1.1. Research Objective
1.2. Scope of the Study
1.3. Definition
2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations
3.1. Market Snapshot
4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis
4.3.1. Raw Material Procurement Analysis
4.3.2. Sales and Distribution Channel Analysis
4.3.3. Downstream Buyer Analysis
5.1. COVID-19 Landscape: EFEM and Sorters Industry Impact
5.2. COVID 19 - Impact Assessment for the Industry
5.3. COVID 19 Impact: Global Major Government Policy
5.4. Market Trends and Opportunities in the COVID-19 Landscape
6.1. Market Dynamics
6.1.1. Market Drivers
6.1.2. Market Restraints
6.1.3. Market Opportunities
6.2. Porter’s Five Forces Analysis
6.2.1. Bargaining power of suppliers
6.2.2. Bargaining power of buyers
6.2.3. Threat of substitute
6.2.4. Threat of new entrants
6.2.5. Degree of competition
7.1.1. Company Market Share/Positioning Analysis
7.1.2. Key Strategies Adopted by Players
7.1.3. Vendor Landscape
7.1.3.1. List of Suppliers
7.1.3.2. List of Buyers
8.1. EFEM and Sorters Market Revenue and Volume, by Equipment Type
8.1.1. EFEM (Equipment Front-End Modules)
8.1.1.1. Market Revenue and Volume Forecast
8.1.2. Wafer Sorters
8.1.2.1. Market Revenue and Volume Forecast
8.1.3. Integrated EFEM + Sorter Systems
8.1.3.1. Market Revenue and Volume Forecast
8.1.4. Robotic Wafer Handling Arms
8.1.4.1. Market Revenue and Volume Forecast
8.1.5. Inspection and Metrology Modules (integrated into EFEM/sorters)
8.1.5.1. Market Revenue and Volume Forecast
9.1. EFEM and Sorters Market Revenue and Volume, by Wafer Size Compatibility
9.1.1. 200mm EFEMs and Sorters
9.1.1.1. Market Revenue and Volume Forecast
9.1.2. 300mm EFEMs and Sorters
9.1.2.1. Market Revenue and Volume Forecast
9.1.3. 450mm EFEMs and Sorters
9.1.3.1. Market Revenue and Volume Forecast
10.1. EFEM and Sorters Market Revenue and Volume, by Level of Automation
10.1.1. Manual/Semi-Automated
10.1.1.1. Market Revenue and Volume Forecast
10.1.2. Fully Automated
10.1.2.1. Market Revenue and Volume Forecast
10.1.3. Smart/Industry 4.0 Enabled (IoT, AI, Predictive Maintenance)
10.1.3.1. Market Revenue and Volume Forecast
11.1. EFEM and Sorters Market Revenue and Volume, by Application
11.1.1. Front-End Wafer Fabrication
11.1.1.1. Market Revenue and Volume Forecast
11.1.2. Wafer Testing and Inspection
11.1.2.1. Market Revenue and Volume Forecast
11.1.3. Packaging and Assembly
11.1.3.1. Market Revenue and Volume Forecast
11.1.4. R&D Labs and Pilot Lines
11.1.4.1. Market Revenue and Volume Forecast
12.1. EFEM and Sorters Market Revenue and Volume, by End-User
12.1.1. IDMs (Integrated Device Manufacturers)
12.1.1.1. Market Revenue and Volume Forecast
12.1.2. Foundries
12.1.2.1. Market Revenue and Volume Forecast
12.1.3. OSATs (Outsourced Semiconductor Assembly and Test)
12.1.3.1. Market Revenue and Volume Forecast
12.1.4. Research Institutes and Universities
12.1.4.1. Market Revenue and Volume Forecast
13.1. North America
13.1.1. Market Revenue and Volume Forecast, by Equipment Type
13.1.2. Market Revenue and Volume Forecast, by Wafer Size Compatibility
13.1.3. Market Revenue and Volume Forecast, by Level of Automation
13.1.4. Market Revenue and Volume Forecast, by Application
13.1.5. Market Revenue and Volume Forecast, by End-User
13.1.6. U.S.
13.1.6.1. Market Revenue and Volume Forecast, by Equipment Type
13.1.6.2. Market Revenue and Volume Forecast, by Wafer Size Compatibility
13.1.6.3. Market Revenue and Volume Forecast, by Level of Automation
13.1.6.4. Market Revenue and Volume Forecast, by Application
13.1.6.5. Market Revenue and Volume Forecast, by End-User
13.1.7. Rest of North America
13.1.7.1. Market Revenue and Volume Forecast, by Equipment Type
13.1.7.2. Market Revenue and Volume Forecast, by Wafer Size Compatibility
13.1.7.3. Market Revenue and Volume Forecast, by Level of Automation
13.1.7.4. Market Revenue and Volume Forecast, by Application
