Low-Loss Materials for 5G Market Size, Share and Trends 2025 to 2034

The market is being led by Asia-Pacific due to massive 5G deployments in China, South Korea, and Japan, and then increasing infrastructure spending in North America and Europe. The emerging economies are also increasing their deployment speed, and new markets are emerging where suppliers of materials and OEMs can find new opportunities.

Market giants like Rogers Corporation, DuPont, Panasonic, and Mitsubishi Chemical are also spending heavily on new state-of-the-art low-loss materials to bolster their 5G offerings. The future needs to innovate substrate and laminate technologies through strategic mergers and alliances.

There is a dynamic startup atmosphere that is taking shape and is aimed at sustainable, miniaturized, and high-performance material solutions of next-gen wireless systems. Advanced polymers, nano-ceramics, and flexible substrates startups are coming into play with low sourcing of them by telecom and semiconductor giants.

Sheets & Laminates: The sheets & laminates segment held a 50.4% share in the low-loss materials for 5G market in 2024, driven by their ubiquitous application in printed circuit boards (PCBs), antenna substrates, and radomes. These materials provide high-dimensional stability and mechanical and dielectric consistency required for 5G transmission of high-frequency signals. Base stations and communication facilities cannot function without sheets and laminates manufactured with PTFE, PPO, and ceramic composites to ensure low signal attenuation and optimal thermal control. The fact that they can be integrated into multilayer structures and that they can be easily produced only adds to production efficiency.

Films: The films segment captured a 13.4% share of the low-loss materials for 5G market in 2024. The filtration materials used to fabricate films based on liquid crystal polymers (LCPs) and polyimides are ideal for compact and foldable devices, antennas, and wearable electronics, owing to their flexibility and low dielectric behaviour. Further intensifying the uptake of low-loss films is the trend toward the miniaturization of RF modules and mobile components. There is also the development of ultra-thin film technology, which is increasing integration efficiency and lowering the devices overall weight, putting this segment on a path of sustained growth.

Tapes & Coatings: The tapes & coatings are dielectrically insulated, waterproof, and thermally protective for antennas, connectors, and PCBs. The coating, made of a PTFE-based, ceramic-impregnated material, reduces electromagnetic interference (EMI) and preserves signal quality at elevated frequencies. New technologies for consistent nanocoating and conductive adhesives are being developed to enhance performance consistency and energy efficiency. With the increasing size and complexity of 5G devices, tapes and coatings are becoming increasingly significant for reliability and longevity.

Antennas & Radomes: The antennas & radomes segment led the market, accounting for 44.4% share in 2024, driven by the growth in 5G base stations and the unprecedented deployment of high-frequency antennas. The application of sophisticated PTFE, ceramic, and composite materials is prevalent to enhance signal efficiency and stability, especially in outdoor and automotive communication networks. Polymer-based radomes with low loss have enhanced resistance to the stress environment and also RF transparency. The segment leadership position is supported by growing demand for mmWave antennas in smartphones, IoT devices, and infrastructure equipment.

RF Modules & Components: The RF modules & components segment is expected to grow at a significant CAGR over the forecast period, with a 13.2% market share. The implementation of high-speed wireless communication technologies. To maintain signal strength and reduce interference at high frequencies, RF front-end modules, filters, and couplers must be fabricated from low-loss materials. The trend toward smaller, more energy-efficient 5G components is driving demand for high-performance materials, such as LCP and PPO composites. The current material engineering and high-frequency packaging solutions research further improves the performance of this segment and enhances its scalability.

Printed Circuit Boards: The printed circuit boards segment contributed a significant portion of the low-loss materials for 5G market in 2024, due to the essential use of the PCBs in the transmission of high-frequency data over 5G hardware. PCBs require materials with uniform dielectric properties, low dissipation, and high heat resistance to ensure uniform performance in a fast network. PTFE, PPO, and hybrid ceramic laminates are being used to design multilayer PCBs with lower signal loss and reduced electromagnetic interference. The demands on PCB materials have also increased, as the complexity of 5G systems and massive MIMO and beamforming systems has grown.

Sub-6 GHz: The Sub-6 GHz segment held a 72.8% share of the low-loss materials for 5G market in 2024. The frequency range strikes a good compromise between coverage, capacity, and signal penetration, making it ideal for urban, suburban, and rural deployment. Low-loss materials, including PTFE, PPO, and LCP, are used in antennas and RF modules to transmit signals and maintain low attenuation. These conditions for an active market, leading and growth trajectory will persist as telecom operators around the globe begin to roll out their Sub-6 GHz 5G infrastructure.

mmWave (24-100 GHz): The mmWave (24-100 GHz) segment is poised for substantial growth in the low-loss materials for 5G market, holding a 13.3% share in 2024, driven by the desire to achieve extremely high-speed and low-latency communication in the high-density urban areas. mmWave frequencies enable high data rates to support applications in smart cities, autonomous systems, and high-definition streaming. With the current increase in technology and faster network densification, the adoption of mmWave is poised to rise considerably, offering strong prospects for new low-loss material applications, particularly for next-generation 5G and beyond.

