Coherent Corp. Unveils Bondable Diamond to Control Heating in Chips
Published: 23 Feb 2026
Author: Precedence Research
Coherent Corp. has recently launched a new bondable diamond technology to enhance heat removal in high performance electronic devices. This new technology is targeted at systems that experience heat constraints, hindering efficiency and reliability. Modern chips are known to produce a substantial amount of heat because of their rising power density. Conventional cooling techniques have been ineffective in removing this heat. This poses various challenges, including performance degradation and device failure. The new diamond technology has been developed to specifically counter this problem.
This new technology enables the direct bonding of diamond to semiconductor devices. This minimizes the thermal resistance between the two materials. Consequently, heat can be extracted from the chip much faster. The company asserts that this technology is much more effective than conventional cooling techniques. The bondable diamond technology is compatible with various semiconductor materials such as silicon, silicon carbide, gallium nitride and gallium arsenide. The prominent applications of this technology include data centers, telecommunication systems and high-power electronics.
Another benefit of this technology is the elimination of the traditional thermal interface layers. These layers are known to slow down the process of heat transfer. The elimination of these layers makes the diamond solution more thermally efficient and enables the design of smaller devices. This solution is designed with careful control over the surface to ensure good bonding and capability to handle larger chips.
The increasing demand for faster and smaller electronics has made thermal management a necessity. This launch indicates the beginning of the use of advanced materials such as diamond for managing future heat issues.
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