1.1. Research Objective
1.2. Scope of the Study
1.3. Definition
2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations
3.1. Market Snapshot
4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis
4.3.1. Raw Material Procurement Analysis
4.3.2. Sales and Distribution Channel Analysis
4.3.3. Downstream Buyer Analysis
5.1. COVID-19 Landscape: 2D Material Transistor Industry Impact
5.2. COVID 19 - Impact Assessment for the Industry
5.3. COVID 19 Impact: Global Major Government Policy
5.4. Market Trends and Opportunities in the COVID-19 Landscape
6.1. Market Dynamics
6.1.1. Market Drivers
6.1.2. Market Restraints
6.1.3. Market Opportunities
6.2. Porter’s Five Forces Analysis
6.2.1. Bargaining power of suppliers
6.2.2. Bargaining power of buyers
6.2.3. Threat of substitute
6.2.4. Threat of new entrants
6.2.5. Degree of competition
7.1.1. Company Market Share/Positioning Analysis
7.1.2. Key Strategies Adopted by Players
7.1.3. Vendor Landscape
7.1.3.1. List of Suppliers
7.1.3.2. List of Buyers
8.1. 2D Material Transistor Market Revenue and Volume, by Material Type
8.1.1. Graphene
8.1.1.1. Market Revenue and Volume Forecast
8.1.2. Transition Metal Dichalcogenides (TMDs)
8.1.2.1. Market Revenue and Volume Forecast
8.1.3. Hexagonal Boron Nitride (h-BN)
8.1.3.1. Market Revenue and Volume Forecast
8.1.4. Others (Black Phosphorus, MXenes)
8.1.4.1. Market Revenue and Volume Forecast
9.1. 2D Material Transistor Market Revenue and Volume, by Transistor Type
9.1.1. Field-Effect Transistors (FETs)
9.1.1.1. Market Revenue and Volume Forecast
9.1.2. Tunneling FETs (TFETs)
9.1.2.1. Market Revenue and Volume Forecast
9.1.3. FinFETs
9.1.3.1. Market Revenue and Volume Forecast
9.1.4. Multi-gate / Nanowire FETs
9.1.4.1. Market Revenue and Volume Forecast
10.1. 2D Material Transistor Market Revenue and Volume, by Device Application
10.1.1. High-Performance Computing (HPC) & Processors
10.1.1.1. Market Revenue and Volume Forecast
10.1.2. Flexible & Wearable Electronics
10.1.2.1. Market Revenue and Volume Forecast
10.1.3. Sensors & MEMS Devices
10.1.3.1. Market Revenue and Volume Forecast
10.1.4. Optoelectronic Devices
10.1.4.1. Market Revenue and Volume Forecast
10.1.5. IoT Devices & Edge Electronics
10.1.5.1. Market Revenue and Volume Forecast
11.1. 2D Material Transistor Market Revenue and Volume, by End-User
11.1.1. Semiconductor & Electronics Companies
11.1.1.1. Market Revenue and Volume Forecast
11.1.2. Consumer Electronics Manufacturers
11.1.2.1. Market Revenue and Volume Forecast
11.1.3. Automotive & Transportation
11.1.3.1. Market Revenue and Volume Forecast
11.1.4. Healthcare & Medical Devices
11.1.4.1. Market Revenue and Volume Forecast
11.1.5. Aerospace & Defense
11.1.5.1. Market Revenue and Volume Forecast
11.1.6. Research & Academia
11.1.6.1. Market Revenue and Volume Forecast
12.1. 2D Material Transistor Market Revenue and Volume, by Integration Technology
