Semiconductor Wafer Fab Equipment Market Size to Hit USD 33.01 Billion by 2034

Chapter 1. Introduction

1.1. Research Objective

1.2. Scope of the Study

1.3. Definition

Chapter 2. Research Methodology

2.1. Research Approach

2.2. Data Sources

2.3. Assumptions & Limitations

Chapter 3. Executive Summary

3.1. Market Snapshot

Chapter 4. Market Variables and Scope

4.1. Introduction

4.2. Market Classification and Scope

4.3. Industry Value Chain Analysis

4.3.1. Raw Material Procurement Analysis

4.3.2. Sales and Distribution Analysis

4.3.3. Downstream Buyer Analysis

Chapter 5. COVID 19 Impact on Semiconductor Wafer Fab Equipment Market

5.1. COVID-19 Landscape: Semiconductor Wafer Fab Equipment Industry Impact

5.2. COVID 19 - Impact Assessment for the Industry

5.3. COVID 19 Impact: Global Major Government Policy

5.4. Market Trends and Opportunities in the COVID-19 Landscape

Chapter 6. Market Dynamics Analysis and Trends

6.1. Market Dynamics

6.1.1. Market Drivers

6.1.2. Market Restraints

6.1.3. Market Opportunities

6.2. Porter’s Five Forces Analysis

6.2.1. Bargaining power of suppliers

6.2.2. Bargaining power of buyers

6.2.3. Threat of substitute

6.2.4. Threat of new entrants

6.2.5. Degree of competition

Chapter 7. Competitive Landscape

7.1.1. Company Market Share/Positioning Analysis

7.1.2. Key Strategies Adopted by Players

7.1.3. Vendor Landscape

7.1.3.1. List of Suppliers

7.1.3.2. List of Buyers

Chapter 8. Global Semiconductor Wafer Fab Equipment Market, By Equipment Type

8.1. Semiconductor Wafer Fab Equipment Market Revenue and Volume, by Equipment Type

8.1.1. Front-End Equipment

8.1.1.1. Market Revenue and Volume Forecast

8.1.2. Back-End Equipment (Wafer Level)

8.1.2.1. Market Revenue and Volume Forecast

8.1.3. Metrology and Inspection Equipment

8.1.3.1. Market Revenue and Volume Forecast

8.1.4. Other Auxiliary Equipment

8.1.4.1. Market Revenue and Volume Forecast

Chapter 9. Global Semiconductor Wafer Fab Equipment Market, By Wafer Size

9.1. Semiconductor Wafer Fab Equipment Market Revenue and Volume, by Wafer Size

9.1.1. 200 mm

9.1.1.1. Market Revenue and Volume Forecast

9.1.2. 300 mm

9.1.2.1. Market Revenue and Volume Forecast

9.1.3. 450 mm

9.1.3.1. Market Revenue and Volume Forecast

9.1.4. Other Sizes (e.g., ≤150 mm)

9.1.4.1. Market Revenue and Volume Forecast

Chapter 10. Global Semiconductor Wafer Fab Equipment Market, By Process Technology Node

10.1. Semiconductor Wafer Fab Equipment Market Revenue and Volume, by Process Technology Node

10.1.1. ≤5 nm

10.1.1.1. Market Revenue and Volume Forecast

10.1.2. 6–10 nm

10.1.2.1. Market Revenue and Volume Forecast

10.1.3. 11–22 nm

10.1.3.1. Market Revenue and Volume Forecast

10.1.4. 28–65 nm

10.1.4.1. Market Revenue and Volume Forecast

10.1.5. ≥90 nm (Legacy Nodes)

10.1.5.1. Market Revenue and Volume Forecast

Chapter 11. Global Semiconductor Wafer Fab Equipment Market, By End-Use Device Type

