Semiconductor Assembly and Packaging Equipment Market Size to Hit USD 20.96 Bn by 2034

Chapter 1. Introduction

1.1. Research Objective

1.2. Scope of the Study

1.3. Definition

Chapter 2. Research Methodology

2.1. Research Approach

2.2. Data Sources

2.3. Assumptions & Limitations

Chapter 3. Executive Summary

3.1. Market Snapshot

Chapter 4. Market Variables and Scope

4.1. Introduction

4.2. Market Classification and Scope

4.3. Industry Value Chain Analysis

4.3.1. Raw Material Procurement Analysis

4.3.2. Sales and Distribution Channel Analysis

4.3.3. Downstream Buyer Analysis

Chapter 5. COVID 19 Impact on Semiconductor Assembly and Packaging Equipment Market

5.1. COVID-19 Landscape: Semiconductor Assembly and Packaging Equipment Industry Impact

5.2. COVID 19 - Impact Assessment for the Industry

5.3. COVID 19 Impact: Global Major Government Policy

5.4. Market Trends and Opportunities in the COVID-19 Landscape

Chapter 6. Market Dynamics Analysis and Trends

6.1. Market Dynamics

6.1.1. Market Drivers

6.1.2. Market Restraints

6.1.3. Market Opportunities

6.2. Porter’s Five Forces Analysis

6.2.1. Bargaining power of suppliers

6.2.2. Bargaining power of buyers

6.2.3. Threat of substitute

6.2.4. Threat of new entrants

6.2.5. Degree of competition

Chapter 7. Competitive Landscape

7.1.1. Company Market Share/Positioning Analysis

7.1.2. Key Strategies Adopted by Players

7.1.3. Vendor Landscape

7.1.3.1. List of Suppliers

7.1.3.2. List of Buyers

Chapter 8. Global Semiconductor Assembly and Packaging Equipment Market, By Equipment Type

8.1. Semiconductor Assembly and Packaging Equipment Market Revenue and Volume Forecast, by Equipment Type

8.1.1. die attach equipment

8.1.1.1. Market Revenue and Volume Forecast

8.1.2. Wire Bonding Equipment

8.1.2.1. Market Revenue and Volume Forecast

8.1.3. flip chip bonders / advanced die bonders

8.1.3.1. Market Revenue and Volume Forecast

8.1.4. Wafer-Level Packaging (WLP) Equipment

8.1.4.1. Market Revenue and Volume Forecast

8.1.5. Encapsulation & Molding Equipment

8.1.5.1. Market Revenue and Volume Forecast

8.1.6. Inspection & Metrology Equipment

8.1.6.1. Market Revenue and Volume Forecast

8.1.7. Thermal Management / Underfill Equipment

8.1.7.1. Market Revenue and Volume Forecast

Chapter 9. Global Semiconductor Assembly and Packaging Equipment Market, By Packaging Type

9.1. Semiconductor Assembly and Packaging Equipment Market Revenue and Volume Forecast, by Packaging Type

9.1.1. Wire Bond Packaging

9.1.1.1. Market Revenue and Volume Forecast

9.1.2. flip chip packaging

9.1.2.1. Market Revenue and Volume Forecast

9.1.3. Wafer-Level Packaging (WLP)

9.1.3.1. Market Revenue and Volume Forecast

9.1.4. 3D Integrated Circuits (3D-ICs)

9.1.4.1. Market Revenue and Volume Forecast

Chapter 10. Global Semiconductor Assembly and Packaging Equipment Market, By Application

10.1. Semiconductor Assembly and Packaging Equipment Market Revenue and Volume Forecast, by Application

10.1.1. consumer electronics

10.1.1.1. Market Revenue and Volume Forecast

10.1.2. automotive electronics

10.1.2.1. Market Revenue and Volume Forecast

10.1.3. Data Centers / AI Chips

10.1.3.1. Market Revenue and Volume Forecast

10.1.4. Industrial IoT / Edge Devices

10.1.4.1. Market Revenue and Volume Forecast

10.1.5. Healthcare Electronics

10.1.5.1. Market Revenue and Volume Forecast

Chapter 11. Global Semiconductor Assembly and Packaging Equipment Market, By End User

11.1. Semiconductor Assembly and Packaging Equipment Market Revenue and Volume Forecast, by End User

11.1.1. OSAT Companies

11.1.1.1. Market Revenue and Volume Forecast

11.1.2. IDMs

11.1.2.1. Market Revenue and Volume Forecast

11.1.3. Foundries

11.1.3.1. Market Revenue and Volume Forecast

Chapter 12. Global Semiconductor Assembly and Packaging Equipment Market, Regional Estimates and Trend Forecast

