1.1. Research Objective
1.2. Scope of the Study
1.3. Definition
2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations
3.1. Market Snapshot
4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis
4.3.1. Raw Material Procurement Analysis
4.3.2. Sales and Distribution Channel Analysis
4.3.3. Downstream Buyer Analysis
5.1. COVID-19 Landscape: Glass Interposers Industry Impact
5.2. COVID 19 - Impact Assessment for the Industry
5.3. COVID 19 Impact: Global Major Government Policy
5.4. Market Trends and Opportunities in the COVID-19 Landscape
6.1. Market Dynamics
6.1.1. Market Drivers
6.1.2. Market Restraints
6.1.3. Market Opportunities
6.2. Porter’s Five Forces Analysis
6.2.1. Bargaining power of suppliers
6.2.2. Bargaining power of buyers
6.2.3. Threat of substitute
6.2.4. Threat of new entrants
6.2.5. Degree of competition
7.1.1. Company Market Share/Positioning Analysis
7.1.2. Key Strategies Adopted by Players
7.1.3. Vendor Landscape
7.1.3.1. List of Suppliers
7.1.3.2. List of Buyers
8.1. Glass Interposers Market Revenue and Volume Forecast, by Product / Type
8.1.1. 2D Glass Interposers
8.1.1.1. Market Revenue and Volume Forecast
8.1.2. 2.5D Glass Interposers g
8.1.2.1. Market Revenue and Volume Forecast
8.1.3. 3D Glass Interposers
8.1.3.1. Market Revenue and Volume Forecast
9.1. Glass Interposers Market Revenue and Volume Forecast, by Wafer Size
9.1.1. < 200 mm
9.1.1.1. Market Revenue and Volume Forecast
9.1.2. 200 mm
9.1.2.1. Market Revenue and Volume Forecast
9.1.3. 300 mm
9.1.3.1. Market Revenue and Volume Forecast
10.1. Glass Interposers Market Revenue and Volume Forecast, by Substrate Technology
10.1.1. Through-Glass Vias (TGVs)
10.1.1.1. Market Revenue and Volume Forecast
10.1.2. Redistribution Layer (RDL) – First / Last
10.1.2.1. Market Revenue and Volume Forecast
10.1.3. Glass Panel Level Packaging (PLP)
10.1.3.1. Market Revenue and Volume Forecast
11.1. Glass Interposers Market Revenue and Volume Forecast, by Application / Packaging Architecture
11.1.1. 2.5D Packaging
11.1.1.1. Market Revenue and Volume Forecast
11.1.2. 3D Packaging
11.1.2.1. Market Revenue and Volume Forecast
11.1.3. Fan-Out Packaging
11.1.3.1. Market Revenue and Volume Forecast
12.1. North America
12.1.1. Market Revenue and Volume Forecast, by Product / Type
12.1.2. Market Revenue and Volume Forecast, by Wafer Size
12.1.3. Market Revenue and Volume Forecast, by Substrate Technology
12.1.4. Market Revenue and Volume Forecast, by Application / Packaging Architecture
12.1.5. U.S.
12.1.5.1. Market Revenue and Volume Forecast, by Product / Type
12.1.5.2. Market Revenue and Volume Forecast, by Wafer Size
12.1.5.3. Market Revenue and Volume Forecast, by Substrate Technology
12.1.5.4. Market Revenue and Volume Forecast, by Application / Packaging Architecture
12.1.6. Rest of North America
12.1.6.1. Market Revenue and Volume Forecast, by Product / Type
12.1.6.2. Market Revenue and Volume Forecast, by Wafer Size
12.1.6.3. Market Revenue and Volume Forecast, by Substrate Technology
12.1.6.4. Market Revenue and Volume Forecast, by Application / Packaging Architecture
12.2. Europe
12.2.1. Market Revenue and Volume Forecast, by Product / Type
12.2.2. Market Revenue and Volume Forecast, by Wafer Size
12.2.3. Market Revenue and Volume Forecast, by Substrate Technology
12.2.4. Market Revenue and Volume Forecast, by Application / Packaging Architecture
