecast, by Application

14.1.3. Market Revenue and Volume Forecast, by Technology Node

14.1.4. Market Revenue and Volume Forecast, by Wafer Size

14.1.5. Market Revenue and Volume Forecast, by End-Use Industry

14.1.6. Market Revenue and Volume Forecast, by Distribution Channel

14.1.7. U.S.

14.1.7.1. Market Revenue and Volume Forecast, by Equipment Type

14.1.7.2. Market Revenue and Volume Forecast, by Application

14.1.7.3. Market Revenue and Volume Forecast, by Technology Node

14.1.7.4. Market Revenue and Volume Forecast, by Wafer Size

14.1.8. Market Revenue and Volume Forecast, by End-Use Industry

14.1.8.1. Market Revenue and Volume Forecast, by Distribution Channel

14.1.9. Rest of North America

14.1.9.1. Market Revenue and Volume Forecast, by Equipment Type

14.1.9.2. Market Revenue and Volume Forecast, by Application

14.1.9.3. Market Revenue and Volume Forecast, by Technology Node

14.1.9.4. Market Revenue and Volume Forecast, by Wafer Size

14.1.10. Market Revenue and Volume Forecast, by End-Use Industry

14.1.11. Market Revenue and Volume Forecast, by Distribution Channel

14.1.11.1.

14.2. Europe

14.2.1. Market Revenue and Volume Forecast, by Equipment Type

14.2.2. Market Revenue and Volume Forecast, by Application

14.2.3. Market Revenue and Volume Forecast, by Technology Node

14.2.4. Market Revenue and Volume Forecast, by Wafer Size

14.2.5. Market Revenue and Volume Forecast, by End-Use Industry

14.2.6. Market Revenue and Volume Forecast, by Distribution Channel

14.2.7.

14.2.8. UK

14.2.8.1. Market Revenue and Volume Forecast, by Equipment Type

14.2.8.2. Market Revenue and Volume Forecast, by Application

14.2.8.3. Market Revenue and Volume Forecast, by Technology Node

14.2.9. Market Revenue and Volume Forecast, by Wafer Size

14.2.10. Market Revenue and Volume Forecast, by End-Use Industry

14.2.10.1. Market Revenue and Volume Forecast, by Distribution Channel

14.2.11. Germany

14.2.11.1. Market Revenue and Volume Forecast, by Equipment Type

14.2.11.2. Market Revenue and Volume Forecast, by Application

14.2.11.3. Market Revenue and Volume Forecast, by Technology Node

14.2.12. Market Revenue and Volume Forecast, by Wafer Size

14.2.13. Market Revenue and Volume Forecast, by End-Use Industry

14.2.14. Market Revenue and Volume Forecast, by Distribution Channel

14.2.14.1.

