Copper Sputtering Target Market Size To Attain USD 1,483.3 Million By 2032

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14 Aug 2023

Table of Content

The global copper sputtering target market size was evaluated at USD 915 million in 2022 and is expected to attain around USD 1,483.3 million by 2032, growing at a CAGR of 5% from 2023 to 2032.

Sputtering is a method of thinly depositing a very pure metallic or oxide substance onto another solid material. The development of copper sputtering targets with low electric resistance is now underway for the component capable of high-speed computer operation. The copper sputtering target's typical grain size is about 30 m, and to ensure uniformity in the thin layer that is formed, 17% of the inhomogeneity is deposited by annealing at a temperature of 0.4 Tm. In the copper sputtering target procedure, gases such as neon, krypton, xenon, and argon are employed. Copper sputtering targets are reproducible and may be mounted up from research and development projects to production groups, including large to medium substrate regions, for efficient energy projected to target mass.

There is a momentum transfer when atoms of the target material collide with high-energy ions. Sometimes there are several collisions. The ions can occasionally lose energy when travelling over great distances. If the ion energy is higher than the bonding energy between the atoms of the target material when it reaches the target, the colliding atoms will detach from the target material, this phenomenon is  known as spluttering. Moreover, the target is covered in thin layers that range in thickness from a few nanometers to a few micrometres, deposition method is known as copper sputtering. The gaseous atoms detach from the target substance. These thermodynamically unstable atoms often live on a surface in a vacuum environment. The atoms on the target create a thin film, a layer just a few micrometres thick. Copper sputtering targets are used in the semiconductor and solar industries to create solar cells and other electrical devices.

Report Highlights:

• Segment Type: Ultra-high copper sputtering target uses 99.99% copper for the coating which is mainly used for ICs, photovoltaics, transistors and semiconductor devices.
• Regional Type: North America is anticipated to have significant growth in the worldwide copper-sputtering target market. North America dominated the industry with a market share of almost 50% in terms of sales in 2017.
• Application Type: The development of electronic goods with high strength, superior performance, and extended product lives for customers requires the long-lasting coating of a thin film layer especially, for electronic goods used in the production of DVDs, CDs, tablets, and other items.

Regional Snapshots:

The region with the largest share of the global copper-sputtering target market is predicted to be North America, followed by Asia-Pacific. Additionally, the prevalence of both well-established and emerging businesses that provide copper sputtering targets, as well as the growth in semiconductor use, are the main factors driving the growth in the region. In addition, it is predicted that the Asia-Pacific market will expand at the fastest rate during the forecast period. The regional copper sputtering target market is expected to expand as a result of the rising need for semiconductors and electrical products in the electronic and semiconductor industry. The development possibilities for the copper-sputtering target market are also primarily attributed to the region's important economies, which include China, Japan, and India.

Copper Sputtering Target Market Report Scope:

Market Dynamics:

Market Driver:

Increased use of copper as a sputtering target for semiconductor chips will fuel industry expansion

The use of copper-sputtering targets for semiconductor devices is predicted to rise during the time of the projection, fueling expansion in the global market for copper-sputtering targets. The sputtering target is used to create the barrier layer and the packaging metal wiring layer. The metal grid, barrier layer, and conductive layer of the wafer are produced largely using the target material throughout the wafer manufacturing process.

Using the sputtering target material, the chip packaging method produces the wiring layer, the metal layer behind the bump, and other metal parts. Despite the small number of target materials used in wafer manufacturing and chip packaging, according to SEMI figures, their cost accounts for around 3% of the total cost of the wafer manufacturing and packaging process. Sputtering target materials are one of the primary raw materials used in the production of semiconductors because they directly affect the uniformity and performance of the conductive layer and barrier layer as well as chip transmission speed and stability

Market Restraint:

The market's growth is hampered by the challenge of uniformly setting targets for complicated structures.

Two of the major obstacles for the worldwide copper sputtering business are the inability to reliably place targets with complex geometries and the sluggish deposition rate for specific materials in the sputtering target technology. The technological advancements and innovations produced by both established and up coming producers in the copper-sputtering target market are also expected to hasten the resolution of these issues.

Market Opportunity:

Consumer electronics semiconductor advancements offer a significant prospect for market expansion

The development of semiconductors for consumer devices like smartphones, tablets, and laptops is likely to assist the growth of the global copper-sputtering target market during the forecasted period. For instance, IBM introduced strides in the design and manufacturing of semiconductors in May 2021 when it unveiled the first chip in the world to use 2 nm Nano sheet technology. Almost every area of modern life uses semiconductors, including computing, appliances, communications, transportation, and essential infrastructure. Improved chip performance and energy efficiency are in high demand, especially in the era of hybrid clouds, AI, and the Internet of Things. IBM has created cutting-edge 2-nanometer chip technology to help the semiconductor industry keep up with this growing demand. It is projected to perform 45% better or consume 75% less energy than the most recent 7 nm node products. As a result, these improvements in the business offer a lucrative opportunity for market expansion.

Market Challenges:

• At low pressure, the sputtered atoms move through the reactor with minimal collisions and eventually reach the wafer; at high pressure, the transport becomes diffusive and the metal atoms can be ionized.
• The deposition rate is slowed down by a diffusive loss mechanism for atoms to the walls, which is caused by the pressure increase.
• Sputtering from the coils may shorten their lifespan, but the difference between sputtering and deposition onto the coils will ultimately determine the overall erosion rate.

Key Developments:

Although the aircraft industry's expansion dominates supply/demand dynamics in this metal sector, titanium metal supply remains constant. Tantalum is mostly obtained through lithium mining, and in the years ahead, tantalum ore may be in excess due to increased lithium mine production required to meet the demand for electric car batteries.

Sputtered Nb3Sn films are being created for superconducting Radiofrequency applications on copper substrates by synthesising a thin layer inside niobium or copper cavity

Major Key Players:

• KFMI
• Honeywell Electronic Materials
• JX Nippon
• Praxair
• KJLC
• Tosoh
• China New Metal Materials
• KJLC
• Sumitomo Chemical Com-pang
• KJLC
• Plansee
• CXMET

Market Segmentation:

By Technique

• Copper sputtering target with low purity
• Copper sputtering target with high purity
• Ultra-high copper sputtering

By Application  

• Semiconductors
• Solar Cells
• LCD Displays
• Others

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