12.2.5. UK
12.2.5.1. Market Revenue and Volume Forecast, by Product / Type
12.2.5.2. Market Revenue and Volume Forecast, by Wafer Size
12.2.5.3. Market Revenue and Volume Forecast, by Substrate Technology
12.2.5.4. Market Revenue and Volume Forecast, by Application / Packaging Architecture
12.2.6. Germany
12.2.6.1. Market Revenue and Volume Forecast, by Product / Type
12.2.6.2. Market Revenue and Volume Forecast, by Wafer Size
12.2.6.3. Market Revenue and Volume Forecast, by Substrate Technology
12.2.6.4. Market Revenue and Volume Forecast, by Application / Packaging Architecture
12.2.7. France
12.2.7.1. Market Revenue and Volume Forecast, by Product / Type
12.2.7.2. Market Revenue and Volume Forecast, by Wafer Size
12.2.7.3. Market Revenue and Volume Forecast, by Substrate Technology
12.2.7.4. Market Revenue and Volume Forecast, by Application / Packaging Architecture
12.2.8. Rest of Europe
12.2.8.1. Market Revenue and Volume Forecast, by Product / Type
12.2.8.2. Market Revenue and Volume Forecast, by Wafer Size
12.2.8.3. Market Revenue and Volume Forecast, by Substrate Technology
12.2.8.4. Market Revenue and Volume Forecast, by Application / Packaging Architecture
12.3. APAC
12.3.1. Market Revenue and Volume Forecast, by Product / Type
12.3.2. Market Revenue and Volume Forecast, by Wafer Size
12.3.3. Market Revenue and Volume Forecast, by Substrate Technology
12.3.4. Market Revenue and Volume Forecast, by Application / Packaging Architecture
12.3.5. India
12.3.5.1. Market Revenue and Volume Forecast, by Product / Type
12.3.5.2. Market Revenue and Volume Forecast, by Wafer Size
12.3.5.3. Market Revenue and Volume Forecast, by Substrate Technology
12.3.5.4. Market Revenue and Volume Forecast, by Application / Packaging Architecture
12.3.6. China
12.3.6.1. Market Revenue and Volume Forecast, by Product / Type
12.3.6.2. Market Revenue and Volume Forecast, by Wafer Size
12.3.6.3. Market Revenue and Volume Forecast, by Substrate Technology
12.3.6.4. Market Revenue and Volume Forecast, by Application / Packaging Architecture
12.3.7. Japan
12.3.7.1. Market Revenue and Volume Forecast, by Product / Type
12.3.7.2. Market Revenue and Volume Forecast, by Wafer Size
12.3.7.3. Market Revenue and Volume Forecast, by Substrate Technology
12.3.7.4. Market Revenue and Volume Forecast, by Application / Packaging Architecture
12.3.8. Rest of APAC
12.3.8.1. Market Revenue and Volume Forecast, by Product / Type
12.3.8.2. Market Revenue and Volume Forecast, by Wafer Size
12.3.8.3. Market Revenue and Volume Forecast, by Substrate Technology
12.3.8.4. Market Revenue and Volume Forecast, by Application / Packaging Architecture
12.4. MEA
12.4.1. Market Revenue and Volume Forecast, by Product / Type
12.4.2. Market Revenue and Volume Forecast, by Wafer Size
12.4.3. Market Revenue and Volume Forecast, by Substrate Technology
12.4.4. Market Revenue and Volume Forecast, by Application / Packaging Architecture
12.4.5. GCC
12.4.5.1. Market Revenue and Volume Forecast, by Product / Type
12.4.5.2. Market Revenue and Volume Forecast, by Wafer Size
12.4.5.3. Market Revenue and Volume Forecast, by Substrate Technology
12.4.5.4. Market Revenue and Volume Forecast, by Application / Packaging Architecture
12.4.6. North Africa
12.4.6.1. Market Revenue and Volume Forecast, by Product / Type
