Intelligent Power Module Top Companies-Recent Developments, Business Strategy, Deal Strategy, Patent Strategy, Benchmarking and Management Outlook

Intelligent Power Module Market Size Analysis and Top Companies

The global intelligent power module market size is estimated at to hit around USD 5.58 billion by 2033 from USD 2.77 billion in 2024 with a CAGR of 8.1% from 2024 to 2033. The top companies operating in the intelligent power module market are Sino Microelectronics, Hangzhou Silan Microelectronics, STMicroelectronics, Sanken Electric, Rohm Semiconductor, Semikron, Fuji Electric, Infineon Technologies, On Semiconductor, Mitsubishi Electric and others.

Market Scope

Intelligent Power Module Market Companies

• Sino Microelectronics
• Hangzhou Silan Microelectronics
• STMicroelectronics
• Sanken Electric
• Rohm Semiconductor
• Semikron
• Fuji Electric
• Infineon Technologies
• On Semiconductor
• Mitsubishi Electric

Recent Developments

• Infineon Technologies AG, Mitsubishi Electric Corp., and STMicroelectronics N.V., three significant producers in the global intelligent power module market, are boosting their sales through merger and acquisition (M&A) and research and development (R&D) efforts. Following are a few of the major market developments:
• In May 2022, In order to ensure efficient and sustainable transportation, as well as electrical energy savings in the transportation sector, Siemens Mobility, and Mitsubishi Electric Europe B.V., signed a Memorandum of Understanding (MoU) to work together in the field of SiC power module technology.
• In February 2022, Infineon Technologies is expanding its manufacturing capabilities in the area of wide bandgap (SiC and GaN) semiconductors, which will help it maintain its market dominance in the power semiconductor sector. The business is spending more than USD 2 billion to construct a third module at its Malaysian facility in Kulim. Once fully outfitted, the new module will bring in an additional USD 2 billion in revenue every year from products made of silicon carbide and gallium nitride.
• In December 2020, A 1,200 V transfer molded silicon carbide (SiC) integrated power module was introduced by Infineon Technologies AG (IPM). The first product in its field for this voltage class is the CIPOS Maxi IPM IM828 series. The series offers a small inverter solution for variable-speed drive applications using three-phase AC motors and permanent magnet motors with excellent thermal conduction and a wide range of switching speeds. These include, but are not limited to, active filters for HVAC and industrial motor drives, pump drives, and pump drives (HVAC).
• In August 2019, the newly created super tiny intelligent power module (IPM) known as DIPIPMTM Ver.7 was unveiled by Mitsubishi Electric Corp. Low power consumption, less radiation noise, and more adaptable heat dissipation are all features of this module.
• In August 2017, Power factor correction (PFC)-equipped IPM CIPOS Mini was introduced by Infineon Technologies AG. Reducing the size of materials may be possible with the integration of CIPOS Mini IPM in end-use applications.
• In June 2017, Surface-mount, intelligent low-power modules were created recently by STMicroelectronics N.V. In space-saving motor drives for efficient motors, this power module is used. In particular in hard-switching circuits at frequencies up to 20 kHz, it also offers great switching efficiency and conduction.

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