Semiconductor Manufacturing Market Size, Share, and Trends 2025 to 2034

Semiconductor Manufacturing Market (By Process: Wafer Fabrication, Photolithography, Etching & Deposition, Doping & Ion Implantation, Assembly & Packaging, Testing & Inspection; By Technology Node: 28nm, 14–28nm, 10–14nm, 7nm, 5nm, 3nm & Below; By Material: Silicon, Silicon Carbide, Gallium Nitride, Germanium, Other Compound Semiconductors; By Equipment Type: Lithography Equipment, Deposition Equipment, Etching Equipment, Cleaning Equipment, Chemical Mechanical Planarization Tools, Testing & Inspection Systems, Assembly & Packaging Equipment; By End-Use Industry: Consumer Electronics, Automotive & Transportation, Telecommunications, Industrial Automation, Healthcare & Medical Devices, Aerospace & Defense;) - Global Industry Analysis, Size, Trends, Leading Companies, Regional Outlook, and Forecast 2025 to 2034

Last Updated : September 2025  |  Report Code : 6818  |  Category : Semiconductor and Electronic  |  Format : PDF / PPT / Excel

Chapter 1. Introduction

1.1. Research Objective

1.2. Scope of the Study

1.3. Definition

Chapter 2. Research Methodology 

2.1. Research Approach

2.2. Data Sources

2.3. Assumptions & Limitations

Chapter 3. Executive Summary

3.1. Market Snapshot

Chapter 4. Market Variables and Scope 

4.1. Introduction

4.2. Market Classification and Scope

4.3. Industry Value Chain Analysis

4.3.1. Raw Material Procurement Analysis 

4.3.2. Sales and Distribution Channel Analysis

4.3.3. Downstream Buyer Analysis

Chapter 5. COVID 19 Impact on Semiconductor Manufacturing Market 

5.1. COVID-19 Landscape: Semiconductor Manufacturing Industry Impact

5.2. COVID 19 - Impact Assessment for the Industry

5.3. COVID 19 Impact: Global Major Government Policy

5.4. Market Trends and Opportunities in the COVID-19 Landscape

6.1. Market Dynamics

6.1.1. Market Drivers

6.1.2. Market Restraints

6.1.3. Market Opportunities

6.2. Porter’s Five Forces Analysis

6.2.1. Bargaining power of suppliers

6.2.2. Bargaining power of buyers

6.2.3. Threat of substitute

6.2.4. Threat of new entrants

6.2.5. Degree of competition

Chapter 7. Competitive Landscape

7.1.1. Company Market Share/Positioning Analysis

7.1.2. Key Strategies Adopted by Players

7.1.3. Vendor Landscape

7.1.3.1. List of Suppliers

7.1.3.2. List of Buyers

Chapter 8. Global Semiconductor Manufacturing Market, By Process

8.1. Semiconductor Manufacturing Market, by Process

8.1.1. Wafer Fabrication

8.1.1.1. Market Revenue and Forecast

8.1.2. Photolithography

8.1.2.1. Market Revenue and Forecast

8.1.3. Etching & Deposition

8.1.3.1. Market Revenue and Forecast

8.1.4. Doping & Ion Implantation

8.1.4.1. Market Revenue and Forecast

8.1.5. Assembly & Packaging

8.1.5.1. Market Revenue and Forecast

8.1.6. Testing & Inspection

8.1.6.1. Market Revenue and Forecast

Chapter 9. Global Semiconductor Manufacturing Market, By Technology Node

9.1. Semiconductor Manufacturing Market, by Technology Node

9.1.1. 28nm

9.1.1.1. Market Revenue and Forecast

9.1.2. 14–28nm

9.1.2.1. Market Revenue and Forecast

9.1.3. 10–14nm

9.1.3.1. Market Revenue and Forecast

9.1.4. 7nm

9.1.4.1. Market Revenue and Forecast

9.1.5. 5nm

9.1.5.1. Market Revenue and Forecast

9.1.6. 3nm & Below (Emerging)

