The global outsourced semiconductor assembly and test services market size is calculated at USD 46.50 billion in 2025 and is forecasted to reach around USD 92.18 billion by 2034, accelerating at a CAGR of 7.90% from 2025 to 2034.The Asia Pacific outsourced semiconductor assembly and test services market size surpassed USD 28.37 billion in 2025 and is expanding at a CAGR of 7.89% during the forecast period. The market sizing and forecasts are revenue-based (USD Million/Billion), with 2024 as the base year.
1.1. Research Objective
1.2. Scope of the Study
1.3. Definition
2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations
3.1. Market Snapshot
4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis
4.3.1. Raw Material Procurement Analysis
4.3.2. Sales and Distribution Channel Analysis
4.3.3. Downstream Buyer Analysis
5.1. COVID-19 Landscape: Outsourced Semiconductor Assembly and Test Services Industry Impact
5.2. COVID 19 - Impact Assessment for the Industry
5.3. COVID 19 Impact: Global Major Government Policy
5.4. Market Trends and Opportunities in the COVID-19 Landscape
6.1. Market Dynamics
6.1.1. Market Drivers
6.1.2. Market Restraints
6.1.3. Market Opportunities
6.2. Porter’s Five Forces Analysis
6.2.1. Bargaining power of suppliers
6.2.2. Bargaining power of buyers
6.2.3. Threat of substitute
6.2.4. Threat of new entrants
6.2.5. Degree of competition
7.1.1. Company Market Share/Positioning Analysis
7.1.2. Key Strategies Adopted by Players
7.1.3. Vendor Landscape
7.1.3.1. List of Suppliers
7.1.3.2. List of Buyers
8.1. Outsourced Semiconductor Assembly and Test Services Market, by Service Type
8.1.1 Packaging
8.1.1.1. Market Revenue and Forecast
8.1.2. Testing
8.1.2.1. Market Revenue and Forecast
9.1. Outsourced Semiconductor Assembly and Test Services Market, by Type of Packaging
9.1.1. Ball Grid Array (BGA) Packaging
9.1.1.1. Market Revenue and Forecast
9.1.2. Chip-scale Packaging
9.1.2.1. Market Revenue and Forecast
9.1.3. Stacked Die Packaging
9.1.3.1. Market Revenue and Forecast
9.1.4. Multi-chip Packaging
9.1.4.1. Market Revenue and Forecast
9.1.5. Quad Flat and Dual-inline Packaging
9.1.5.1. Market Revenue and Forecast
10.1. Outsourced Semiconductor Assembly and Test Services Market, by Application
10.1.1. Communication
10.1.1.1. Market Revenue and Forecast
10.1.2. Consumer Electronics
10.1.2.1. Market Revenue and Forecast
10.1.3. Automotive
10.1.3.1. Market Revenue and Forecast
10.1.4. Computing and Networking
10.1.4.1. Market Revenue and Forecast
10.1.5. Industrial
10.1.5.1. Market Revenue and Forecast
11.1. North America
11.1.1. Market Revenue and Forecast, by Service Type
11.1.2. Market Revenue and Forecast, by Type of Packaging
11.1.3. Market Revenue and Forecast, by Application
11.1.4. U.S.
11.1.4.1. Market Revenue and Forecast, by Service Type
11.1.4.2. Market Revenue and Forecast, by Type of Packaging
11.1.4.3. Market Revenue and Forecast, by Application
11.1.5. Rest of North America
11.1.5.1. Market Revenue and Forecast, by Service Type
11.1.5.2. Market Revenue and Forecast, by Type of Packaging
11.1.5.3. Market Revenue and Forecast, by Application
11.2. Europe
11.2.1. Market Revenue and Forecast, by Service Type
11.2.2. Market Revenue and Forecast, by Type of Packaging
11.2.3. Market Revenue and Forecast, by Application
11.2.4. UK
11.2.4.1. Market Revenue and Forecast, by Service Type
11.2.4.2. Market Revenue and Forecast, by Type of Packaging
11.2.4.3. Market Revenue and Forecast, by Application
11.2.5. Germany
11.2.5.1. Market Revenue and Forecast, by Service Type
11.2.5.2. Market Revenue and Forecast, by Type of Packaging
11.2.5.3. Market Revenue and Forecast, by Application
11.2.6. France
11.2.6.1. Market Revenue and Forecast, by Service Type
11.2.6.2. Market Revenue and Forecast, by Type of Packaging
11.2.6.3. Market Revenue and Forecast, by Application
11.2.7. Rest of Europe
11.2.7.1. Market Revenue and Forecast, by Service Type
11.2.7.2. Market Revenue and Forecast, by Type of Packaging
11.2.7.3. Market Revenue and Forecast, by Application