11.1. Semiconductor Wafer Fab Equipment Market Revenue and Volume, by End-Use Device Type

11.1.1. Logic ICs

11.1.1.1. Market Revenue and Volume Forecast

11.1.2. Analog ICs

11.1.2.1. Market Revenue and Volume Forecast

11.1.3. Memory (DRAM, NAND)

11.1.3.1. Market Revenue and Volume Forecast

11.1.4. Power Devices

11.1.4.1. Market Revenue and Volume Forecast

11.1.5. MEMS & Sensors

11.1.5.1. Market Revenue and Volume Forecast

11.1.6. RF Devices

11.1.6.1. Market Revenue and Volume Forecast

11.1.7. Optoelectronics

11.1.7.1. Market Revenue and Volume Forecast

11.1.8. Discrete Devices

11.1.8.1. Market Revenue and Volume Forecast

Chapter 12. Global Semiconductor Wafer Fab Equipment Market, By Fab Type

12.1. Semiconductor Wafer Fab Equipment Market Revenue and Volume, by Fab Type

12.1.1. Foundries

12.1.1.1. Market Revenue and Volume Forecast

12.1.2. Integrated Device Manufacturers (IDMs)

12.1.2.1. Market Revenue and Volume Forecast

12.1.3. OSATs (for wafer-level processing)

12.1.3.1. Market Revenue and Volume Forecast

12.1.4. R&D / Pilot Lines

12.1.4.1. Market Revenue and Volume Forecast

Chapter 13. Global Semiconductor Wafer Fab Equipment Market, By Application Sector

13.1. Semiconductor Wafer Fab Equipment Market Revenue and Volume, by Application Sector

13.1.1. Consumer Electronics

13.1.1.1. Market Revenue and Volume Forecast

13.1.2. Automotive

13.1.2.1. Market Revenue and Volume Forecast

13.1.3. Industrial

13.1.3.1. Market Revenue and Volume Forecast

13.1.4. Telecommunications

13.1.4.1. Market Revenue and Volume Forecast

13.1.5. Healthcare

13.1.5.1. Market Revenue and Volume Forecast

13.1.6. Aerospace & Defense

13.1.6.1. Market Revenue and Volume Forecast

Chapter 14. Global Semiconductor Wafer Fab Equipment Market, Regional Estimates and Trend Forecast

