1.1. Research Objective
1.2. Scope of the Study
1.3. Definition
2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations
3.1. Market Snapshot
4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis
4.3.1. Raw Material Procurement Analysis
4.3.2. Sales and Distribution Channel Analysis
4.3.3. Downstream Buyer Analysis
5.1. Market Dynamics
5.1.1. Market Drivers
5.1.2. Market Restraints
5.1.3. Market Opportunities
5.2. Porter’s Five Forces Analysis
5.2.1. Bargaining power of suppliers
5.2.2. Bargaining power of buyers
5.2.3. Threat of substitute
5.2.4. Threat of new entrants
5.2.5. Degree of competition
6.1.1. Company Market Share/Positioning Analysis
6.1.2. Key Strategies Adopted by Players
6.1.3. Vendor Landscape
6.1.3.1. List of Suppliers
6.1.3.2. List of Buyers
7.1. Semiconductor Etch Equipment Market Revenue and Volume, by Etching Type
7.1.1. Dry Etching
7.1.1.1. Market Revenue and Volume Forecast
7.1.2. Wet Etching
7.1.2.1. Market Revenue and Volume Forecast
8.1. Semiconductor Etch Equipment Market Revenue and Volume, by Process Type
8.1.1. Conductor Etch
8.1.1.1. Market Revenue and Volume Forecast
8.1.2. Dielectric Etch
8.1.2.1. Market Revenue and Volume Forecast
8.1.3. Silicon Etch
8.1.3.1. Market Revenue and Volume Forecast
9.1. Semiconductor Etch Equipment Market Revenue and Volume, by Wafer Size Compatibility
9.1.1. ≤150 mm
9.1.1.1. Market Revenue and Volume Forecast
9.1.2. 200 mm
9.1.2.1. Market Revenue and Volume Forecast
9.1.3. 300 mm
9.1.3.1. Market Revenue and Volume Forecast
9.1.4. ≥450 mm
9.1.4.1. Market Revenue and Volume Forecast
10.1. Semiconductor Etch Equipment Market Revenue and Volume, by Equipment Type
10.1.1. Batch Etch Systems
10.1.1.1. Market Revenue and Volume Forecast
10.1.2. Single-Wafer Etch Systems
10.1.2.1. Market Revenue and Volume Forecast
11.1. Semiconductor Etch Equipment Market Revenue and Volume, by Technology Node
11.1.1. ≥65 nm
11.1.1.1. Market Revenue and Volume Forecast
11.1.2. 45–65 nm
11.1.2.1. Market Revenue and Volume Forecast
11.1.3. 28–45 nm
11.1.3.1. Market Revenue and Volume Forecast
11.1.4. 10–28 nm
11.1.4.1. Market Revenue and Volume Forecast
11.1.5. ≤7 nm
11.1.5.1. Market Revenue and Volume Forecast
12.1. Semiconductor Etch Equipment Market Revenue and Volume, by End-Use Device Type
12.1.1. Logic IC
12.1.1.1. Market Revenue and Volume Forecast
12.1.2. Memory IC
12.1.2.1. Market Revenue and Volume Forecast
12.1.3. Analog & Mixed Signal
12.1.3.1. Market Revenue and Volume Forecast
12.1.4. Power Devices
12.1.4.1. Market Revenue and Volume Forecast
12.1.5. MEMS
12.1.5.1. Market Revenue and Volume Forecast
12.1.6. CMOS Image Sensors
12.1.6.1. Market Revenue and Volume Forecast
13.1. Semiconductor Etch Equipment Market Revenue and Volume, by Application
13.1.1. Front-End-of-Line (FEOL)
13.1.1.1. Market Revenue and Volume Forecast
13.1.2. Back-End-of-Line (BEOL)
13.1.2.1. Market Revenue and Volume Forecast
13.1.3. Packaging Etch (e.g., TSV, RDL)
13.1.3.1. Market Revenue and Volume Forecast
14.1. Semiconductor Etch Equipment Market Revenue and Volume, by End-User / Fabrication Facility Type
14.1.1. IDMs (Integrated Device Manufacturers)
14.1.1.1. Market Revenue and Volume Forecast
14.1.2. Foundries
14.1.2.1. Market Revenue and Volume Forecast
14.1.3. OSATs (Outsourced Semiconductor Assembly and Test)
14.1.3.1. Market Revenue and Volume Forecast
14.1.4. Research & Academia / R&D Labs
14.1.4.1. Market Revenue and Volume Forecast
15.1. North America
15.1.1. Market Revenue and Volume Forecast, by Etching Type
15.1.2. Market Revenue and Volume Forecast, by Process Type
15.1.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility
15.1.4. Market Revenue and Volume Forecast, by Equipment Type
15.1.5. Market Revenue and Volume Forecast, by Technology Node
15.1.6. Market Revenue and Volume Forecast, by End-Use Device Type
15.1.7. Market Revenue and Volume Forecast, by Application
15.1.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type
15.1.9. U.S.
15.1.9.1. Market Revenue and Volume Forecast, by Etching Type
