Keysight Launches FITS-8CH: A Significant Milestone for High-Speed Interconnect Testing
Published: 17 Mar 2026
Author: Precedence Research
On March 11,2026, Keysight Technologies, Inc., a leading technology company, has launched a new product called FITS-8CH, a new solution in Keysight’s Functional Interconnect Test Solutions(FITS) portfolio. This product facilitates the testing of high-speed optical and copper interconnects used in network equipment and infrastructure, validating error performance at the digital layer.
The speeds in high-end communications continue to increase with new architectures in development, including 400 GE, 800 GE, and upcoming 1.6T Ethernet systems. Manufacturers of these systems are facing a challenge in ensuring the reliability and error-free performance of these high-speed interconnects. Keysight’s FITS-8CH provides a solution in this regard as it provides BER and FEC performance validation across multiple lanes simultaneously.
System-Level Validation Beyond Physical Layer Tools
Most test and measurement tools available in the industry validate the performance of these high-speed interconnects at the physical layers, ensuring compliance with industry specifications at the electrical lanes of these high-speed systems. However, with the advent of high-end systems with multiple layers of complexity in their operation, validation of these systems at the digital layer, where error simulation occurs in real-time, becomes essential. FITS-8CH provides validation at the digital layer. This product provides various benefits such as multiple lane digital validation, high-quality signal generation and automated lane tuning.
The global molded interconnect device market size was calculated at USD 6.21 billion in 2025 and is predicted to increase from USD 6.93 billion in 2026 to approximately USD 18.56 billion by 2035, expanding at a CAGR of 11.57% from 2026 to 2035 as the demand grows for compact, lightweight and multi-functional electronic devices in automotive, aerospace and consumer electronics sectors.
Supporting Development and Manufacturing
The FITS-8CH is meant to be used to support interconnect validation throughout the product lifecycle, from research and development to in-process manufacturing and system qualification. By detecting problems such as mechanical misalignment, thermal failure, and improper signal configuration early on, costly recalls can be minimized. Keysight is planning to showcase its entire range of FITS solutions at OFC 2026, an event to be held in mid-March. The company intends to demonstrate how this solution complements existing physical layer solutions and meets the needs for high-speed networks.
A recent report by Precedence Research highlights that the molded interconnect device market is benefiting from rapid progress in 3D printing technology, flexible circuits and miniaturization of electronic devices.