14.1. North America

14.1.1. Market Revenue and Volume Forecast, by Equipment Type

14.1.2. Market Revenue and Volume Forecast, by Wafer Size

14.1.3. Market Revenue and Volume Forecast, by Process Technology Node

14.1.4. Market Revenue and Volume Forecast, by End-Use Device Type

14.1.5. Market Revenue and Volume Forecast, by Fab Type

14.1.6. Market Revenue and Volume Forecast, by Application Sector

14.1.7. U.S.

14.1.7.1. Market Revenue and Volume Forecast, by Equipment Type

14.1.7.2. Market Revenue and Volume Forecast, by Wafer Size

14.1.7.3. Market Revenue and Volume Forecast, by Process Technology Node

14.1.7.4. Market Revenue and Volume Forecast, by End-Use Device Type

14.1.8. Market Revenue and Volume Forecast, by Fab Type

14.1.8.1. Market Revenue and Volume Forecast, by Application Sector

14.1.9. Rest of North America

14.1.9.1. Market Revenue and Volume Forecast, by Equipment Type

14.1.9.2. Market Revenue and Volume Forecast, by Wafer Size

14.1.9.3. Market Revenue and Volume Forecast, by Process Technology Node

14.1.9.4. Market Revenue and Volume Forecast, by End-Use Device Type

14.1.10. Market Revenue and Volume Forecast, by Fab Type

14.1.11. Market Revenue and Volume Forecast, by Application Sector

14.2. Europe

14.2.1. Market Revenue and Volume Forecast, by Equipment Type

14.2.2. Market Revenue and Volume Forecast, by Wafer Size

14.2.3. Market Revenue and Volume Forecast, by Process Technology Node

14.2.4. Market Revenue and Volume Forecast, by End-Use Device Type

14.2.5. Market Revenue and Volume Forecast, by Fab Type

14.2.6. Market Revenue and Volume Forecast, by Application Sector

14.2.8. UK

14.2.8.1. Market Revenue and Volume Forecast, by Equipment Type

14.2.8.2. Market Revenue and Volume Forecast, by Wafer Size

14.2.8.3. Market Revenue and Volume Forecast, by Process Technology Node

14.2.9. Market Revenue and Volume Forecast, by End-Use Device Type

14.2.10. Market Revenue and Volume Forecast, by Fab Type

14.2.10.1. Market Revenue and Volume Forecast, by Application Sector

14.2.11. Germany

14.2.11.1. Market Revenue and Volume Forecast, by Equipment Type

14.2.11.2. Market Revenue and Volume Forecast, by Wafer Size

14.2.11.3. Market Revenue and Volume Forecast, by Process Technology Node

14.2.12. Market Revenue and Volume Forecast, by End-Use Device Type

14.2.13. Market Revenue and Volume Forecast, by Fab Type

14.2.14. Market Revenue and Volume Forecast, by Application Sector

14.2.15. France

14.2.15.1. Market Revenue and Volume Forecast, by Equipment Type

14.2.15.2. Market Revenue and Volume Forecast, by Wafer Size

14.2.15.3. Market Revenue and Volume Forecast, by Process Technology Node

14.2.15.4. Market Revenue and Volume Forecast, by End-Use Device Type

14.2.16. Market Revenue and Volume Forecast, by Fab Type

14.2.16.1. Market Revenue and Volume Forecast, by Application Sector

14.2.17. Rest of Europe

14.2.17.1. Market Revenue and Volume Forecast, by Equipment Type

14.2.17.2. Market Revenue and Volume Forecast, by Wafer Size

14.2.17.3. Market Revenue and Volume Forecast, by Process Technology Node

14.2.17.4. Market Revenue and Volume Forecast, by End-Use Device Type

14.2.18. Market Revenue and Volume Forecast, by Fab Type

14.2.18.1. Market Revenue and Volume Forecast, by Application Sector

14.3. APAC

14.3.1. Market Revenue and Volume Forecast, by Equipment Type

14.3.2. Market Revenue and Volume Forecast, by Wafer Size

14.3.3. Market Revenue and Volume Forecast, by Process Technology Node

14.3.4. Market Revenue and Volume Forecast, by End-Use Device Type

14.3.5. Market Revenue and Volume Forecast, by Fab Type

14.3.6. Market Revenue and Volume Forecast, by Application Sector

14.3.7. India

14.3.7.1. Market Revenue and Volume Forecast, by Equipment Type

14.3.7.2. Market Revenue and Volume Forecast, by Wafer Size

