Active Electronic Components Market (By Product Type: Semiconductor Devices (Transistors, Diodes, Optoelectronic components, and Integrated Circuits) and Display Devices (Cathode-ray Tubes, Microwave Tubes, X-ray Tubes, Triodes, and Photoelectric Tubes), and Other Devices) - Global Market Size, Trends Analysis, Segment Forecasts, Regional Outlook 2020 - 2027

Chapter 1. Introduction

1.1. Research Objective
1.2. Scope of the Study
1.3. Definition

Chapter 2. Research Methodology

2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations

Chapter 3. Executive Summary

3.1. Market Snapshot

Chapter 4. Market Variables and Scope

4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis

Chapter 5. Market Dynamics Analysis and Trends

5.1. Market Dynamics
5.1.1. Market Drivers
5.1.2. Market Restraints
5.1.3. Market Opportunities
5.2. Porter’s Five Forces Analysis
5.2.1. Bargaining power of suppliers
5.2.2. Bargaining power of buyers
5.2.3. Threat of substitute
5.2.4. Threat of new entrants
5.2.5. Degree of competition

Chapter 6. Competitive Landscape

6.1.1. Company Market Share/Positioning Analysis
6.1.2. Key Strategies Adopted by Players
6.1.3. Vendor Landscape
6.1.3.1. List of Suppliers
6.1.3.2. List of Buyers

Chapter 7. Global Active Electronic Components Market, By Product

7.1. Active Electronic Components Market, by Product Type, 2020-2027
7.1.1. Semiconductor Devices
7.1.1.1. Transistors
7.1.1.2. Diodes
7.1.1.3. Optoelectronic Components
7.1.1.4. Integrated Circuits
7.1.1.5. Market Revenue and Forecast (2016-2027)
7.1.2. Display Devices
7.1.2.1. Cathode-ray Tubes
7.1.2.2. Microwave Tubes
7.1.2.3. X-ray Tubes
7.1.2.4. Triodes
7.1.2.5. Photoelectric Tubes
7.1.2.6. Market Revenue and Forecast (2016-2027)
7.1.3. Other Devices
7.1.3.1. Market Revenue and Forecast (2016-2027)

Chapter 8. Global Active Electronic Components Market, Regional Estimates and Trend Forecast

8.1. North America
8.1.1. Market Revenue and Forecast, by Product (2016-2027)
8.1.2. U.S.
8.1.3. Rest of North America
8.1.3.1. Market Revenue and Forecast, by Product (2016-2027)
8.2. Europe
8.2.1. Market Revenue and Forecast, by Product (2016-2027)
8.2.2. UK
8.2.2.1. Market Revenue and Forecast, by Product (2016-2027)
8.2.3. France
8.2.3.1. Market Revenue and Forecast, by Product (2016-2027)
8.2.4. Rest of Europe
8.2.4.1. Market Revenue and Forecast, by Product (2016-2027)
8.3. APAC
8.3.1. Market Revenue and Forecast, by Product (2016-2027)
8.3.2. India
8.3.2.1. Market Revenue and Forecast, by Product (2016-2027)
8.3.3. China
8.3.3.1. Market Revenue and Forecast, by Product (2016-2027)
8.3.4. Japan
8.3.4.1. Market Revenue and Forecast, by Product (2016-2027)
8.3.5. Rest of APAC
8.3.5.1. Market Revenue and Forecast, by Product (2016-2027)
8.4. MEA
8.4.1. Market Revenue and Forecast, by Product (2016-2027)
8.4.2. GCC
8.4.2.1. Market Revenue and Forecast, by Product (2016-2027)
8.4.3. North Africa
8.4.3.1. Market Revenue and Forecast, by Product (2016-2027)
8.4.4. South Africa
8.4.4.1. Market Revenue and Forecast, by Product (2016-2027)
8.4.5. Rest of MEA
8.4.5.1. Market Revenue and Forecast, by Product (2016-2027)
8.5. Latin America
8.5.1. Market Revenue and Forecast, by Product (2016-2027)
8.5.2. Brazil
8.5.2.1. Market Revenue and Forecast, by Product (2016-2027)
8.5.3. Rest of LATAM
8.5.3.1. Market Revenue and Forecast, by Product (2016-2027)

Chapter 9. Company Profiles

9.1. Infineon Technologies AG
9.1.1. Company Overview
9.1.2. Product Offerings
9.1.3. Financial Performance
9.1.4. Recent Initiatives
9.2. Fairchild Semiconductor International, Inc.
9.2.1. Company Overview
9.2.2. Product Offerings
9.2.3. Financial Performance
9.2.4. Recent Initiatives
9.3. Maxim Integrated Products Inc.
9.3.1. Company Overview
9.3.2. Product Offerings
9.3.3. Financial Performance
9.3.4. Recent Initiatives
9.4. Texas Instruments, Inc.
9.4.1. Company Overview
9.4.2. Product Offerings
9.4.3. Financial Performance
9.4.4. Recent Initiatives
9.5. Analog Devices, Inc.
9.5.1. Company Overview
9.5.2. Product Offerings
9.5.3. Financial Performance
9.5.4. Recent Initiatives
9.6. ST Microelectronics NV
9.6.1. Company Overview
9.6.2. Product Offerings
9.6.3. Financial Performance
9.6.4. Recent Initiatives
9.7. Diotec Semiconductor AG
9.7.1. Company Overview
9.7.2. Product Offerings
9.7.3. Financial Performance
9.7.4. Recent Initiatives
9.8. ON Semiconductor
9.8.1. Company Overview
9.8.2. Product Offerings
9.8.3. Financial Performance
9.8.4. Recent Initiatives
9.9. Toshiba Corporation
9.9.1. Company Overview
9.9.2. Product Offerings
9.9.3. Financial Performance
9.9.4. Recent Initiatives
9.10. NXP Semiconductors NV
9.10.1. Company Overview
9.10.2. Product Offerings
9.10.3. Financial Performance
9.10.4. Recent Initiatives
9.11. Everlight Electronics Co., Ltd.
9.11.1. Company Overview
9.11.2. Product Offerings
9.11.3. Financial Performance
9.11.4. Recent Initiatives
9.12. Vishay Intertechnology, Inc.
9.12.1. Company Overview
9.12.2. Product Offerings
9.12.3. Financial Performance
9.12.4. Recent Initiatives
9.13. Renesas Electric Corporation
9.13.1. Company Overview
9.13.2. Product Offerings
9.13.3. Financial Performance
9.13.4. Recent Initiatives
9.14. Panasonic Corporation
9.14.1. Company Overview
9.14.2. Product Offerings
9.14.3. Financial Performance
9.14.4. Recent Initiatives


Chapter 10. Research Methodology

10.1. Primary Research
10.2. Secondary Research
10.3. Assumptions

Chapter 11. Appendix

11.1. About Us
11.2. Glossary of Terms

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