9.1.6.1. Market Revenue and Forecast

Chapter 10. Global Semiconductor Manufacturing Market, By Material 

10.1. Semiconductor Manufacturing Market, by Material

10.1.1. Silicon (Conventional)

10.1.1.1. Market Revenue and Forecast

10.1.2. Silicon Carbide (SiC)

10.1.2.1. Market Revenue and Forecast

10.1.3. Gallium Nitride (GaN)

10.1.3.1. Market Revenue and Forecast

10.1.4. Germanium

10.1.4.1. Market Revenue and Forecast

10.1.5. Other Compound Semiconductors

10.1.5.1. Market Revenue and Forecast

Chapter 11. Global Semiconductor Manufacturing Market, By Equipment Type

11.1. Semiconductor Manufacturing Market, by Equipment Type

11.1.1. Lithography Equipment (EUV, DUV)

11.1.1.1. Market Revenue and Forecast

11.1.2. Deposition Equipment (CVD, PVD, ALD)

11.1.2.1. Market Revenue and Forecast

11.1.3. Etching Equipment

11.1.3.1. Market Revenue and Forecast

11.1.4. Cleaning Equipment

11.1.4.1. Market Revenue and Forecast

11.1.5. Testing & Inspection Systems

11.1.5.1. Market Revenue and Forecast

11.1.6. Chemical Mechanical Planarization (CMP) Tools

11.1.6.1. Market Revenue and Forecast

11.1.7. Assembly & Packaging Equipment

11.1.7.1. Market Revenue and Forecast

Chapter 12. Global Semiconductor Manufacturing Market, By End-Use Industry

12.1. Semiconductor Manufacturing Market, by End-Use Industry

12.1.1. Consumer Electronics

12.1.1.1. Market Revenue and Forecast

12.1.2. Automotive & Transportation (EVs, ADAS, Infotainment)

12.1.2.1. Market Revenue and Forecast

12.1.3. Telecommunications (5G, Data Centers)

12.1.3.1. Market Revenue and Forecast

12.1.4. Industrial Automation

12.1.4.1. Market Revenue and Forecast

12.1.5. Healthcare & Medical Devices

12.1.5.1. Market Revenue and Forecast

12.1.6. Aerospace & Defense

12.1.6.1. Market Revenue and Forecast

Chapter 13. Global Semiconductor Manufacturing Market, Regional Estimates and Trend Forecast

