Semiconductor Etch Equipment Market Size, Share, and Trends 2025 to 2034

Chapter 1. Introduction

1.1. Research Objective

1.2. Scope of the Study

1.3. Definition

Chapter 2. Research Methodology

2.1. Research Approach

2.2. Data Sources

2.3. Assumptions & Limitations

Chapter 3. Executive Summary

3.1. Market Snapshot

Chapter 4. Market Variables and Scope 

4.1. Introduction

4.2. Market Classification and Scope

4.3. Industry Value Chain Analysis

4.3.1. Raw Material Procurement Analysis 

4.3.2. Sales and Distribution Channel Analysis

4.3.3. Downstream Buyer Analysis

Chapter 5. Market Dynamics Analysis and Trends

5.1. Market Dynamics

5.1.1. Market Drivers

5.1.2. Market Restraints

5.1.3. Market Opportunities

5.2. Porter’s Five Forces Analysis

5.2.1. Bargaining power of suppliers

5.2.2. Bargaining power of buyers

5.2.3. Threat of substitute

5.2.4. Threat of new entrants

5.2.5. Degree of competition

Chapter 6. Competitive Landscape

6.1.1. Company Market Share/Positioning Analysis

6.1.2. Key Strategies Adopted by Players

6.1.3. Vendor Landscape

6.1.3.1. List of Suppliers

6.1.3.2. List of Buyers

Chapter 7. Global Semiconductor Etch Equipment Market, By Etching Type

7.1. Semiconductor Etch Equipment Market Revenue and Volume, by Etching Type, 2025-2034

7.1.1. Dry Etching

7.1.1.1. Market Revenue and Volume Forecast (2022-2034)

7.1.2. Wet Etching

7.1.2.1. Market Revenue and Volume Forecast (2022-2034)

Chapter 8. Global Semiconductor Etch Equipment Market, By Process Type

8.1. Semiconductor Etch Equipment Market Revenue and Volume, by Process Type, 2025-2034

8.1.1. Conductor Etch

8.1.1.1. Market Revenue and Volume Forecast (2022-2034)

8.1.2. Dielectric Etch

8.1.2.1. Market Revenue and Volume Forecast (2022-2034)

8.1.3. Silicon Etch

8.1.3.1. Market Revenue and Volume Forecast (2022-2034)

Chapter 9. Global Semiconductor Etch Equipment Market, By Wafer Size Compatibility

