Chapter 1. Introduction

1.1. Research Objective

1.2. Scope of the Study

1.3. Definition

Chapter 2. Research Methodology

2.1. Research Approach

2.2. Data Sources

2.3. Assumptions & Limitations

Chapter 3. Executive Summary

3.1. Market Snapshot

Chapter 4. Market Variables and Scope 

4.1. Introduction

4.2. Market Classification and Scope

4.3. Industry Value Chain Analysis

4.3.1. Raw Material Procurement Analysis 

4.3.2. Sales and Distribution Channel Analysis

4.3.3. Downstream Buyer Analysis

Chapter 5. COVID 19 Impact on GaN Semiconductor Devices Market 

5.1. COVID-19 Landscape: GaN Semiconductor Devices Industry Impact

5.2. COVID 19 - Impact Assessment for the Industry

5.3. COVID 19 Impact: Global Major Government Policy

5.4. Market Trends and Opportunities in the COVID-19 Landscape

Chapter 6. Market Dynamics Analysis and Trends

6.1. Market Dynamics

6.1.1. Market Drivers

6.1.2. Market Restraints

6.1.3. Market Opportunities

6.2. Porter’s Five Forces Analysis

6.2.1. Bargaining power of suppliers

6.2.2. Bargaining power of buyers

6.2.3. Threat of substitute

6.2.4. Threat of new entrants

6.2.5. Degree of competition

Chapter 7. Competitive Landscape

7.1.1. Company Market Share/Positioning Analysis

7.1.2. Key Strategies Adopted by Players

7.1.3. Vendor Landscape

7.1.3.1. List of Suppliers

7.1.3.2. List of Buyers

Chapter 8. Global GaN Semiconductor Devices Market, By Product

8.1. GaN Semiconductor Devices Market, by Product, 2023-2032

8.1.1. GaN Radio Frequency Devices

8.1.1.1. Market Revenue and Forecast (2021-2032)

8.1.2. Opto-semiconductors

8.1.2.1. Market Revenue and Forecast (2021-2032)

8.1.3. Power Semiconductors

8.1.3.1. Market Revenue and Forecast (2021-2032)

Chapter 9. Global GaN Semiconductor Devices Market, By Component

9.1. GaN Semiconductor Devices Market, by Component, 2023-2032

9.1.1. Transistor

9.1.1.1. Market Revenue and Forecast (2021-2032)

9.1.2. Diode

9.1.2.1. Market Revenue and Forecast (2021-2032)

9.1.3. Rectifier

9.1.3.1. Market Revenue and Forecast (2021-2032)

9.1.4. Power IC

9.1.4.1. Market Revenue and Forecast (2021-2032)

9.1.5. Others

9.1.5.1. Market Revenue and Forecast (2021-2032)

Chapter 10. Global GaN Semiconductor Devices Market, By Wafer Size 

10.1. GaN Semiconductor Devices Market, by Wafer Size, 2023-2032

10.1.1. 2-inch

10.1.1.1. Market Revenue and Forecast (2021-2032)

10.1.2. 4-inch

10.1.2.1. Market Revenue and Forecast (2021-2032)

10.1.3. 6-inch

10.1.3.1. Market Revenue and Forecast (2021-2032)

10.1.4. 8-inch

10.1.4.1. Market Revenue and Forecast (2021-2032)

Chapter 11. Global GaN Semiconductor Devices Market, By End Use 

11.1. GaN Semiconductor Devices Market, by End Use, 2023-2032

11.1.1. Automotive

11.1.1.1. Market Revenue and Forecast (2021-2032)

11.1.2. Consumer Electronics

11.1.2.1. Market Revenue and Forecast (2021-2032)

11.1.3. Defense & Aerospace

11.1.3.1. Market Revenue and Forecast (2021-2032)

11.1.4. Healthcare

11.1.4.1. Market Revenue and Forecast (2021-2032)

11.1.5. Industrial & Power

11.1.5.1. Market Revenue and Forecast (2021-2032)

11.1.6. Information & Communication Technology

11.1.6.1. Market Revenue and Forecast (2021-2032)

11.1.7. Others

11.1.7.1. Market Revenue and Forecast (2021-2032)

Chapter 12. Global GaN Semiconductor Devices Market, Regional Estimates and Trend Forecast