14.3.7.3. Market Revenue and Volume Forecast, by Process Technology Node

14.3.7.4. Market Revenue and Volume Forecast, by End-Use Device Type

14.3.8. Market Revenue and Volume Forecast, by Fab Type

14.3.9. Market Revenue and Volume Forecast, by Application Sector

14.3.10. China

14.3.10.1. Market Revenue and Volume Forecast, by Equipment Type

14.3.10.2. Market Revenue and Volume Forecast, by Wafer Size

14.3.10.3. Market Revenue and Volume Forecast, by Process Technology Node

14.3.10.4. Market Revenue and Volume Forecast, by End-Use Device Type

14.3.11. Market Revenue and Volume Forecast, by Fab Type

14.3.11.1. Market Revenue and Volume Forecast, by Application Sector

14.3.12. Japan

14.3.12.1. Market Revenue and Volume Forecast, by Equipment Type

14.3.12.2. Market Revenue and Volume Forecast, by Wafer Size

14.3.12.3. Market Revenue and Volume Forecast, by Process Technology Node

14.3.12.4. Market Revenue and Volume Forecast, by End-Use Device Type

14.3.12.5. Market Revenue and Volume Forecast, by Fab Type

14.3.12.6. Market Revenue and Volume Forecast, by Application Sector

14.3.13. Rest of APAC

14.3.13.1. Market Revenue and Volume Forecast, by Equipment Type

14.3.13.2. Market Revenue and Volume Forecast, by Wafer Size

14.3.13.3. Market Revenue and Volume Forecast, by Process Technology Node

14.3.13.4. Market Revenue and Volume Forecast, by End-Use Device Type

14.3.13.5. Market Revenue and Volume Forecast, by Fab Type

14.3.13.6. Market Revenue and Volume Forecast, by Application Sector

14.4. MEA

14.4.1. Market Revenue and Volume Forecast, by Equipment Type

14.4.2. Market Revenue and Volume Forecast, by Wafer Size

14.4.3. Market Revenue and Volume Forecast, by Process Technology Node

14.4.4. Market Revenue and Volume Forecast, by End-Use Device Type

14.4.5. Market Revenue and Volume Forecast, by Fab Type

14.4.6. Market Revenue and Volume Forecast, by Application Sector

14.4.7. GCC

14.4.7.1. Market Revenue and Volume Forecast, by Equipment Type

14.4.7.2. Market Revenue and Volume Forecast, by Wafer Size

14.4.7.3. Market Revenue and Volume Forecast, by Process Technology Node

14.4.7.4. Market Revenue and Volume Forecast, by End-Use Device Type

14.4.8. Market Revenue and Volume Forecast, by Fab Type

14.4.9. Market Revenue and Volume Forecast, by Application Sector

14.4.10. North Africa

14.4.10.1. Market Revenue and Volume Forecast, by Equipment Type

14.4.10.2. Market Revenue and Volume Forecast, by Wafer Size

14.4.10.3. Market Revenue and Volume Forecast, by Process Technology Node

14.4.10.4. Market Revenue and Volume Forecast, by End-Use Device Type

14.4.11. Market Revenue and Volume Forecast, by Fab Type

14.4.12. Market Revenue and Volume Forecast, by Application Sector

14.4.13. South Africa

14.4.13.1. Market Revenue and Volume Forecast, by Equipment Type

14.4.13.2. Market Revenue and Volume Forecast, by Wafer Size

14.4.13.3. Market Revenue and Volume Forecast, by Process Technology Node

14.4.13.4. Market Revenue and Volume Forecast, by End-Use Device Type

14.4.13.5. Market Revenue and Volume Forecast, by Fab Type

14.4.13.6. Market Revenue and Volume Forecast, by Application Sector

14.4.14. Rest of MEA

14.4.14.1. Market Revenue and Volume Forecast, by Equipment Type

14.4.14.2. Market Revenue and Volume Forecast, by Wafer Size

14.4.14.3. Market Revenue and Volume Forecast, by Process Technology Node

14.4.14.4. Market Revenue and Volume Forecast, by End-Use Device Type

14.4.14.5. Market Revenue and Volume Forecast, by Fab Type

14.4.14.6. Market Revenue and Volume Forecast, by Application Sector

14.5. Latin America

14.5.1. Market Revenue and Volume Forecast, by Equipment Type

14.5.2. Market Revenue and Volume Forecast, by Wafer Size

14.5.3. Market Revenue and Volume Forecast, by Process Technology Node

14.5.4. Market Revenue and Volume Forecast, by End-Use Device Type