9.1. Semiconductor Etch Equipment Market Revenue and Volume, by Wafer Size Compatibility, 2025-2034

9.1.1. ≤150 mm

9.1.1.1. Market Revenue and Volume Forecast (2022-2034)

9.1.2. 200 mm  

9.1.2.1. Market Revenue and Volume Forecast (2022-2034)

9.1.3. 300 mm

9.1.3.1. Market Revenue and Volume Forecast (2022-2034)

9.1.4. ≥450 mm

9.1.4.1. Market Revenue and Volume Forecast (2022-2034)

Chapter 10. Global Semiconductor Etch Equipment Market, By Equipment Type

10.1. Semiconductor Etch Equipment Market Revenue and Volume, by Equipment Type, 2025-2034

10.1.1. Batch Etch Systems

10.1.1.1. Market Revenue and Volume Forecast (2022-2034)

10.1.2. Single-Wafer Etch Systems

10.1.2.1. Market Revenue and Volume Forecast (2022-2034)

Chapter 11. Global Semiconductor Etch Equipment Market, By Technology Node

11.1. Semiconductor Etch Equipment Market Revenue and Volume, by Technology Node, 2025-2034

11.1.1. ≥65 nm

11.1.1.1. Market Revenue and Volume Forecast (2022-2034)

11.1.2. 45–65 nm

11.1.2.1. Market Revenue and Volume Forecast (2022-2034)

11.1.3. 28–45 nm

11.1.3.1. Market Revenue and Volume Forecast (2022-2034)

11.1.4. 10–28 nm

11.1.4.1. Market Revenue and Volume Forecast (2022-2034)

11.1.5. ≤7 nm

11.1.5.1. Market Revenue and Volume Forecast (2022-2034)

Chapter 12. Global Semiconductor Etch Equipment Market, By End-Use Device Type

12.1. Semiconductor Etch Equipment Market Revenue and Volume, by End-Use Device Type, 2025-2034

12.1.1. Logic IC

12.1.1.1. Market Revenue and Volume Forecast (2022-2034)

12.1.2. Memory IC

12.1.2.1. Market Revenue and Volume Forecast (2022-2034)

12.1.3. Analog & Mixed Signal

12.1.3.1. Market Revenue and Volume Forecast (2022-2034)

12.1.4. Power Devices

12.1.4.1. Market Revenue and Volume Forecast (2022-2034)

12.1.5. MEMS

12.1.5.1. Market Revenue and Volume Forecast (2022-2034)

12.1.6. CMOS Image Sensors

12.1.6.1. Market Revenue and Volume Forecast

Chapter 13. Global Semiconductor Etch Equipment Market, By Application

13.1. Semiconductor Etch Equipment Market Revenue and Volume, by Application, 2025-2034

13.1.1. Front-End-of-Line (FEOL)

13.1.1.1. Market Revenue and Volume Forecast (2022-2034)

13.1.2. Back-End-of-Line (BEOL)

13.1.2.1. Market Revenue and Volume Forecast (2022-2034)

13.1.3. Packaging Etch (e.g., TSV, RDL)

13.1.3.1. Market Revenue and Volume Forecast (2022-2034)

Chapter 14. Global Semiconductor Etch Equipment Market, By End-User / Fabrication Facility Type

14.1. Semiconductor Etch Equipment Market Revenue and Volume, by End-User / Fabrication Facility Type, 2025-2034

14.1.1. IDMs (Integrated Device Manufacturers)

14.1.1.1. Market Revenue and Volume Forecast (2022-2034)

14.1.2. Foundries

14.1.2.1. Market Revenue and Volume Forecast (2022-2034)

14.1.3. OSATs (Outsourced Semiconductor Assembly and Test)

14.1.3.1. Market Revenue and Volume Forecast (2022-2034)

14.1.4. Research & Academia / R&D Labs

14.1.4.1. Market Revenue and Volume Forecast (2022-2034)

Chapter 15. Global Semiconductor Etch Equipment Market, Regional Estimates and Trend Forecast

15.1. North America

15.1.1. Market Revenue and Volume Forecast, by Etching Type (2022-2034)

15.1.2. Market Revenue and Volume Forecast, by Process Type (2022-2034)

15.1.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility (2022-2034)

15.1.4. Market Revenue and Volume Forecast, by Equipment Type (2022-2034)

15.1.5. Market Revenue and Volume Forecast, by Technology Node (2022-2034)

15.1.6. Market Revenue and Volume Forecast, by End-Use Device Type (2022-2034)

15.1.7. Market Revenue and Volume Forecast, by Application (2022-2034)

15.1.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type (2022-2034)

15.1.9. U.S.

15.1.9.1. Market Revenue and Volume Forecast, by Etching Type (2022-2034)

15.1.9.2. Market Revenue and Volume Forecast, by Process Type (2022-2034)

15.1.9.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility (2022-2034)

15.1.9.4. Market Revenue and Volume Forecast, by Equipment Type (2022-2034)

15.1.9.5.  Market Revenue and Volume Forecast, by Technology Node (2022-2034)

15.1.9.6. Market Revenue and Volume Forecast, by End-Use Device Type (2022-2034)

15.1.9.7. Market Revenue and Volume Forecast, by Application (2022-2034)

15.1.9.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type (2022-2034)

15.1.10. Rest of North America

15.1.10.1. Market Revenue and Volume Forecast, by Etching Type (2022-2034)

15.1.10.2. Market Revenue and Volume Forecast, by Process Type (2022-2034)

15.1.10.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility (2022-2034)

15.1.10.4. Market Revenue and Volume Forecast, by Equipment Type (2022-2034)

15.1.10.5. Market Revenue and Volume Forecast, by Technology Node (2022-2034)

15.1.10.6. Market Revenue and Volume Forecast, by End-Use Device Type (2022-2034)

15.1.10.7. Market Revenue and Volume Forecast, by Application (2022-2034)

15.1.10.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type (2022-2034)

15.2. Europe

15.2.1. Market Revenue and Volume Forecast, by Etching Type (2022-2034)

15.2.2. Market Revenue and Volume Forecast, by Process Type (2022-2034)

15.2.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility (2022-2034)

15.2.4. Market Revenue and Volume Forecast, by Equipment Type (2022-2034)

15.2.5. Market Revenue and Volume Forecast, by Technology Node (2022-2034)

15.2.6. Market Revenue and Volume Forecast, by End-Use Device Type (2022-2034)

15.2.7. Market Revenue and Volume Forecast, by Application (2022-2034)

15.2.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type (2022-2034)