Base Stations: The base stations segment led the market, accounting for 40.5% in 2024, driven by the mass deployment of 5G infrastructure across cities and rural areas. Base stations require high dielectric stability, small signal loss, and thermal management materials to enable them to provide high-frequency and capacity data transmission. PTFE, ceramic composites, and laminates are used in antennas, radomes, and circuit boards to ensure device performance is not affected in harsh outdoor environments. The growing demand for mmWave base stations, small-cell networks, and beamforming technology has led to the adoption of low-loss materials as the optimal solution for channel-optimized signal propagation.

Smartphones & Consumer Devices: The segment is projected to grow at a significant CAGR over the forecast period, with a 13.6% share in 2024. Driven by the 5G opportunities of mobile and wearable electronics. Polyimides and LCPs are low-loss materials that have been used in antennas, flexible circuits, and RF modules to ensure consistent signal behaviour and enable miniature designs. The necessity of smartphones, tablets, and AR/VR devices to operate with fast and low-latency internet connections is shaping the creation of materials with opportunities, including miniaturization and energy efficiency.

Automotive (V2X Communication): The automotive (V2X Communication) market took a significant portion of the low-loss materials for 5G market in 2024, with the help of the increasing use of cellular vehicle-to-everything (V2X) technologies. Antennas, sensors, and control units in automotive applications require low-loss materials that enable real-time data transfer among vehicles, infrastructure, and pedestrians. Substances such as PTFE and ceramic composites are very signal-clear and electromagnetic-compatible, making them safe and reliable for connected and autonomous vehicles. The increased use of 5G-based telematics and advanced driver-assistance systems (ADAS) is also driving demand.

North America is estimated to achieve the highest CAGR throughout the forecast period, driven by rapid 5G deployment, robust industry growth, and the presence of major technology and telecommunications companies. The region emphasis on mmWave networks, smart infrastructure, and connected industries is increasing the need for advanced, low-loss materials. New opportunities in material innovation are associated with high-frequency applications in defense, aerospace, autonomous vehicles, and industrial IoT. The use of PTFE, LCP, and ceramic materials in the U.S. and Canada is growing as companies seek to improve signal integrity and energy efficiency in communication equipment modules. Technological innovations are driven by strategic alliances among suppliers and manufacturers of materials, chip companies, and telecommunications companies.

U.S Low-Loss Materials for 5G Market Trends

The U.S. is the growth leader in North America in the low-loss materials for 5G market, with the massive effort of modernizing the networks and robust investments into semiconductor manufacturing. The introduction of 5G by major cell phone companies in the country and government-funded infrastructure projects are augmenting demand for high-performance dielectric products. Rogers Corporation, DuPont, and 3M, the American companies, are pioneers in innovative PTFE and LCP antenna, PCB, and RF module composites. With the spread of 5G into autonomous vehicles, healthcare, and defense, the U.S. remains a key driver of global trends in the engineering of high-frequency materials.

The European low-loss material for 5G market is experiencing sustainable growth because of the increased investments in the 5G infrastructure, increased smart manufacturing, and increased necessity to offer high-speed connectivity in industries. The regions digital transformation and green communication technologies are driving the adoption of energy-efficient, low-loss materials such as PSOE, ceramic composites, and PPO laminates. Major European telecom network operators and material manufacturers are working together to develop high-performance substrates used in base stations, antennas, and RF modules that meet the stringent environmental and performance requirements.

UK Low-Loss Materials for 5G Market Trends

The UKs low-loss material for 5G market has gained momentum at a growing pace because the UK is resolved to become a nation with full 5G coverage and the evolution of the digital connection. Government-funded initiatives, including the 5G Testbeds and Trials Programme, are promoting innovation in high-frequency materials for communication infrastructure and smart city initiatives. UK-based research facilities and startups are busy developing more advanced dielectric polymers and ceramic composites for use in antennas, PCBs, and radar systems. The powerful automotive, aerospace, and defense industries in the country are also driving the adoption of low-loss materials for data transmission with high security and high speed.

Offers high-frequency circuit materials of type RO3000(r), RO4000(r) series that are ensured to deliver high signal integrity with 5G antennas and base stations.

Develops low dielectric material and thermally stable substrate in miniature and mini high-performance RF modules.

Mitsui Chemicals produces high-purity polymer resins and dielectric materials, which are 5G communications and semiconductor packaging optimization.

It produces the low-loss materials made out of fluoropolymer and ceramics utilized in the 5G networks in the antennas, radomes, and high-frequency PCBs.

Provides high-performance, low-loss laminates such as RO3000 and RO4000 series used in 5G antennas, base stations, mmWave devices, and high-frequency circuit boards requiring excellent dielectric stability.

Supplies advanced low-loss materials including PTFE laminates, flexible circuit materials, and high-frequency dielectrics designed for 5G RF modules, antennas, and high-speed interconnects.

Offers low-loss multilayer circuit materials and high-frequency resin systems used in 5G infrastructure, small-cell antennas, and high-speed IC packaging.

Develops specialty resins and low-dielectric materials engineered for mmWave 5G applications, semiconductor packaging, and high-density interconnects.

Produces fluoropolymer-based laminates, ultra-low-dielectric glass materials, and high-frequency substrates suitable for 5G antennas, phased-array modules, and RF front-end devices.