13.1. North America

13.1.1. Market Revenue and Forecast, by Process

13.1.2. Market Revenue and Forecast, by Technology Node

13.1.3. Market Revenue and Forecast, by Material

13.1.4. Market Revenue and Forecast, by Equipment Type

13.1.5. Market Revenue and Forecast, by End-Use Industry

13.1.6. U.S.

13.1.6.1. Market Revenue and Forecast, by Process

13.1.6.2. Market Revenue and Forecast, by Technology Node

13.1.6.3. Market Revenue and Forecast, by Material

13.1.6.4. Market Revenue and Forecast, by Equipment Type

13.1.6.5. Market Revenue and Forecast, by End-Use Industry  

13.1.7. Rest of North America

13.1.7.1. Market Revenue and Forecast, by Process

13.1.7.2. Market Revenue and Forecast, by Technology Node

13.1.7.3. Market Revenue and Forecast, by Material

13.1.7.4. Market Revenue and Forecast, by Equipment Type

13.1.7.5. Market Revenue and Forecast, by End-Use Industry

13.2. Europe

13.2.1. Market Revenue and Forecast, by Process

13.2.2. Market Revenue and Forecast, by Technology Node

13.2.3. Market Revenue and Forecast, by Material

13.2.4. Market Revenue and Forecast, by Equipment Type  

13.2.5. Market Revenue and Forecast, by End-Use Industry  

13.2.6. UK

13.2.6.1. Market Revenue and Forecast, by Process

13.2.6.2. Market Revenue and Forecast, by Technology Node

13.2.6.3. Market Revenue and Forecast, by Material

13.2.7. Market Revenue and Forecast, by Equipment Type  

13.2.8. Market Revenue and Forecast, by End-Use Industry  

13.2.9. Germany

13.2.9.1. Market Revenue and Forecast, by Process

13.2.9.2. Market Revenue and Forecast, by Technology Node

13.2.9.3. Market Revenue and Forecast, by Material

13.2.10. Market Revenue and Forecast, by Equipment Type

13.2.11. Market Revenue and Forecast, by End-Use Industry

13.2.12. France

13.2.12.1. Market Revenue and Forecast, by Process

13.2.12.2. Market Revenue and Forecast, by Technology Node

13.2.12.3. Market Revenue and Forecast, by Material

13.2.12.4. Market Revenue and Forecast, by Equipment Type

13.2.13. Market Revenue and Forecast, by End-Use Industry

13.2.14. Rest of Europe

13.2.14.1. Market Revenue and Forecast, by Process

13.2.14.2. Market Revenue and Forecast, by Technology Node

13.2.14.3. Market Revenue and Forecast, by Material

13.2.14.4. Market Revenue and Forecast, by Equipment Type

13.2.15. Market Revenue and Forecast, by End-Use Industry

13.3. APAC

13.3.1. Market Revenue and Forecast, by Process

13.3.2. Market Revenue and Forecast, by Technology Node

13.3.3. Market Revenue and Forecast, by Material

13.3.4. Market Revenue and Forecast, by Equipment Type

13.3.5. Market Revenue and Forecast, by End-Use Industry

13.3.6. India

13.3.6.1. Market Revenue and Forecast, by Process

13.3.6.2. Market Revenue and Forecast, by Technology Node

13.3.6.3. Market Revenue and Forecast, by Material

13.3.6.4. Market Revenue and Forecast, by Equipment Type

13.3.7. Market Revenue and Forecast, by End-Use Industry

13.3.8. China

13.3.8.1. Market Revenue and Forecast, by Process

13.3.8.2. Market Revenue and Forecast, by Technology Node

13.3.8.3. Market Revenue and Forecast, by Material

13.3.8.4. Market Revenue and Forecast, by Equipment Type

13.3.9. Market Revenue and Forecast, by End-Use Industry

13.3.10. Japan

13.3.10.1. Market Revenue and Forecast, by Process

13.3.10.2. Market Revenue and Forecast, by Technology Node

13.3.10.3. Market Revenue and Forecast, by Material

13.3.10.4. Market Revenue and Forecast, by Equipment Type

13.3.10.5. Market Revenue and Forecast, by End-Use Industry

13.3.11. Rest of APAC

13.3.11.1. Market Revenue and Forecast, by Process

13.3.11.2. Market Revenue and Forecast, by Technology Node

13.3.11.3. Market Revenue and Forecast, by Material

13.3.11.4. Market Revenue and Forecast, by Equipment Type

13.3.11.5. Market Revenue and Forecast, by End-Use Industry

13.4. MEA

13.4.1. Market Revenue and Forecast, by Process

13.4.2. Market Revenue and Forecast, by Technology Node

13.4.3. Market Revenue and Forecast, by Material

13.4.4. Market Revenue and Forecast, by Equipment Type

13.4.5. Market Revenue and Forecast, by End-Use Industry

13.4.6. GCC

13.4.6.1. Market Revenue and Forecast, by Process

13.4.6.2. Market Revenue and Forecast, by Technology Node

13.4.6.3. Market Revenue and Forecast, by Material

13.4.6.4. Market Revenue and Forecast, by Equipment Type

13.4.7. Market Revenue and Forecast, by End-Use Industry