12.1. North America

12.1.1. Market Revenue and Forecast, by Product (2021-2032)

12.1.2. Market Revenue and Forecast, by Component (2021-2032)

12.1.3. Market Revenue and Forecast, by Wafer Size (2021-2032)

12.1.4. Market Revenue and Forecast, by End Use (2021-2032)

12.1.5. U.S.

12.1.5.1. Market Revenue and Forecast, by Product (2021-2032)

12.1.5.2. Market Revenue and Forecast, by Component (2021-2032)

12.1.5.3. Market Revenue and Forecast, by Wafer Size (2021-2032)

12.1.5.4. Market Revenue and Forecast, by End Use (2021-2032)

12.1.6. Rest of North America

12.1.6.1. Market Revenue and Forecast, by Product (2021-2032)

12.1.6.2. Market Revenue and Forecast, by Component (2021-2032)

12.1.6.3. Market Revenue and Forecast, by Wafer Size (2021-2032)

12.1.6.4. Market Revenue and Forecast, by End Use (2021-2032)

12.2. Europe

12.2.1. Market Revenue and Forecast, by Product (2021-2032)

12.2.2. Market Revenue and Forecast, by Component (2021-2032)

12.2.3. Market Revenue and Forecast, by Wafer Size (2021-2032)

12.2.4. Market Revenue and Forecast, by End Use (2021-2032)

12.2.5. UK

12.2.5.1. Market Revenue and Forecast, by Product (2021-2032)

12.2.5.2. Market Revenue and Forecast, by Component (2021-2032)

12.2.5.3. Market Revenue and Forecast, by Wafer Size (2021-2032)

12.2.5.4. Market Revenue and Forecast, by End Use (2021-2032)

12.2.6. Germany

12.2.6.1. Market Revenue and Forecast, by Product (2021-2032)

12.2.6.2. Market Revenue and Forecast, by Component (2021-2032)

12.2.6.3. Market Revenue and Forecast, by Wafer Size (2021-2032)

12.2.6.4. Market Revenue and Forecast, by End Use (2021-2032)

12.2.7. France

12.2.7.1. Market Revenue and Forecast, by Product (2021-2032)

12.2.7.2. Market Revenue and Forecast, by Component (2021-2032)

12.2.7.3. Market Revenue and Forecast, by Wafer Size (2021-2032)

12.2.7.4. Market Revenue and Forecast, by End Use (2021-2032)

12.2.8. Rest of Europe

12.2.8.1. Market Revenue and Forecast, by Product (2021-2032)

12.2.8.2. Market Revenue and Forecast, by Component (2021-2032)

12.2.8.3. Market Revenue and Forecast, by Wafer Size (2021-2032)

12.2.8.4. Market Revenue and Forecast, by End Use (2021-2032)

12.3. APAC

12.3.1. Market Revenue and Forecast, by Product (2021-2032)

12.3.2. Market Revenue and Forecast, by Component (2021-2032)

12.3.3. Market Revenue and Forecast, by Wafer Size (2021-2032)

12.3.4. Market Revenue and Forecast, by End Use (2021-2032)

12.3.5. India

12.3.5.1. Market Revenue and Forecast, by Product (2021-2032)

12.3.5.2. Market Revenue and Forecast, by Component (2021-2032)

12.3.5.3. Market Revenue and Forecast, by Wafer Size (2021-2032)

12.3.5.4. Market Revenue and Forecast, by End Use (2021-2032)

12.3.6. China

12.3.6.1. Market Revenue and Forecast, by Product (2021-2032)

12.3.6.2. Market Revenue and Forecast, by Component (2021-2032)

12.3.6.3. Market Revenue and Forecast, by Wafer Size (2021-2032)

12.3.6.4. Market Revenue and Forecast, by End Use (2021-2032)

12.3.7. Japan

12.3.7.1. Market Revenue and Forecast, by Product (2021-2032)

12.3.7.2. Market Revenue and Forecast, by Component (2021-2032)

12.3.7.3. Market Revenue and Forecast, by Wafer Size (2021-2032)

12.3.7.4. Market Revenue and Forecast, by End Use (2021-2032)

12.3.8. Rest of APAC

12.3.8.1. Market Revenue and Forecast, by Product (2021-2032)

12.3.8.2. Market Revenue and Forecast, by Component (2021-2032)

12.3.8.3. Market Revenue and Forecast, by Wafer Size (2021-2032)

12.3.8.4. Market Revenue and Forecast, by End Use (2021-2032)

12.4. MEA

12.4.1. Market Revenue and Forecast, by Product (2021-2032)

12.4.2. Market Revenue and Forecast, by Component (2021-2032)