15.2.9. UK

15.2.9.1. Market Revenue and Volume Forecast, by Etching Type (2022-2034)

15.2.9.2. Market Revenue and Volume Forecast, by Process Type (2022-2034)

15.2.9.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility (2022-2034)

15.2.9.4. Market Revenue and Volume Forecast, by Equipment Type (2022-2034)

15.2.9.5. Market Revenue and Volume Forecast, by Technology Node (2022-2034)

15.2.9.6. Market Revenue and Volume Forecast, by End-Use Device Type (2022-2034)

15.2.9.7. Market Revenue and Volume Forecast, by Application (2022-2034)

15.2.9.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type (2022-2034)

15.2.10. Germany

15.2.10.1. Market Revenue and Volume Forecast, by Etching Type (2022-2034)

15.2.10.2. Market Revenue and Volume Forecast, by Process Type (2022-2034)

15.2.10.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility (2022-2034)

15.2.10.4. Market Revenue and Volume Forecast, by Equipment Type (2022-2034)

15.2.10.5. Market Revenue and Volume Forecast, by Technology Node (2022-2034)

15.2.10.6. Market Revenue and Volume Forecast, by End-Use Device Type (2022-2034)

15.2.10.7. Market Revenue and Volume Forecast, by Application (2022-2034)

15.2.10.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type (2022-2034)

15.2.11.  France

15.2.11.1. Market Revenue and Volume Forecast, by Etching Type (2022-2034)

15.2.11.2. Market Revenue and Volume Forecast, by Process Type (2022-2034)

15.2.11.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility (2022-2034)

15.2.11.4. Market Revenue and Volume Forecast, by Equipment Type (2022-2034)

15.2.11.5. Market Revenue and Volume Forecast, by Technology Node (2022-2034)

15.2.11.6. Market Revenue and Volume Forecast, by End-Use Device Type (2022-2034)

15.2.11.7. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type (2022-2034)

15.2.11.8. Market Revenue and Volume Forecast, by Application (2022-2034)

15.2.12. Rest of Europe

15.2.12.1. Market Revenue and Volume Forecast, by Etching Type (2022-2034)

15.2.12.2. Market Revenue and Volume Forecast, by Process Type (2022-2034)

15.2.12.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility (2022-2034)

15.2.12.4. Market Revenue and Volume Forecast, by Equipment Type (2022-2034)

15.2.12.5. Market Revenue and Volume Forecast, by Technology Node (2022-2034)

15.2.12.6. Market Revenue and Volume Forecast, by End-Use Device Type (2022-2034)

15.2.12.7. Market Revenue and Volume Forecast, by Application (2022-2034)

15.2.12.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type (2022-2034)

15.3. APAC

15.3.1. Market Revenue and Volume Forecast, by Etching Type (2022-2034)

15.3.2. Market Revenue and Volume Forecast, by Process Type (2022-2034)

15.3.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility (2022-2034)

15.3.4. Market Revenue and Volume Forecast, by Equipment Type (2022-2034)

15.3.5. Market Revenue and Volume Forecast, by Technology Node (2022-2034)

15.3.6. Market Revenue and Volume Forecast, by End-Use Device Type (2022-2034)

15.3.7. Market Revenue and Volume Forecast, by Application (2022-2034)

15.3.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type (2022-2034)

15.3.9. India

15.3.9.1. Market Revenue and Volume Forecast, by Etching Type (2022-2034)

15.3.9.2. Market Revenue and Volume Forecast, by Process Type (2022-2034)

15.3.9.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility (2022-2034)

15.3.9.4. Market Revenue and Volume Forecast, by Equipment Type (2022-2034)

15.3.9.5. Market Revenue and Volume Forecast, by Technology Node (2022-2034)

15.3.9.6. Market Revenue and Volume Forecast, by End-Use Device Type (2022-2034)

15.3.9.7. Market Revenue and Volume Forecast, by Application (2022-2034)

15.3.9.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type (2022-2034)

15.3.10. China

15.3.10.1. Market Revenue and Volume Forecast, by Etching Type (2022-2034)

15.3.10.2. Market Revenue and Volume Forecast, by Process Type (2022-2034)

15.3.10.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility (2022-2034)