13.1.7.5. Market Revenue and Volume Forecast, by End-User
13.2. Europe
13.2.1. Market Revenue and Volume Forecast, by Equipment Type
13.2.2. Market Revenue and Volume Forecast, by Wafer Size Compatibility
13.2.3. Market Revenue and Volume Forecast, by Level of Automation
13.2.4. Market Revenue and Volume Forecast, by Application
13.2.5. Market Revenue and Volume Forecast, by End-User
13.2.6. UK
13.2.6.1. Market Revenue and Volume Forecast, by Equipment Type
13.2.6.2. Market Revenue and Volume Forecast, by Wafer Size Compatibility
13.2.6.3. Market Revenue and Volume Forecast, by Level of Automation
13.2.7. Market Revenue and Volume Forecast, by Application
13.2.8. Market Revenue and Volume Forecast, by End-User
13.2.9. Germany
13.2.9.1. Market Revenue and Volume Forecast, by Equipment Type
13.2.9.2. Market Revenue and Volume Forecast, by Wafer Size Compatibility
13.2.9.3. Market Revenue and Volume Forecast, by Level of Automation
13.2.10. Market Revenue and Volume Forecast, by Application
13.2.11. Market Revenue and Volume Forecast, by End-User
13.2.12. France
13.2.12.1. Market Revenue and Volume Forecast, by Equipment Type
13.2.12.2. Market Revenue and Volume Forecast, by Wafer Size Compatibility
13.2.12.3. Market Revenue and Volume Forecast, by Level of Automation
13.2.12.4. Market Revenue and Volume Forecast, by Application
13.2.13. Market Revenue and Volume Forecast, by End-User
13.2.14. Rest of Europe
13.2.14.1. Market Revenue and Volume Forecast, by Equipment Type
13.2.14.2. Market Revenue and Volume Forecast, by Wafer Size Compatibility
13.2.14.3. Market Revenue and Volume Forecast, by Level of Automation
13.2.14.4. Market Revenue and Volume Forecast, by Application
13.2.15. Market Revenue and Volume Forecast, by End-User
13.3. APAC
13.3.1. Market Revenue and Volume Forecast, by Equipment Type
13.3.2. Market Revenue and Volume Forecast, by Wafer Size Compatibility
13.3.3. Market Revenue and Volume Forecast, by Level of Automation
13.3.4. Market Revenue and Volume Forecast, by Application
13.3.5. Market Revenue and Volume Forecast, by End-User
13.3.6. India
13.3.6.1. Market Revenue and Volume Forecast, by Equipment Type
13.3.6.2. Market Revenue and Volume Forecast, by Wafer Size Compatibility
13.3.6.3. Market Revenue and Volume Forecast, by Level of Automation
13.3.6.4. Market Revenue and Volume Forecast, by Application
13.3.7. Market Revenue and Volume Forecast, by End-User
13.3.8. China
13.3.8.1. Market Revenue and Volume Forecast, by Equipment Type
13.3.8.2. Market Revenue and Volume Forecast, by Wafer Size Compatibility
13.3.8.3. Market Revenue and Volume Forecast, by Level of Automation
13.3.8.4. Market Revenue and Volume Forecast, by Application
13.3.9. Market Revenue and Volume Forecast, by End-User
13.3.10. Japan
13.3.10.1. Market Revenue and Volume Forecast, by Equipment Type
13.3.10.2. Market Revenue and Volume Forecast, by Wafer Size Compatibility
13.3.10.3. Market Revenue and Volume Forecast, by Level of Automation
13.3.10.4. Market Revenue and Volume Forecast, by Application
13.3.10.5. Market Revenue and Volume Forecast, by End-User
13.3.11. Rest of APAC
13.3.11.1. Market Revenue and Volume Forecast, by Equipment Type
13.3.11.2. Market Revenue and Volume Forecast, by Wafer Size Compatibility
13.3.11.3. Market Revenue and Volume Forecast, by Level of Automation
13.3.11.4. Market Revenue and Volume Forecast, by Application
13.3.11.5. Market Revenue and Volume Forecast, by End-User
13.4. MEA
13.4.1. Market Revenue and Volume Forecast, by Equipment Type
13.4.2. Market Revenue and Volume Forecast, by Wafer Size Compatibility
13.4.3. Market Revenue and Volume Forecast, by Level of Automation
13.4.4. Market Revenue and Volume Forecast, by Application
13.4.5. Market Revenue and Volume Forecast, by End-User
13.4.6. GCC
13.4.6.1. Market Revenue and Volume Forecast, by Equipment Type
