Bourns BTJ Series Thermal Jumper Chips Enter Electronics Market
Published: 24 Feb 2026
Author: Precedence Research
Bourns continues to expand its offerings in the thermal management sector with the BTJ Series Thermal Jumper Chips, which are now available in the market. This product is intended to efficiently transfer heat between circuit boards while providing electrical isolation, making them suitable for use in compact and dense electronics.
The BTJ Series Thermal Jumper Chips are made of aluminum nitride, a material that is recognized for its high thermal conductivity, enabling fast heat dissipation from hot electronic components. The chips are available in various standard surface-mount packages, ranging from the compact 0508 package to the larger 2512 package. This allows engineers to select the package size that suits their thermal requirements without occupying additional space on the circuit board.
This product finds application in power supplies, RF and GaN amplifiers, converters and mobile electronics, where heat generation can impact device performance and reliability. These chips also facilitate direct connection of thermal sensors to hot components, resulting in enhanced accuracy of heat measurements while ensuring that there is no unwanted electrical conduction.
This product has a broad operating temperature range of -55oC to 155oC. It is also RoHS compliant and halogen-free. This means that the chips are safe to use in industrial, automotive and consumer electronics products. Analysts believe that the launch of the BTJ Series is a reaction to the growing need for compact thermal solutions. According to the reports from distributors, engineers have shown interest in the chips for use in high-density boards. As technology advances, the need to efficiently manage heat in devices has become a pressing issue. The BTJ Series offers designers a practical and high performance solution to this problem.
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