14.5.5. Market Revenue and Volume Forecast, by Fab Type

14.5.6. Market Revenue and Volume Forecast, by Application Sector

14.5.7. Brazil

14.5.7.1. Market Revenue and Volume Forecast, by Equipment Type

14.5.7.2. Market Revenue and Volume Forecast, by Wafer Size

14.5.7.3. Market Revenue and Volume Forecast, by Process Technology Node

14.5.7.4. Market Revenue and Volume Forecast, by End-Use Device Type

14.5.8. Market Revenue and Volume Forecast, by Fab Type

14.5.8.1. Market Revenue and Volume Forecast, by Application Sector

14.5.9. Rest of LATAM

14.5.9.1. Market Revenue and Volume Forecast, by Equipment Type

14.5.9.2. Market Revenue and Volume Forecast, by Wafer Size

14.5.9.3. Market Revenue and Volume Forecast, by Process Technology Node

14.5.9.4. Market Revenue and Volume Forecast, by End-Use Device Type

14.5.9.5. Market Revenue and Volume Forecast, by Fab Type

14.5.9.6. Market Revenue and Volume Forecast, by Application Sector

Chapter 15. Company Profiles

15.1. ASML Holding N.V.

15.1.1. Company Overview

15.1.2. Product Offerings

15.1.3. Financial Performance

15.1.4. Recent Initiatives

15.2. Tokyo Electron Limited (TEL)

15.2.1. Company Overview

15.2.2. Product Offerings

15.2.3. Financial Performance

15.2.4. Recent Initiatives

15.3. Plasma-Therm LLC

15.3.1. Company Overview

15.3.2. Product Offerings

15.3.3. Financial Performance

15.3.4. Recent Initiatives

15.4. Oxford Instruments plc

15.4.1. Company Overview

15.4.2. Product Offerings

15.4.3. Financial Performance

15.4.4. Recent Initiatives

15.5. EV Group (EVG)

15.5.1. Company Overview

15.5.2. Product Offerings

15.5.3. Financial Performance

15.5.4. Recent Initiatives

15.6. Plasma-Therm LLC

15.6.1. Company Overview

15.6.2. Product Offerings

15.6.3. Financial Performance

15.6.4. Recent Initiatives

15.7. ASM International N.V.

15.7.1. Company Overview

15.7.2. Product Offerings

15.7.3. Financial Performance

15.7.4. Recent Initiatives

15.8. Tokyo Electron Limited (TEL)

15.8.1. Company Overview

15.8.2. Product Offerings

15.8.3. Financial Performance

15.8.4. Recent Initiatives

15.9. KLA Corporation

15.9.1. Company Overview

15.9.2. Product Offerings

15.9.3. Financial Performance

15.9.4. Recent Initiatives

15.10. Lam Research Corporation

15.10.1. Company Overview

15.10.2. Product Offerings

15.10.3. Financial Performance

15.10.4. Recent Initiatives

Chapter 16. Research Methodology

16.1. Primary Research

16.2. Secondary Research

16.3. Assumptions

Chapter 17. Appendix

17.1. About Us

17.2. Glossary of Terms

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Frequently Asked Questions

The semiconductor wafer fab equipment market size is expected to increase from USD 19.25 billion in 2024 to USD 33.01 billion by 2034.

The semiconductor wafer fab equipment market is expected to grow at a compound annual growth rate (CAGR) of around 5.54% from 2025 to 2034.

The major players in the semiconductor wafer fab equipment market include ASML Holding N.V., Applied Materials, Inc., Lam Research Corporation, Tokyo Electron Limited (TEL), KLA Corporation, SCREEN Semiconductor Solutions Co., Ltd., Hitachi High-Tech Corporation, Canon Inc., Nikon Corporation, Advantest Corporation, Teradyne, Inc., ASM International N.V., Plasma-Therm LLC, EV Group (EVG), Naura Technology Group Co., Ltd., AMEC (Advanced Micro-Fabrication Equipment Inc.), Oxford Instruments plc, Veeco Instruments Inc., Tokyo Seimitsu Co., Ltd. (Accretech), and Ultratech (subsidiary of Veeco).

The driving factors of the semiconductor wafer fab equipment market are the rapid shift toward advanced node technologies is driving the growth of the semiconductor wafer fab equipment market

Asia Pacific region will lead the global semiconductor wafer fab equipment market during the forecast period 2025 to 2034.