12.1. North America

12.1.1. Market Revenue and Volume Forecast, by Equipment Type

12.1.2. Market Revenue and Volume Forecast, by Packaging Type

12.1.3. Market Revenue and Volume Forecast, by Application

12.1.4. Market Revenue and Volume Forecast, by End User

12.1.5. U.S.

12.1.5.1. Market Revenue and Volume Forecast, by Equipment Type

12.1.5.2. Market Revenue and Volume Forecast, by Packaging Type

12.1.5.3. Market Revenue and Volume Forecast, by Application

12.1.5.4. Market Revenue and Volume Forecast, by End User

12.1.6. Rest of North America

12.1.6.1. Market Revenue and Volume Forecast, by Equipment Type

12.1.6.2. Market Revenue and Volume Forecast, by Packaging Type

12.1.6.3. Market Revenue and Volume Forecast, by Application

12.1.6.4. Market Revenue and Volume Forecast, by End User

12.2. Europe

12.2.1. Market Revenue and Volume Forecast, by Equipment Type

12.2.2. Market Revenue and Volume Forecast, by Packaging Type

12.2.3. Market Revenue and Volume Forecast, by Application

12.2.4. Market Revenue and Volume Forecast, by End User

12.2.5. UK

12.2.5.1. Market Revenue and Volume Forecast, by Equipment Type

12.2.5.2. Market Revenue and Volume Forecast, by Packaging Type

12.2.5.3. Market Revenue and Volume Forecast, by Application

12.2.5.4. Market Revenue and Volume Forecast, by End User

12.2.6. Germany

12.2.6.1. Market Revenue and Volume Forecast, by Equipment Type

12.2.6.2. Market Revenue and Volume Forecast, by Packaging Type

12.2.6.3. Market Revenue and Volume Forecast, by Application

12.2.6.4. Market Revenue and Volume Forecast, by End User

12.2.7. France

12.2.7.1. Market Revenue and Volume Forecast, by Equipment Type

12.2.7.2. Market Revenue and Volume Forecast, by Packaging Type

12.2.7.3. Market Revenue and Volume Forecast, by Application

12.2.7.4. Market Revenue and Volume Forecast, by End User

12.2.8. Rest of Europe

12.2.8.1. Market Revenue and Volume Forecast, by Equipment Type

12.2.8.2. Market Revenue and Volume Forecast, by Packaging Type

12.2.8.3. Market Revenue and Volume Forecast, by Application

12.2.8.4. Market Revenue and Volume Forecast, by End User

12.3. APAC

12.3.1. Market Revenue and Volume Forecast, by Equipment Type

12.3.2. Market Revenue and Volume Forecast, by Packaging Type

12.3.3. Market Revenue and Volume Forecast, by Application

12.3.4. Market Revenue and Volume Forecast, by End User

12.3.5. India

12.3.5.1. Market Revenue and Volume Forecast, by Equipment Type

12.3.5.2. Market Revenue and Volume Forecast, by Packaging Type

12.3.5.3. Market Revenue and Volume Forecast, by Application

12.3.5.4. Market Revenue and Volume Forecast, by End User

12.3.6. China

12.3.6.1. Market Revenue and Volume Forecast, by Equipment Type

12.3.6.2. Market Revenue and Volume Forecast, by Packaging Type

12.3.6.3. Market Revenue and Volume Forecast, by Application

12.3.6.4. Market Revenue and Volume Forecast, by End User

12.3.7. Japan

12.3.7.1. Market Revenue and Volume Forecast, by Equipment Type

12.3.7.2. Market Revenue and Volume Forecast, by Packaging Type

12.3.7.3. Market Revenue and Volume Forecast, by Application

12.3.7.4. Market Revenue and Volume Forecast, by End User

12.3.8. Rest of APAC

12.3.8.1. Market Revenue and Volume Forecast, by Equipment Type

12.3.8.2. Market Revenue and Volume Forecast, by Packaging Type

12.3.8.3. Market Revenue and Volume Forecast, by Application

12.3.8.4. Market Revenue and Volume Forecast, by End User

12.4. MEA

12.4.1. Market Revenue and Volume Forecast, by Equipment Type

12.4.2. Market Revenue and Volume Forecast, by Packaging Type

12.4.3. Market Revenue and Volume Forecast, by Application

12.4.4. Market Revenue and Volume Forecast, by End User

12.4.5. GCC

12.4.5.1. Market Revenue and Volume Forecast, by Equipment Type

12.4.5.2. Market Revenue and Volume Forecast, by Packaging Type

12.4.5.3. Market Revenue and Volume Forecast, by Application

12.4.5.4. Market Revenue and Volume Forecast, by End User

12.4.6. North Africa

12.4.6.1. Market Revenue and Volume Forecast, by Equipment Type

12.4.6.2. Market Revenue and Volume Forecast, by Packaging Type

12.4.6.3. Market Revenue and Volume Forecast, by Application

12.4.6.4. Market Revenue and Volume Forecast, by End User