14.2.15. France

14.2.15.1. Market Revenue and Volume Forecast, by Equipment Type

14.2.15.2. Market Revenue and Volume Forecast, by Application

14.2.15.3. Market Revenue and Volume Forecast, by Technology Node

14.2.15.4. Market Revenue and Volume Forecast, by Wafer Size

14.2.16. Market Revenue and Volume Forecast, by End-Use Industry

14.2.16.1. Market Revenue and Volume Forecast, by Distribution Channel

14.2.17. Rest of Europe

14.2.17.1. Market Revenue and Volume Forecast, by Equipment Type

14.2.17.2. Market Revenue and Volume Forecast, by Application

14.2.17.3. Market Revenue and Volume Forecast, by Technology Node

14.2.17.4. Market Revenue and Volume Forecast, by Wafer Size

14.2.18. Market Revenue and Volume Forecast, by End-Use Industry

14.2.18.1. Market Revenue and Volume Forecast, by Distribution Channel

14.3. APAC

14.3.1. Market Revenue and Volume Forecast, by Equipment Type

14.3.2. Market Revenue and Volume Forecast, by Application

14.3.3. Market Revenue and Volume Forecast, by Technology Node

14.3.4. Market Revenue and Volume Forecast, by Wafer Size

14.3.5. Market Revenue and Volume Forecast, by End-Use Industry

14.3.6. Market Revenue and Volume Forecast, by Distribution Channel

14.3.7. India

14.3.7.1. Market Revenue and Volume Forecast, by Equipment Type

14.3.7.2. Market Revenue and Volume Forecast, by Application

14.3.7.3. Market Revenue and Volume Forecast, by Technology Node

14.3.7.4. Market Revenue and Volume Forecast, by Wafer Size

14.3.8. Market Revenue and Volume Forecast, by End-Use Industry

14.3.9. Market Revenue and Volume Forecast, by Distribution Channel

14.3.10. China

14.3.10.1. Market Revenue and Volume Forecast, by Equipment Type

14.3.10.2. Market Revenue and Volume Forecast, by Application

14.3.10.3. Market Revenue and Volume Forecast, by Technology Node

14.3.10.4. Market Revenue and Volume Forecast, by Wafer Size

14.3.11. Market Revenue and Volume Forecast, by End-Use Industry

14.3.11.1. Market Revenue and Volume Forecast, by Distribution Channel

14.3.12. Japan

14.3.12.1. Market Revenue and Volume Forecast, by Equipment Type

14.3.12.2. Market Revenue and Volume Forecast, by Application

14.3.12.3. Market Revenue and Volume Forecast, by Technology Node

14.3.12.4. Market Revenue and Volume Forecast, by Wafer Size

14.3.12.5. Market Revenue and Volume Forecast, by End-Use Industry

14.3.12.6. Market Revenue and Volume Forecast, by Distribution Channel

14.3.13. Rest of APAC

14.3.13.1. Market Revenue and Volume Forecast, by Equipment Type

14.3.13.2. Market Revenue and Volume Forecast, by Application

14.3.13.3. Market Revenue and Volume Forecast, by Technology Node

14.3.13.4. Market Revenue and Volume Forecast, by Wafer Size

14.3.13.5. Market Revenue and Volume Forecast, by End-Use Industry

14.3.13.6. Market Revenue and Volume Forecast, by Distribution Channel

14.4. MEA

14.4.1. Market Revenue and Volume Forecast, by Equipment Type

14.4.2. Market Revenue and Volume Forecast, by Application

14.4.3. Market Revenue and Volume Forecast, by Technology Node

14.4.4. Market Revenue and Volume Forecast, by Wafer Size

14.4.5. Market Revenue and Volume Forecast, by End-Use Industry

14.4.6. Market Revenue and Volume Forecast, by Distribution Channel

14.4.7. GCC

14.4.7.1. Market Revenue and Volume Forecast, by Equipment Type

14.4.7.2. Market Revenue and Volume Forecast, by Application

14.4.7.3. Market Revenue and Volume Forecast, by Technology Node

14.4.7.4. Market Revenue and Volume Forecast, by Wafer Size

14.4.8. Market Revenue and Volume Forecast, by End-Use Industry

14.4.9. Market Revenue and Volume Forecast, by Distribution Channel

14.4.10. North Africa

14.4.10.1. Market Revenue and Volume Forecast, by Equipment Type

14.4.10.2. Market Revenue and Volume Forecast, by Application

14.4.10.3. Market Revenue and Volume Forecast, by Technology Node

14.4.10.4. Market Revenue and Volume Forecast, by Wafer Size

14.4.11. Market Revenue and Volume Forecast, by End-Use Industry

14.4.12. Market Revenue and Volume Forecast, by Distribution Channel

14.4.13. South Africa

14.4.13.1. Market Revenue and Volume Forecast, by Equipment Type

14.4.13.2. Market Revenue and Volume Forecast, by Application

14.4.13.3. Market Revenue and Volume Forecast, by Technology Node

14.4.13.4. Market Revenue and Volume Forecast, by Wafer Size

14.4.13.5. Market Revenue and Volume Forecast, by End-Use Industry