12.1.1. Discrete 2D Transistor Devices
12.1.1.1. Market Revenue and Volume Forecast
12.1.2. Integrated Circuits (ICs) with 2D Transistors
12.1.2.1. Market Revenue and Volume Forecast
12.1.3. Hybrid 2D/3D Semiconductor Devices
12.1.3.1. Market Revenue and Volume Forecast
13.1. North America
13.1.1. Market Revenue and Volume Forecast, by Material Type
13.1.2. Market Revenue and Volume Forecast, by Transistor Type
13.1.3. Market Revenue and Volume Forecast, by Device Application
13.1.4. Market Revenue and Volume Forecast, by End-User
13.1.5. Market Revenue and Volume Forecast, by Integration Technology
13.1.6. U.S.
13.1.6.1. Market Revenue and Volume Forecast, by Material Type
13.1.6.2. Market Revenue and Volume Forecast, by Transistor Type
13.1.6.3. Market Revenue and Volume Forecast, by Device Application
13.1.6.4. Market Revenue and Volume Forecast, by End-User
13.1.6.5. Market Revenue and Volume Forecast, by Integration Technology
13.1.7. Rest of North America
13.1.7.1. Market Revenue and Volume Forecast, by Material Type
13.1.7.2. Market Revenue and Volume Forecast, by Transistor Type
13.1.7.3. Market Revenue and Volume Forecast, by Device Application
13.1.7.4. Market Revenue and Volume Forecast, by End-User
13.1.7.5. Market Revenue and Volume Forecast, by Integration Technology
13.2. Europe
13.2.1. Market Revenue and Volume Forecast, by Material Type
13.2.2. Market Revenue and Volume Forecast, by Transistor Type
13.2.3. Market Revenue and Volume Forecast, by Device Application
13.2.4. Market Revenue and Volume Forecast, by End-User
13.2.5. Market Revenue and Volume Forecast, by Integration Technology
13.2.6. UK
13.2.6.1. Market Revenue and Volume Forecast, by Material Type
13.2.6.2. Market Revenue and Volume Forecast, by Transistor Type
13.2.6.3. Market Revenue and Volume Forecast, by Device Application
13.2.7. Market Revenue and Volume Forecast, by End-User
13.2.8. Market Revenue and Volume Forecast, by Integration Technology
13.2.9. Germany
13.2.9.1. Market Revenue and Volume Forecast, by Material Type
13.2.9.2. Market Revenue and Volume Forecast, by Transistor Type
13.2.9.3. Market Revenue and Volume Forecast, by Device Application
13.2.10. Market Revenue and Volume Forecast, by End-User
13.2.11. Market Revenue and Volume Forecast, by Integration Technology
13.2.12. France
13.2.12.1. Market Revenue and Volume Forecast, by Material Type
13.2.12.2. Market Revenue and Volume Forecast, by Transistor Type
13.2.12.3. Market Revenue and Volume Forecast, by Device Application
13.2.12.4. Market Revenue and Volume Forecast, by End-User
13.2.13. Market Revenue and Volume Forecast, by Integration Technology
13.2.14. Rest of Europe
13.2.14.1. Market Revenue and Volume Forecast, by Material Type
13.2.14.2. Market Revenue and Volume Forecast, by Transistor Type
13.2.14.3. Market Revenue and Volume Forecast, by Device Application
13.2.14.4. Market Revenue and Volume Forecast, by End-User
13.2.15. Market Revenue and Volume Forecast, by Integration Technology
13.3. APAC
13.3.1. Market Revenue and Volume Forecast, by Material Type
13.3.2. Market Revenue and Volume Forecast, by Transistor Type
13.3.3. Market Revenue and Volume Forecast, by Device Application
13.3.4. Market Revenue and Volume Forecast, by End-User
13.3.5. Market Revenue and Volume Forecast, by Integration Technology
13.3.6. India
13.3.6.1. Market Revenue and Volume Forecast, by Material Type
13.3.6.2. Market Revenue and Volume Forecast, by Transistor Type
13.3.6.3. Market Revenue and Volume Forecast, by Device Application
13.3.6.4. Market Revenue and Volume Forecast, by End-User
13.3.7. Market Revenue and Volume Forecast, by Integration Technology
13.3.8. China
13.3.8.1. Market Revenue and Volume Forecast, by Material Type
13.3.8.2. Market Revenue and Volume Forecast, by Transistor Type
13.3.8.3. Market Revenue and Volume Forecast, by Device Application
13.3.8.4. Market Revenue and Volume Forecast, by End-User
13.3.9. Market Revenue and Volume Forecast, by Integration Technology
13.3.10. Japan
13.3.10.1. Market Revenue and Volume Forecast, by Material Type
13.3.10.2. Market Revenue and Volume Forecast, by Transistor Type
13.3.10.3. Market Revenue and Volume Forecast, by Device Application
13.3.10.4. Market Revenue and Volume Forecast, by End-User
13.3.10.5. Market Revenue and Volume Forecast, by Integration Technology
13.3.11. Rest of APAC
13.3.11.1. Market Revenue and Volume Forecast, by Material Type
13.3.11.2. Market Revenue and Volume Forecast, by Transistor Type