12.4.7. South Africa

12.4.7.1. Market Revenue and Volume Forecast, by Equipment Type

12.4.7.2. Market Revenue and Volume Forecast, by Packaging Type

12.4.7.3. Market Revenue and Volume Forecast, by Application

12.4.7.4. Market Revenue and Volume Forecast, by End User

12.4.8. Rest of MEA

12.4.8.1. Market Revenue and Volume Forecast, by Equipment Type

12.4.8.2. Market Revenue and Volume Forecast, by Packaging Type

12.4.8.3. Market Revenue and Volume Forecast, by Application

12.4.8.4. Market Revenue and Volume Forecast, by End User

12.5. Latin America

12.5.1. Market Revenue and Volume Forecast, by Equipment Type

12.5.2. Market Revenue and Volume Forecast, by Packaging Type

12.5.3. Market Revenue and Volume Forecast, by Application

12.5.4. Market Revenue and Volume Forecast, by End User

12.5.5. Brazil

12.5.5.1. Market Revenue and Volume Forecast, by Equipment Type

12.5.5.2. Market Revenue and Volume Forecast, by Packaging Type

12.5.5.3. Market Revenue and Volume Forecast, by Application

12.5.5.4. Market Revenue and Volume Forecast, by End User

12.5.6. Rest of LATAM

12.5.6.1. Market Revenue and Volume Forecast, by Equipment Type

12.5.6.2. Market Revenue and Volume Forecast, by Packaging Type

12.5.6.3. Market Revenue and Volume Forecast, by Application

12.5.6.4. Market Revenue and Volume Forecast, by End User

Chapter 13. Company Profiles

13.1. BE Semiconductor Industries (Besi)

13.1.1. Company Overview

13.1.2. Product Offerings

13.1.3. Financial Performance

13.1.4. Recent Initiatives

13.2. Tokyo Electron Ltd. (TEL)

13.2.1. Company Overview

13.2.2. Product Offerings

13.2.3. Financial Performance

13.2.4. Recent Initiatives

13.3. Hitachi High-Tech

13.3.1. Company Overview

13.3.2. Product Offerings

13.3.3. Financial Performance

13.3.4. Recent Initiatives

13.4. Toray Engineering

13.4.1. Company Overview

13.4.2. Product Offerings

13.4.3. Financial Performance

13.4.4. Recent Initiatives

13.5. Nidec Sankyo

13.5.1. Company Overview

13.5.2. Product Offerings

13.5.3. Financial Performance

13.5.4. Recent Initiatives

13.6. Intel & Samsung

13.6.1. Company Overview

13.6.2. Product Offerings

13.6.3. Financial Performance

13.6.4. Recent Initiatives

13.7. Amkor Technology

13.7.1. Company Overview

13.7.2. Product Offerings

13.7.3. Financial Performance

13.7.4. Recent Initiatives

13.8. Applied MaterialsKulicke & Soffa (K&S)

13.8.1. Company Overview

13.8.2. Product Offerings

13.8.3. Financial Performance

13.8.4. Recent Initiatives

13.9. DISCO Corporation

13.9.1. Company Overview

13.9.2. Product Offerings

13.9.3. Financial Performance

13.9.4. Recent Initiatives

13.10. EV Group (EVG)

13.10.1. Company Overview

13.10.2. Product Offerings

13.10.3. Financial Performance

13.10.4. Recent Initiatives

Chapter 14. Research Methodology

14.1. Primary Research

14.2. Secondary Research

14.3. Assumptions

Chapter 15. Appendix

15.1. About Us

15.2. Glossary of Terms

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Frequently Asked Questions

The semiconductor assembly and packaging equipment market size is expected to increase from USD 9.06 billion in 2024 to USD 20.96 billion by 2034.

The semiconductor assembly and packaging equipment market is expected to grow at a compound annual growth rate (CAGR) of around 8.75% from 2025 to 2034.

The major players in the semiconductor assembly and packaging equipment market include ASMPT (ASM Pacific Technology), Kulicke & Soffa (K&S), BE Semiconductor Industries (Besi), DISCO Corporation, Tokyo Electron Ltd. (TEL), Applied Materials, Onto Innovation, EV Group (EVG), SUSS MicroTec, Hanmi Semiconductor, Shibaura Mechatronics (Toshiba), Hitachi High-Tech, Toray Engineering, Panasonic Factory Solutions, Nidec Sankyo, Rudolph Technologies, Intel & Samsung, Amkor Technology, and Startups in Hybrid Bonding & 3D-IC.

The driving factors of the semiconductor assembly and packaging equipment market are the consumer electronics and wearables are driving the need for ultra-thin, compact packaging, pushing innovation in materials, substrate technology, and 3D stacking methods

Asia Pacific region will lead the global semiconductor assembly and packaging equipment market during the forecast period 2025 to 2034.