14.4.13.6. Market Revenue and Volume Forecast, by Distribution Channel

14.4.14. Rest of MEA

14.4.14.1. Market Revenue and Volume Forecast, by Equipment Type

14.4.14.2. Market Revenue and Volume Forecast, by Application

14.4.14.3. Market Revenue and Volume Forecast, by Technology Node

14.4.14.4. Market Revenue and Volume Forecast, by Wafer Size

14.4.14.5. Market Revenue and Volume Forecast, by End-Use Industry

14.4.14.6. Market Revenue and Volume Forecast, by Distribution Channel

14.5. Latin America

14.5.1. Market Revenue and Volume Forecast, by Equipment Type

14.5.2. Market Revenue and Volume Forecast, by Application

14.5.3. Market Revenue and Volume Forecast, by Technology Node

14.5.4. Market Revenue and Volume Forecast, by Wafer Size

14.5.5. Market Revenue and Volume Forecast, by End-Use Industry

14.5.6. Market Revenue and Volume Forecast, by Distribution Channel

14.5.7. Brazil

14.5.7.1. Market Revenue and Volume Forecast, by Equipment Type

14.5.7.2. Market Revenue and Volume Forecast, by Application

14.5.7.3. Market Revenue and Volume Forecast, by Technology Node

14.5.7.4. Market Revenue and Volume Forecast, by Wafer Size

14.5.8. Market Revenue and Volume Forecast, by End-Use Industry

14.5.8.1. Market Revenue and Volume Forecast, by Distribution Channel

14.5.9. Rest of LATAM

14.5.9.1. Market Revenue and Volume Forecast, by Equipment Type

14.5.9.2. Market Revenue and Volume Forecast, by Application

14.5.9.3. Market Revenue and Volume Forecast, by Technology Node

14.5.9.4. Market Revenue and Volume Forecast, by Wafer Size

14.5.9.5. Market Revenue and Volume Forecast, by End-Use Industry

14.5.9.6. Market Revenue and Volume Forecast, by Distribution Channel

Chapter 15. Company Profiles

15.1. ASM International

15.1.1. Company Overview

15.1.2. Product Offerings

15.1.3. Financial Performance

15.1.4. Recent Initiatives

15.2. ASML Holding

15.2.1. Company Overview

15.2.2. Product Offerings

15.2.3. Financial Performance

15.2.4. Recent Initiatives

15.3. Cohu, Inc.

15.3.1. Company Overview

15.3.2. Product Offerings

15.3.3. Financial Performance

15.3.4. Recent Initiatives

15.4. DISCO Corporation

15.4.1. Company Overview

15.4.2. Product Offerings

15.4.3. Financial Performance

15.4.4. Recent Initiatives

15.5. Lam Research Corporation

15.5.1. Company Overview

15.5.2. Product Offerings

15.5.3. Financial Performance

15.5.4. Recent Initiatives

15.6. NAURA Technology Group Co., Ltd.

15.6.1. Company Overview

15.6.2. Product Offerings

15.6.3. Financial Performance

15.6.4. Recent Initiatives

15.7. Nikon Corporation

15.7.1. Company Overview

15.7.2. Product Offerings

15.7.3. Financial Performance

15.7.4. Recent Initiatives

15.8. Onto Innovation Inc.

15.8.1. Company Overview

15.8.2. Product Offerings

15.8.3. Financial Performance

15.8.4. Recent Initiatives

15.9. SCREEN Holdings Co., Ltd.

15.9.1. Company Overview

15.9.2. Product Offerings

15.9.3. Financial Performance

15.9.4. Recent Initiatives

15.10. Teradyne, Inc.

15.10.1. Company Overview

15.10.2. Product Offerings

15.10.3. Financial Performance

15.10.4. Recent Initiatives

Chapter 16. Research Methodology

16.1. Primary Research

16.2. Secondary Research

16.3. Assumptions

Chapter 17. Appendix

17.1. About Us

17.2. Glossary of Terms

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Frequently Asked Questions

The semiconductor capital equipment market size is expected to increase from USD 108.56 billion in 2024 to USD 210.58 billion by 2034.

The semiconductor capital equipment market is expected to grow at a compound annual growth rate (CAGR) of around 6.85% from 2025 to 2034.

The major players in the semiconductor capital equipment market include Advantest Corporation, AMEC, Applied Materials, Inc., ASM International, ASML Holding, Canon Inc., Cohu, Inc., DISCO Corporation, Hitachi High-Tech Corporation, KLA Corporation, Lam Research Corporation, NAURA Technology Group Co., Ltd., Nikon Corporation, Nova Measuring Instruments Ltd., Onto Innovation Inc., SCREEN Holdings Co., Ltd., Teradyne, Inc., Tokyo Electron Limited, ULVAC, Inc., and Veeco Instruments Inc.

The driving factors of the semiconductor capital equipment market are the expansion of AI data centers and hyperscale computing is poised to drive the growth of the semiconductor capital equipment market

Asia Pacific region will lead the global semiconductor capital equipment market during the forecast period 2025 to 2034.