13.4.8. North Africa

13.4.8.1. Market Revenue and Forecast, by Process

13.4.8.2. Market Revenue and Forecast, by Technology Node

13.4.8.3. Market Revenue and Forecast, by Material

13.4.8.4. Market Revenue and Forecast, by Equipment Type

13.4.9. Market Revenue and Forecast, by End-Use Industry

13.4.10. South Africa

13.4.10.1. Market Revenue and Forecast, by Process

13.4.10.2. Market Revenue and Forecast, by Technology Node

13.4.10.3. Market Revenue and Forecast, by Material

13.4.10.4. Market Revenue and Forecast, by Equipment Type

13.4.10.5. Market Revenue and Forecast, by End-Use Industry

13.4.11. Rest of MEA

13.4.11.1. Market Revenue and Forecast, by Process

13.4.11.2. Market Revenue and Forecast, by Technology Node

13.4.11.3. Market Revenue and Forecast, by Material

13.4.11.4. Market Revenue and Forecast, by Equipment Type

13.4.11.5. Market Revenue and Forecast, by End-Use Industry

13.5. Latin America

13.5.1. Market Revenue and Forecast, by Process

13.5.2. Market Revenue and Forecast, by Technology Node

13.5.3. Market Revenue and Forecast, by Material

13.5.4. Market Revenue and Forecast, by Equipment Type

13.5.5. Market Revenue and Forecast, by End-Use Industry

13.5.6. Brazil

13.5.6.1. Market Revenue and Forecast, by Process

13.5.6.2. Market Revenue and Forecast, by Technology Node

13.5.6.3. Market Revenue and Forecast, by Material

13.5.6.4. Market Revenue and Forecast, by Equipment Type

13.5.7. Market Revenue and Forecast, by End-Use Industry

13.5.8. Rest of LATAM

13.5.8.1. Market Revenue and Forecast, by Process

13.5.8.2. Market Revenue and Forecast, by Technology Node

13.5.8.3. Market Revenue and Forecast, by Material

13.5.8.4. Market Revenue and Forecast, by Equipment Type

13.5.8.5. Market Revenue and Forecast, by End-Use Industry

Chapter 14. Company Profiles

14.1. Taiwan Semiconductor Manufacturing Company (TSMC)

14.1.1. Company Overview

14.1.2. Product Offerings

14.1.3. Financial Performance

14.1.4. Recent Initiatives

14.2. Intel Corporation

14.2.1. Company Overview

14.2.2. Product Offerings

14.2.3. Financial Performance

14.2.4. Recent Initiatives

14.3. Samsung Electronics Co., Ltd.

14.3.1. Company Overview

14.3.2. Product Offerings

14.3.3. Financial Performance

14.3.4. Recent Initiatives

14.4. GlobalFoundries Inc.

14.4.1. Company Overview

14.4.2. Product Offerings

14.4.3. Financial Performance

14.4.4. Recent Initiatives

14.5. United Microelectronics Corporation (UMC)

14.5.1. Company Overview

14.5.2. Product Offerings

14.5.3. Financial Performance

14.5.4. Recent Initiatives

14.6. Semiconductor Manufacturing International Corporation (SMIC)

14.6.1. Company Overview

14.6.2. Product Offerings

14.6.3. Financial Performance

14.6.4. Recent Initiatives

14.7. Texas Instruments Incorporated

14.7.1. Company Overview

14.7.2. Product Offerings

14.7.3. Financial Performance

14.7.4. Recent Initiatives

14.8. Micron Technology, Inc.

14.8.1. Company Overview

14.8.2. Product Offerings

14.8.3. Financial Performance

14.8.4. Recent Initiatives

14.9. Applied Materials, Inc.

14.9.1. Company Overview

14.9.2. Product Offerings

14.9.3. Financial Performance

14.9.4. Recent Initiatives

14.10. ASML Holding N.V.

14.10.1. Company Overview

14.10.2. Product Offerings

14.10.3. Financial Performance

14.10.4. Recent Initiatives

Chapter 15. Research Methodology

15.1. Primary Research

15.2. Secondary Research

15.3. Assumptions

Chapter 16. Appendix

16.1. About Us

16.2. Glossary of Terms

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Frequently Asked Questions

The major players in the semiconductor manufacturing market include Taiwan Semiconductor Manufacturing Company (TSMC), Intel Corporation, Samsung Electronics Co., Ltd., GlobalFoundries Inc., United Microelectronics Corporation (UMC), Semiconductor Manufacturing International Corporation (SMIC), Texas Instruments Incorporated, Micron Technology, Inc., Applied Materials, Inc., ASML Holding N.V., Lam Research Corporation, KLA Corporation, Tokyo Electron Limited, Broadcom Inc., and Infineon Technologies AG.

The driving factors of the semiconductor manufacturing market are the Rising global digitization, electrification of mobility, and the proliferation of IoT device.

Asia Pacific region will lead the global semiconductor manufacturing market during the forecast period 2025 to 2034.

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