13.3.11.3. Market Revenue and Volume Forecast, by Device Application
13.3.11.4. Market Revenue and Volume Forecast, by End-User
13.3.11.5. Market Revenue and Volume Forecast, by Integration Technology
13.4. MEA
13.4.1. Market Revenue and Volume Forecast, by Material Type
13.4.2. Market Revenue and Volume Forecast, by Transistor Type
13.4.3. Market Revenue and Volume Forecast, by Device Application
13.4.4. Market Revenue and Volume Forecast, by End-User
13.4.5. Market Revenue and Volume Forecast, by Integration Technology
13.4.6. GCC
13.4.6.1. Market Revenue and Volume Forecast, by Material Type
13.4.6.2. Market Revenue and Volume Forecast, by Transistor Type
13.4.6.3. Market Revenue and Volume Forecast, by Device Application
13.4.6.4. Market Revenue and Volume Forecast, by End-User
13.4.7. Market Revenue and Volume Forecast, by Integration Technology
13.4.8. North Africa
13.4.8.1. Market Revenue and Volume Forecast, by Material Type
13.4.8.2. Market Revenue and Volume Forecast, by Transistor Type
13.4.8.3. Market Revenue and Volume Forecast, by Device Application
13.4.8.4. Market Revenue and Volume Forecast, by End-User
13.4.9. Market Revenue and Volume Forecast, by Integration Technology
13.4.10. South Africa
13.4.10.1. Market Revenue and Volume Forecast, by Material Type
13.4.10.2. Market Revenue and Volume Forecast, by Transistor Type
13.4.10.3. Market Revenue and Volume Forecast, by Device Application
13.4.10.4. Market Revenue and Volume Forecast, by End-User
13.4.10.5. Market Revenue and Volume Forecast, by Integration Technology
13.4.11. Rest of MEA
13.4.11.1. Market Revenue and Volume Forecast, by Material Type
13.4.11.2. Market Revenue and Volume Forecast, by Transistor Type
13.4.11.3. Market Revenue and Volume Forecast, by Device Application
13.4.11.4. Market Revenue and Volume Forecast, by End-User
13.4.11.5. Market Revenue and Volume Forecast, by Integration Technology
13.5. Latin America
13.5.1. Market Revenue and Volume Forecast, by Material Type
13.5.2. Market Revenue and Volume Forecast, by Transistor Type
13.5.3. Market Revenue and Volume Forecast, by Device Application
13.5.4. Market Revenue and Volume Forecast, by End-User
13.5.5. Market Revenue and Volume Forecast, by Integration Technology
13.5.6. Brazil
13.5.6.1. Market Revenue and Volume Forecast, by Material Type
13.5.6.2. Market Revenue and Volume Forecast, by Transistor Type
13.5.6.3. Market Revenue and Volume Forecast, by Device Application
13.5.6.4. Market Revenue and Volume Forecast, by End-User
13.5.7. Market Revenue and Volume Forecast, by Integration Technology
13.5.8. Rest of LATAM
13.5.8.1. Market Revenue and Volume Forecast, by Material Type
13.5.8.2. Market Revenue and Volume Forecast, by Transistor Type
13.5.8.3. Market Revenue and Volume Forecast, by Device Application
13.5.8.4. Market Revenue and Volume Forecast, by End-User
13.5.8.5. Market Revenue and Volume Forecast, by Integration Technology
14.1. GlobalFoundries
14.1.1. Company Overview
14.1.2. Product Offerings
14.1.3. Financial Performance
14.1.4. Recent Initiatives
14.2. Nantero, Inc.
14.2.1. Company Overview
14.2.2. Product Offerings
14.2.3. Financial Performance
14.2.4. Recent Initiatives
14.3. Graphenea
14.3.1. Company Overview
14.3.2. Product Offerings
14.3.3. Financial Performance
14.3.4. Recent Initiatives
14.4. Silvaco, Inc.
14.4.1. Company Overview
14.4.2. Product Offerings
14.4.3. Financial Performance
14.4.4. Recent Initiatives
14.5. AIM Photonics
14.5.1. Company Overview
14.5.2. Product Offerings
14.5.3. Financial Performance
14.5.4. Recent Initiatives
14.6. University-based Spinouts
14.6.1. Company Overview
14.6.2. Product Offerings
14.6.3. Financial Performance
14.6.4. Recent Initiatives
14.7. Arizona State University / MIT 2D Device Labs
14.7.1. Company Overview
14.7.2. Product Offerings
14.7.3. Financial Performance
14.7.4. Recent Initiatives
14.8. Samsung Advanced Institute of Technology (SAIT)
14.8.1. Company Overview
14.8.2. Product Offerings
14.8.3. Financial Performance
14.8.4. Recent Initiatives
14.9. CEA-Leti (France)
14.9.1. Company Overview
14.9.2. Product Offerings
14.9.3. Financial Performance
14.9.4. Recent Initiatives
14.10. HRL Laboratories
14.10.1. Company Overview
14.10.2. Product Offerings
14.10.3. Financial Performance
14.10.4. Recent Initiatives
15.1. Primary Research
15.2. Secondary Research
15.3. Assumptions
16.1. About Us
16.2. Glossary of Terms
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