15.3.10.4. Market Revenue and Volume Forecast, by Equipment Type (2022-2034)

15.3.10.5. Market Revenue and Volume Forecast, by Technology Node (2022-2034)

15.3.10.6. Market Revenue and Volume Forecast, by End-Use Device Type (2022-2034)

15.3.10.7. Market Revenue and Volume Forecast, by Application (2022-2034)

15.3.10.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type (2022-2034)

15.3.11. Japan

15.3.11.1. Market Revenue and Volume Forecast, by Etching Type (2022-2034)

15.3.11.2. Market Revenue and Volume Forecast, by Process Type (2022-2034)

15.3.11.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility (2022-2034)

15.3.11.4. Market Revenue and Volume Forecast, by Equipment Type (2022-2034)

15.3.11.5. Market Revenue and Volume Forecast, by Technology Node (2022-2034)

15.3.11.6. Market Revenue and Volume Forecast, by End-Use Device Type (2022-2034)

15.3.11.7. Market Revenue and Volume Forecast, by Application (2022-2034)

15.3.11.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type (2022-2034)

15.3.12. Rest of APAC

15.3.12.1. Market Revenue and Volume Forecast, by Etching Type (2022-2034)

15.3.12.2. Market Revenue and Volume Forecast, by Process Type (2022-2034)

15.3.12.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility (2022-2034)

15.3.12.4. Market Revenue and Volume Forecast, by Equipment Type (2022-2034)

15.3.12.5. Market Revenue and Volume Forecast, by Technology Node (2022-2034)

15.3.12.6. Market Revenue and Volume Forecast, by End-Use Device Type (2022-2034)

15.3.12.7. Market Revenue and Volume Forecast, by Application (2022-2034)

15.3.12.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type (2022-2034)

15.4. MEA

15.4.1. Market Revenue and Volume Forecast, by Etching Type (2022-2034)

15.4.2. Market Revenue and Volume Forecast, by Process Type (2022-2034)

15.4.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility (2022-2034)

15.4.4. Market Revenue and Volume Forecast, by Equipment Type (2022-2034)

15.4.5. Market Revenue and Volume Forecast, by Technology Node (2022-2034)

15.4.6. Market Revenue and Volume Forecast, by End-Use Device Type (2022-2034)

15.4.7. Market Revenue and Volume Forecast, by Application (2022-2034)

15.4.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type (2022-2034)

15.4.9. GCC

15.4.9.1. Market Revenue and Volume Forecast, by Etching Type (2022-2034)

15.4.9.2. Market Revenue and Volume Forecast, by Process Type (2022-2034)

15.4.9.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility (2022-2034)

15.4.9.4. Market Revenue and Volume Forecast, by Equipment Type (2022-2034)

15.4.9.5. Market Revenue and Volume Forecast, by Technology Node (2022-2034)

15.4.9.6. Market Revenue and Volume Forecast, by End-Use Device Type (2022-2034)

15.4.9.7. Market Revenue and Volume Forecast, by Application (2022-2034)

15.4.9.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type (2022-2034)

15.4.10. North Africa

15.4.10.1. Market Revenue and Volume Forecast, by Etching Type (2022-2034)

15.4.10.2. Market Revenue and Volume Forecast, by Process Type (2022-2034)

15.4.10.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility (2022-2034)

15.4.10.4. Market Revenue and Volume Forecast, by Equipment Type (2022-2034)

15.4.10.5. Market Revenue and Volume Forecast, by Technology Node (2022-2034)

15.4.10.6. Market Revenue and Volume Forecast, by End-Use Device Type (2022-2034)

15.4.10.7. Market Revenue and Volume Forecast, by Application (2022-2034)

15.4.10.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type (2022-2034)

15.4.11. South Africa

15.4.11.1. Market Revenue and Volume Forecast, by Etching Type (2022-2034)

15.4.11.2. Market Revenue and Volume Forecast, by Process Type (2022-2034)

15.4.11.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility (2022-2034)

15.4.11.4. Market Revenue and Volume Forecast, by Equipment Type (2022-2034)

15.4.11.5. Market Revenue and Volume Forecast, by Technology Node (2022-2034)

15.4.11.6. Market Revenue and Volume Forecast, by End-Use Device Type (2022-2034)

15.4.11.7. Market Revenue and Volume Forecast, by Application (2022-2034)

15.4.11.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type (2022-2034)

15.4.12. Rest of MEA

15.4.12.1. Market Revenue and Volume Forecast, by Etching Type (2022-2034)

15.4.12.2. Market Revenue and Volume Forecast, by Process Type (2022-2034)

15.4.12.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility (2022-2034)