15.1.9.2. Market Revenue and Volume Forecast, by Process Type
15.1.9.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility
15.1.9.4. Market Revenue and Volume Forecast, by Equipment Type
15.1.9.5. Market Revenue and Volume Forecast, by Technology Node
15.1.9.6. Market Revenue and Volume Forecast, by End-Use Device Type
15.1.9.7. Market Revenue and Volume Forecast, by Application
15.1.9.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type
15.1.10. Rest of North America
15.1.10.1. Market Revenue and Volume Forecast, by Etching Type
15.1.10.2. Market Revenue and Volume Forecast, by Process Type
15.1.10.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility
15.1.10.4. Market Revenue and Volume Forecast, by Equipment Type
15.1.10.5. Market Revenue and Volume Forecast, by Technology Node
15.1.10.6. Market Revenue and Volume Forecast, by End-Use Device Type
15.1.10.7. Market Revenue and Volume Forecast, by Application
15.1.10.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type
15.2. Europe
15.2.1. Market Revenue and Volume Forecast, by Etching Type
15.2.2. Market Revenue and Volume Forecast, by Process Type
15.2.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility
15.2.4. Market Revenue and Volume Forecast, by Equipment Type
15.2.5. Market Revenue and Volume Forecast, by Technology Node
15.2.6. Market Revenue and Volume Forecast, by End-Use Device Type
15.2.7. Market Revenue and Volume Forecast, by Application
15.2.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type
15.2.9. UK
15.2.9.1. Market Revenue and Volume Forecast, by Etching Type
15.2.9.2. Market Revenue and Volume Forecast, by Process Type
15.2.9.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility
15.2.9.4. Market Revenue and Volume Forecast, by Equipment Type
15.2.9.5. Market Revenue and Volume Forecast, by Technology Node
15.2.9.6. Market Revenue and Volume Forecast, by End-Use Device Type
15.2.9.7. Market Revenue and Volume Forecast, by Application
15.2.9.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type
15.2.10. Germany
15.2.10.1. Market Revenue and Volume Forecast, by Etching Type
15.2.10.2. Market Revenue and Volume Forecast, by Process Type
15.2.10.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility
15.2.10.4. Market Revenue and Volume Forecast, by Equipment Type
15.2.10.5. Market Revenue and Volume Forecast, by Technology Node
15.2.10.6. Market Revenue and Volume Forecast, by End-Use Device Type
15.2.10.7. Market Revenue and Volume Forecast, by Application
15.2.10.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type
15.2.11. France
15.2.11.1. Market Revenue and Volume Forecast, by Etching Type
15.2.11.2. Market Revenue and Volume Forecast, by Process Type
15.2.11.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility
15.2.11.4. Market Revenue and Volume Forecast, by Equipment Type
15.2.11.5. Market Revenue and Volume Forecast, by Technology Node
15.2.11.6. Market Revenue and Volume Forecast, by End-Use Device Type
15.2.11.7. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type
15.2.11.8. Market Revenue and Volume Forecast, by Application
15.2.12. Rest of Europe
15.2.12.1. Market Revenue and Volume Forecast, by Etching Type
15.2.12.2. Market Revenue and Volume Forecast, by Process Type
15.2.12.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility
15.2.12.4. Market Revenue and Volume Forecast, by Equipment Type
15.2.12.5. Market Revenue and Volume Forecast, by Technology Node
15.2.12.6. Market Revenue and Volume Forecast, by End-Use Device Type
15.2.12.7. Market Revenue and Volume Forecast, by Application
15.2.12.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type
15.3. APAC
15.3.1. Market Revenue and Volume Forecast, by Etching Type
15.3.2. Market Revenue and Volume Forecast, by Process Type
15.3.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility
15.3.4. Market Revenue and Volume Forecast, by Equipment Type
15.3.5. Market Revenue and Volume Forecast, by Technology Node
15.3.6. Market Revenue and Volume Forecast, by End-Use Device Type