11.3. APAC
11.3.1. Market Revenue and Forecast, by Service Type
11.3.2. Market Revenue and Forecast, by Type of Packaging
11.3.3. Market Revenue and Forecast, by Application
11.3.4. India
11.3.4.1. Market Revenue and Forecast, by Service Type
11.3.4.2. Market Revenue and Forecast, by Type of Packaging
11.3.4.3. Market Revenue and Forecast, by Application
11.3.5. China
11.3.5.1. Market Revenue and Forecast, by Service Type
11.3.5.2. Market Revenue and Forecast, by Type of Packaging
11.3.5.3. Market Revenue and Forecast, by Application
11.3.6. Japan
11.3.6.1. Market Revenue and Forecast, by Service Type
11.3.6.2. Market Revenue and Forecast, by Type of Packaging
11.3.6.3. Market Revenue and Forecast, by Application
11.3.7. Rest of APAC
11.3.7.1. Market Revenue and Forecast, by Service Type
11.3.7.2. Market Revenue and Forecast, by Type of Packaging
11.3.7.3. Market Revenue and Forecast, by Application
11.4. MEA
11.4.1. Market Revenue and Forecast, by Service Type
11.4.2. Market Revenue and Forecast, by Type of Packaging
11.4.3. Market Revenue and Forecast, by Application
11.4.4. GCC
11.4.4.1. Market Revenue and Forecast, by Service Type
11.4.4.2. Market Revenue and Forecast, by Type of Packaging
11.4.4.3. Market Revenue and Forecast, by Application
11.4.5. North Africa
11.4.5.1. Market Revenue and Forecast, by Service Type
11.4.5.2. Market Revenue and Forecast, by Type of Packaging
11.4.5.3. Market Revenue and Forecast, by Application
11.4.6. South Africa
11.4.6.1. Market Revenue and Forecast, by Service Type
11.4.6.2. Market Revenue and Forecast, by Type of Packaging
11.4.6.3. Market Revenue and Forecast, by Application
11.4.7. Rest of MEA
11.4.7.1. Market Revenue and Forecast, by Service Type
11.4.7.2. Market Revenue and Forecast, by Type of Packaging
11.4.7.3. Market Revenue and Forecast, by Application
11.5. Latin America
11.5.1. Market Revenue and Forecast, by Service Type
11.5.2. Market Revenue and Forecast, by Type of Packaging
11.5.3. Market Revenue and Forecast, by Application
11.5.4. Brazil
11.5.4.1. Market Revenue and Forecast, by Service Type
11.5.4.2. Market Revenue and Forecast, by Type of Packaging
11.5.4.3. Market Revenue and Forecast, by Application
11.5.5. Rest of LATAM
11.5.5.1. Market Revenue and Forecast, by Service Type
11.5.5.2. Market Revenue and Forecast, by Type of Packaging
11.5.5.3. Market Revenue and Forecast, by Application
12.1. ASE Technology Holding Co., Ltd.
12.1.1. Company Overview
12.1.2. Product Offerings
12.1.3. Financial Performance
12.1.4. Recent Initiatives
12.2. Amkor Technology, Inc.
12.2.1. Company Overview
12.2.2. Product Offerings
12.2.3. Financial Performance
12.2.4. Recent Initiatives
12.3. Siliconware Precision Industries Co., Ltd.
12.3.1. Company Overview
12.3.2. Product Offerings
12.3.3. Financial Performance
12.3.4. Recent Initiatives
12.4. JCET Group Co., Ltd.
12.4.1. Company Overview
12.4.2. Product Offerings
12.4.3. Financial Performance
12.4.4. Recent Initiatives
12.5. Powertech Technology Inc.
12.5.1. Company Overview
12.5.2. Product Offerings
12.5.3. Financial Performance
12.5.4. Recent Initiatives
12.6. Chipbond Technology Corporation
12.6.1. Company Overview
12.6.2. Product Offerings
12.6.3. Financial Performance
12.6.4. Recent Initiatives
12.7. Tongfu Microelectronics Co., Ltd.
12.7.1. Company Overview
12.7.2. Product Offerings
12.7.3. Financial Performance
12.7.4. Recent Initiatives
12.8. ChipMOS Technologies Inc.
12.8.1. Company Overview
12.8.2. Product Offerings
12.8.3. Financial Performance
12.8.4. Recent Initiatives
12.9. Tianshui Huatian Technology Co., Ltd.
12.9.1. Company Overview
12.9.2. Product Offerings
12.9.3. Financial Performance
12.9.4. Recent Initiatives
12.10. STATS ChipPAC Pte. Ltd.
12.10.1. Company Overview
12.10.2. Product Offerings
12.10.3. Financial Performance
12.10.4. Recent Initiatives
13.1. Primary Research
13.2. Secondary Research
13.3. Assumptions
14.1. About Us
14.2. Glossary of Terms
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