12.4.3. Market Revenue and Forecast, by Wafer Size (2021-2032)

12.4.4. Market Revenue and Forecast, by End Use (2021-2032)

12.4.5. GCC

12.4.5.1. Market Revenue and Forecast, by Product (2021-2032)

12.4.5.2. Market Revenue and Forecast, by Component (2021-2032)

12.4.5.3. Market Revenue and Forecast, by Wafer Size (2021-2032)

12.4.5.4. Market Revenue and Forecast, by End Use (2021-2032)

12.4.6. North Africa

12.4.6.1. Market Revenue and Forecast, by Product (2021-2032)

12.4.6.2. Market Revenue and Forecast, by Component (2021-2032)

12.4.6.3. Market Revenue and Forecast, by Wafer Size (2021-2032)

12.4.6.4. Market Revenue and Forecast, by End Use (2021-2032)

12.4.7. South Africa

12.4.7.1. Market Revenue and Forecast, by Product (2021-2032)

12.4.7.2. Market Revenue and Forecast, by Component (2021-2032)

12.4.7.3. Market Revenue and Forecast, by Wafer Size (2021-2032)

12.4.7.4. Market Revenue and Forecast, by End Use (2021-2032)

12.4.8. Rest of MEA

12.4.8.1. Market Revenue and Forecast, by Product (2021-2032)

12.4.8.2. Market Revenue and Forecast, by Component (2021-2032)

12.4.8.3. Market Revenue and Forecast, by Wafer Size (2021-2032)

12.4.8.4. Market Revenue and Forecast, by End Use (2021-2032)

12.5. Latin America

12.5.1. Market Revenue and Forecast, by Product (2021-2032)

12.5.2. Market Revenue and Forecast, by Component (2021-2032)

12.5.3. Market Revenue and Forecast, by Wafer Size (2021-2032)

12.5.4. Market Revenue and Forecast, by End Use (2021-2032)

12.5.5. Brazil

12.5.5.1. Market Revenue and Forecast, by Product (2021-2032)

12.5.5.2. Market Revenue and Forecast, by Component (2021-2032)

12.5.5.3. Market Revenue and Forecast, by Wafer Size (2021-2032)

12.5.5.4. Market Revenue and Forecast, by End Use (2021-2032)

12.5.6. Rest of LATAM

12.5.6.1. Market Revenue and Forecast, by Product (2021-2032)

12.5.6.2. Market Revenue and Forecast, by Component (2021-2032)

12.5.6.3. Market Revenue and Forecast, by Wafer Size (2021-2032)

12.5.6.4. Market Revenue and Forecast, by End Use (2021-2032)

Chapter 13. Company Profiles

13.1. Cree, Inc.

13.1.1. Company Overview

13.1.2. Product Offerings

13.1.3. Financial Performance

13.1.4. Recent Initiatives

13.2. Efficient Power Conversion Corporation

13.2.1. Company Overview

13.2.2. Product Offerings

13.2.3. Financial Performance

13.2.4. Recent Initiatives

13.3. Fujitsu Ltd.

13.3.1. Company Overview

13.3.2. Product Offerings

13.3.3. Financial Performance

13.3.4. Recent Initiatives

13.4. GaN Systems

13.4.1. Company Overview

13.4.2. Product Offerings

13.4.3. Financial Performance

13.4.4. Recent Initiatives

13.5. Infineon Technologies AG

13.5.1. Company Overview

13.5.2. Product Offerings

13.5.3. Financial Performance

13.5.4. Recent Initiatives

13.6. NexgenPowerSystems

13.6.1. Company Overview

13.6.2. Product Offerings

13.6.3. Financial Performance

13.6.4. Recent Initiatives

13.7. NXP Semiconductor

13.7.1. Company Overview

13.7.2. Product Offerings

13.7.3. Financial Performance

13.7.4. Recent Initiatives

13.8. Qorvo, Inc.

13.8.1. Company Overview

13.8.2. Product Offerings

13.8.3. Financial Performance

13.8.4. Recent Initiatives

13.9. Texas Instruments Incorporated

13.9.1. Company Overview

13.9.2. Product Offerings

13.9.3. Financial Performance

13.9.4. Recent Initiatives

13.10. Toshiba Corporation

13.10.1. Company Overview

13.10.2. Product Offerings

13.10.3. Financial Performance

13.10.4. Recent Initiatives

Chapter 14. Research Methodology

14.1. Primary Research

14.2. Secondary Research

14.3. Assumptions

Chapter 15. Appendix

15.1. About Us

15.2. Glossary of Terms