15.4.12.4. Market Revenue and Volume Forecast, by Equipment Type (2022-2034)

15.4.12.5. Market Revenue and Volume Forecast, by Technology Node (2022-2034)

15.4.12.6. Market Revenue and Volume Forecast, by End-Use Device Type (2022-2034)

15.4.12.7. Market Revenue and Volume Forecast, by Application (2022-2034)

15.4.12.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type (2022-2034)

15.5. Latin America

15.5.1. Market Revenue and Volume Forecast, by Etching Type (2022-2034)

15.5.2. Market Revenue and Volume Forecast, by Process Type (2022-2034)

15.5.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility (2022-2034)

15.5.4. Market Revenue and Volume Forecast, by Equipment Type (2022-2034)

15.5.5. Market Revenue and Volume Forecast, by Technology Node (2022-2034)

15.5.6. Market Revenue and Volume Forecast, by End-Use Device Type (2022-2034)

15.5.7. Market Revenue and Volume Forecast, by Application (2022-2034)

15.5.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type (2022-2034)

15.5.9. Brazil

15.5.9.1. Market Revenue and Volume Forecast, by Etching Type (2022-2034)

15.5.9.2. Market Revenue and Volume Forecast, by Process Type (2022-2034)

15.5.9.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility (2022-2034)

15.5.9.4. Market Revenue and Volume Forecast, by Equipment Type (2022-2034)

15.5.9.5. Market Revenue and Volume Forecast, by Technology Node (2022-2034)

15.5.9.6. Market Revenue and Volume Forecast, by End-Use Device Type (2022-2034)

15.5.9.7. Market Revenue and Volume Forecast, by Application (2022-2034)

15.5.9.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type (2022-2034)

15.5.10.   Rest of LATAM

15.5.10.1. Market Revenue and Volume Forecast, by Etching Type (2022-2034)

15.5.10.2. Market Revenue and Volume Forecast, by Process Type (2022-2034)

15.5.10.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility (2022-2034)

15.5.10.4. Market Revenue and Volume Forecast, by Equipment Type (2022-2034)

15.5.10.5. Market Revenue and Volume Forecast, by Technology Node (2022-2034)

15.5.10.6. Market Revenue and Volume Forecast, by End-Use Device Type (2022-2034)

15.5.10.7. Market Revenue and Volume Forecast, by Application (2022-2034)

15.5.10.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type (2022-2034)

Chapter 16. Company Profiles

16.1. Applied Materials, Inc.

16.1.1. Company Overview

16.1.2. Product Offerings

16.1.3. Financial Performance

16.1.4. Recent Initiatives

16.2. Lam Research Corporation

16.2.1. Company Overview

16.2.2. Product Offerings

16.2.3. Financial Performance

16.2.4. Recent Initiatives

16.3. Plasma-Therm

16.3.1. Company Overview

16.3.2. Product Offerings

16.3.3. Financial Performance

16.3.4. Recent Initiatives

16.4. Oxford Instruments

16.4.1. Company Overview

16.4.2. Product Offerings

16.4.3. Financial Performance

16.4.4. Recent Initiatives

16.5. SPTS Technologies (a KLA company)

16.5.1. Company Overview

16.5.2. Product Offerings

16.5.3. Financial Performance

16.5.4. Recent Initiatives

16.6. SAMCO Inc.

16.6.1. Company Overview

16.6.2. Product Offerings

16.6.3. Financial Performance

16.6.4. Recent Initiatives

16.7. Veeco Instruments Inc.

16.7.1. Company Overview

16.7.2. Product Offerings

16.7.3. Financial Performance

16.7.4. Recent Initiatives

16.8. Trion Technology, Inc.

16.8.1. Company Overview

16.8.2. Product Offerings

16.8.3. Financial Performance

16.8.4. Recent Initiatives

16.9. Shibaura Mechatronics Corp.

16.9.1. Company Overview

16.9.2. Product Offerings

16.9.3. Financial Performance

16.9.4. Recent Initiatives

16.10. RION Technology

16.10.1. Company Overview

16.10.2. Product Offerings

16.10.3. Financial Performance

16.10.4. Recent Initiatives

Chapter 17. Research Methodology

16.7. Primary Research

16.7. Secondary Research

16.7. Assumptions

Chapter 18. Appendix

18.1. About Us

18.2. Glossary of Terms