13.4.6.2. Market Revenue and Volume Forecast, by Wafer Size Compatibility
13.4.6.3. Market Revenue and Volume Forecast, by Level of Automation
13.4.6.4. Market Revenue and Volume Forecast, by Application
13.4.7. Market Revenue and Volume Forecast, by End-User
13.4.8. North Africa
13.4.8.1. Market Revenue and Volume Forecast, by Equipment Type
13.4.8.2. Market Revenue and Volume Forecast, by Wafer Size Compatibility
13.4.8.3. Market Revenue and Volume Forecast, by Level of Automation
13.4.8.4. Market Revenue and Volume Forecast, by Application
13.4.9. Market Revenue and Volume Forecast, by End-User
13.4.10. South Africa
13.4.10.1. Market Revenue and Volume Forecast, by Equipment Type
13.4.10.2. Market Revenue and Volume Forecast, by Wafer Size Compatibility
13.4.10.3. Market Revenue and Volume Forecast, by Level of Automation
13.4.10.4. Market Revenue and Volume Forecast, by Application
13.4.10.5. Market Revenue and Volume Forecast, by End-User
13.4.11. Rest of MEA
13.4.11.1. Market Revenue and Volume Forecast, by Equipment Type
13.4.11.2. Market Revenue and Volume Forecast, by Wafer Size Compatibility
13.4.11.3. Market Revenue and Volume Forecast, by Level of Automation
13.4.11.4. Market Revenue and Volume Forecast, by Application
13.4.11.5. Market Revenue and Volume Forecast, by End-User
13.5. Latin America
13.5.1. Market Revenue and Volume Forecast, by Equipment Type
13.5.2. Market Revenue and Volume Forecast, by Wafer Size Compatibility
13.5.3. Market Revenue and Volume Forecast, by Level of Automation
13.5.4. Market Revenue and Volume Forecast, by Application
13.5.5. Market Revenue and Volume Forecast, by End-User
13.5.6. Brazil
13.5.6.1. Market Revenue and Volume Forecast, by Equipment Type
13.5.6.2. Market Revenue and Volume Forecast, by Wafer Size Compatibility
13.5.6.3. Market Revenue and Volume Forecast, by Level of Automation
13.5.6.4. Market Revenue and Volume Forecast, by Application
13.5.7. Market Revenue and Volume Forecast, by End-User
13.5.8. Rest of LATAM
13.5.8.1. Market Revenue and Volume Forecast, by Equipment Type
13.5.8.2. Market Revenue and Volume Forecast, by Wafer Size Compatibility
13.5.8.3. Market Revenue and Volume Forecast, by Level of Automation
13.5.8.4. Market Revenue and Volume Forecast, by Application
13.5.8.5. Market Revenue and Volume Forecast, by End-User
14.1. Brooks Automation (Azenta Life Sciences)
14.1.1. Company Overview
14.1.2. Product Offerings
14.1.3. Financial Performance
14.1.4. Recent Initiatives
14.2. Daifuku Co., Ltd.
14.2.1. Company Overview
14.2.2. Product Offerings
14.2.3. Financial Performance
14.2.4. Recent Initiatives
14.3. Hirata Corporation
14.3.1. Company Overview
14.3.2. Product Offerings
14.3.3. Financial Performance
14.3.4. Recent Initiatives
14.4. Kawasaki Robotics
14.4.1. Company Overview
14.4.2. Product Offerings
14.4.3. Financial Performance
14.4.4. Recent Initiatives
14.5. Konbu Systems
14.5.1. Company Overview
14.5.2. Product Offerings
14.5.3. Financial Performance
14.5.4. Recent Initiatives
14.6. MEKICS Co. Ltd.
14.6.1. Company Overview
14.6.2. Product Offerings
14.6.3. Financial Performance
14.6.4. Recent Initiatives
14.7. Rorze Corporation
14.7.1. Company Overview
14.7.2. Product Offerings
14.7.3. Financial Performance
14.7.4. Recent Initiatives
14.8. Ryoyo Electro Corporation
14.8.1. Company Overview
14.8.2. Product Offerings
14.8.3. Financial Performance
14.8.4. Recent Initiatives
14.9. Shibaura Mechatronics Corporation
14.9.1. Company Overview
14.9.2. Product Offerings
14.9.3. Financial Performance
14.9.4. Recent Initiatives
14.10. Shinko Electric Industries Co., Ltd.
14.10.1. Company Overview
14.10.2. Product Offerings
14.10.3. Financial Performance
14.10.4. Recent Initiatives
15.1. Primary Research
15.2. Secondary Research
15.3. Assumptions
16.1. About Us
16.2. Glossary of Terms
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