15.3.7. Market Revenue and Volume Forecast, by Application
15.3.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type
15.3.9. India
15.3.9.1. Market Revenue and Volume Forecast, by Etching Type
15.3.9.2. Market Revenue and Volume Forecast, by Process Type
15.3.9.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility
15.3.9.4. Market Revenue and Volume Forecast, by Equipment Type
15.3.9.5. Market Revenue and Volume Forecast, by Technology Node
15.3.9.6. Market Revenue and Volume Forecast, by End-Use Device Type
15.3.9.7. Market Revenue and Volume Forecast, by Application
15.3.9.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type
15.3.10. China
15.3.10.1. Market Revenue and Volume Forecast, by Etching Type
15.3.10.2. Market Revenue and Volume Forecast, by Process Type
15.3.10.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility
15.3.10.4. Market Revenue and Volume Forecast, by Equipment Type
15.3.10.5. Market Revenue and Volume Forecast, by Technology Node
15.3.10.6. Market Revenue and Volume Forecast, by End-Use Device Type
15.3.10.7. Market Revenue and Volume Forecast, by Application
15.3.10.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type
15.3.11. Japan
15.3.11.1. Market Revenue and Volume Forecast, by Etching Type
15.3.11.2. Market Revenue and Volume Forecast, by Process Type
15.3.11.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility
15.3.11.4. Market Revenue and Volume Forecast, by Equipment Type
15.3.11.5. Market Revenue and Volume Forecast, by Technology Node
15.3.11.6. Market Revenue and Volume Forecast, by End-Use Device Type
15.3.11.7. Market Revenue and Volume Forecast, by Application
15.3.11.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type
15.3.12. Rest of APAC
15.3.12.1. Market Revenue and Volume Forecast, by Etching Type
15.3.12.2. Market Revenue and Volume Forecast, by Process Type
15.3.12.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility
15.3.12.4. Market Revenue and Volume Forecast, by Equipment Type
15.3.12.5. Market Revenue and Volume Forecast, by Technology Node
15.3.12.6. Market Revenue and Volume Forecast, by End-Use Device Type
15.3.12.7. Market Revenue and Volume Forecast, by Application
15.3.12.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type
15.4. MEA
15.4.1. Market Revenue and Volume Forecast, by Etching Type
15.4.2. Market Revenue and Volume Forecast, by Process Type
15.4.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility
15.4.4. Market Revenue and Volume Forecast, by Equipment Type
15.4.5. Market Revenue and Volume Forecast, by Technology Node
15.4.6. Market Revenue and Volume Forecast, by End-Use Device Type
15.4.7. Market Revenue and Volume Forecast, by Application
15.4.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type
15.4.9. GCC
15.4.9.1. Market Revenue and Volume Forecast, by Etching Type
15.4.9.2. Market Revenue and Volume Forecast, by Process Type
15.4.9.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility
15.4.9.4. Market Revenue and Volume Forecast, by Equipment Type
15.4.9.5. Market Revenue and Volume Forecast, by Technology Node
15.4.9.6. Market Revenue and Volume Forecast, by End-Use Device Type
15.4.9.7. Market Revenue and Volume Forecast, by Application
15.4.9.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type
15.4.10. North Africa
15.4.10.1. Market Revenue and Volume Forecast, by Etching Type
15.4.10.2. Market Revenue and Volume Forecast, by Process Type
15.4.10.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility
15.4.10.4. Market Revenue and Volume Forecast, by Equipment Type
15.4.10.5. Market Revenue and Volume Forecast, by Technology Node
15.4.10.6. Market Revenue and Volume Forecast, by End-Use Device Type
15.4.10.7. Market Revenue and Volume Forecast, by Application
15.4.10.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type
15.4.11. South Africa
15.4.11.1. Market Revenue and Volume Forecast, by Etching Type
15.4.11.2. Market Revenue and Volume Forecast, by Process Type
15.4.11.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility
15.4.11.4. Market Revenue and Volume Forecast, by Equipment Type
15.4.11.5. Market Revenue and Volume Forecast, by Technology Node
15.4.11.6. Market Revenue and Volume Forecast, by End-Use Device Type
15.4.11.7. Market Revenue and Volume Forecast, by Application
15.4.11.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type
15.4.12. Rest of MEA
15.4.12.1. Market Revenue and Volume Forecast, by Etching Type
15.4.12.2. Market Revenue and Volume Forecast, by Process Type
15.4.12.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility
15.4.12.4. Market Revenue and Volume Forecast, by Equipment Type
15.4.12.5. Market Revenue and Volume Forecast, by Technology Node
15.4.12.6. Market Revenue and Volume Forecast, by End-Use Device Type
15.4.12.7. Market Revenue and Volume Forecast, by Application
15.4.12.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type
15.5. Latin America
15.5.1. Market Revenue and Volume Forecast, by Etching Type
15.5.2. Market Revenue and Volume Forecast, by Process Type
15.5.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility
15.5.4. Market Revenue and Volume Forecast, by Equipment Type
15.5.5. Market Revenue and Volume Forecast, by Technology Node
15.5.6. Market Revenue and Volume Forecast, by End-Use Device Type
15.5.7. Market Revenue and Volume Forecast, by Application
15.5.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type
15.5.9. Brazil
15.5.9.1. Market Revenue and Volume Forecast, by Etching Type
15.5.9.2. Market Revenue and Volume Forecast, by Process Type
15.5.9.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility
15.5.9.4. Market Revenue and Volume Forecast, by Equipment Type
15.5.9.5. Market Revenue and Volume Forecast, by Technology Node
15.5.9.6. Market Revenue and Volume Forecast, by End-Use Device Type
15.5.9.7. Market Revenue and Volume Forecast, by Application
15.5.9.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type
15.5.10. Rest of LATAM
15.5.10.1. Market Revenue and Volume Forecast, by Etching Type
15.5.10.2. Market Revenue and Volume Forecast, by Process Type
15.5.10.3. Market Revenue and Volume Forecast, by Wafer Size Compatibility
15.5.10.4. Market Revenue and Volume Forecast, by Equipment Type
15.5.10.5. Market Revenue and Volume Forecast, by Technology Node
15.5.10.6. Market Revenue and Volume Forecast, by End-Use Device Type
15.5.10.7. Market Revenue and Volume Forecast, by Application
15.5.10.8. Market Revenue and Volume Forecast, by End-User / Fabrication Facility Type
16.1. Applied Materials, Inc.
16.1.1. Company Overview
16.1.2. Product Offerings
16.1.3. Financial Performance
16.1.4. Recent Initiatives
16.2. Lam Research Corporation
16.2.1. Company Overview
16.2.2. Product Offerings
16.2.3. Financial Performance
16.2.4. Recent Initiatives
16.3. Plasma-Therm
16.3.1. Company Overview
16.3.2. Product Offerings
16.3.3. Financial Performance
16.3.4. Recent Initiatives
16.4. Oxford Instruments
16.4.1. Company Overview
16.4.2. Product Offerings
16.4.3. Financial Performance
16.4.4. Recent Initiatives
16.5. SPTS Technologies (a KLA company)
16.5.1. Company Overview
16.5.2. Product Offerings
16.5.3. Financial Performance
16.5.4. Recent Initiatives
16.6. SAMCO Inc.
16.6.1. Company Overview
16.6.2. Product Offerings
16.6.3. Financial Performance
16.6.4. Recent Initiatives
16.7. Veeco Instruments Inc.
16.7.1. Company Overview
16.7.2. Product Offerings
16.7.3. Financial Performance
16.7.4. Recent Initiatives
16.8. Trion Technology, Inc.
16.8.1. Company Overview
16.8.2. Product Offerings
16.8.3. Financial Performance
16.8.4. Recent Initiatives
16.9. Shibaura Mechatronics Corp.
16.9.1. Company Overview
16.9.2. Product Offerings
16.9.3. Financial Performance
16.9.4. Recent Initiatives
16.10. RION Technology
16.10.1. Company Overview
16.10.2. Product Offerings
16.10.3. Financial Performance
16.10.4. Recent Initiatives
16.7. Primary Research
16.7. Secondary Research
16.7. Assumptions
18.1. About Us
18.2. Glossary of Terms
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