12.4.6.2. Market Revenue and Volume Forecast, by Wafer Size
12.4.6.3. Market Revenue and Volume Forecast, by Substrate Technology
12.4.6.4. Market Revenue and Volume Forecast, by Application / Packaging Architecture
12.4.7. South Africa
12.4.7.1. Market Revenue and Volume Forecast, by Product / Type
12.4.7.2. Market Revenue and Volume Forecast, by Wafer Size
12.4.7.3. Market Revenue and Volume Forecast, by Substrate Technology
12.4.7.4. Market Revenue and Volume Forecast, by Application / Packaging Architecture
12.4.8. Rest of MEA
12.4.8.1. Market Revenue and Volume Forecast, by Product / Type
12.4.8.2. Market Revenue and Volume Forecast, by Wafer Size
12.4.8.3. Market Revenue and Volume Forecast, by Substrate Technology
12.4.8.4. Market Revenue and Volume Forecast, by Application / Packaging Architecture
12.5. Latin America
12.5.1. Market Revenue and Volume Forecast, by Product / Type
12.5.2. Market Revenue and Volume Forecast, by Wafer Size
12.5.3. Market Revenue and Volume Forecast, by Substrate Technology
12.5.4. Market Revenue and Volume Forecast, by Application / Packaging Architecture
12.5.5. Brazil
12.5.5.1. Market Revenue and Volume Forecast, by Product / Type
12.5.5.2. Market Revenue and Volume Forecast, by Wafer Size
12.5.5.3. Market Revenue and Volume Forecast, by Substrate Technology
12.5.5.4. Market Revenue and Volume Forecast, by Application / Packaging Architecture
12.5.6. Rest of LATAM
12.5.6.1. Market Revenue and Volume Forecast, by Product / Type
12.5.6.2. Market Revenue and Volume Forecast, by Wafer Size
12.5.6.3. Market Revenue and Volume Forecast, by Substrate Technology
12.5.6.4. Market Revenue and Volume Forecast, by Application / Packaging Architecture
13.1. Corning Incorporated
13.1.1. Company Overview
13.1.2. Product Offerings
13.1.3. Financial PerProduct / Typeance
13.1.4. Recent Initiatives
13.2. AGC Inc. (Asahi Glass)
13.2.1. Company Overview
13.2.2. Product Offerings
13.2.3. Financial PerProduct / Typeance
13.2.4. Recent Initiatives
13.3. SCHOTT AG
13.3.1. Company Overview
13.3.2. Product Offerings
13.3.3. Financial PerProduct / Typeance
13.3.4. Recent Initiatives
13.4. Plan Optik AG
13.4.1. Company Overview
13.4.2. Product Offerings
13.4.3. Financial PerProduct / Typeance
13.4.4. Recent Initiatives
13.5. Kiso Micro Co., Ltd.
13.5.1. Company Overview
13.5.2. Product Offerings
13.5.3. Financial PerProduct / Typeance
13.5.4. Recent Initiatives
13.6. Ushio Inc.
13.6.1. Company Overview
13.6.2. Product Offerings
13.6.3. Financial PerProduct / Typeance
13.6.4. Recent Initiatives
13.7. 3D Glass Solutions, Inc.
13.7.1. Company Overview
13.7.2. Product Offerings
13.7.3. Financial PerProduct / Typeance
13.7.4. Recent Initiatives
13.8. Triton Microtechnologies, Inc.
13.8.1. Company Overview
13.8.2. Product Offerings
13.8.3. Financial PerProduct / Typeance
13.8.4. Recent Initiatives
13.9. Taiwan Semiconductor Manufacturing Company (TSMC)
13.9.1. Company Overview
13.9.2. Product Offerings
13.9.3. Financial PerProduct / Typeance
13.9.4. Recent Initiatives
13.10. Murata Manufacturing Co., Ltd.
13.10.1. Company Overview
13.10.2. Product Offerings
13.10.3. Financial PerProduct / Typeance
13.10.4. Recent Initiatives
14.1. Primary Research
14.2. Secondary Research
14.3. Assumptions
15.1. About Us
15.2. Glossary of Terms
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