Samsung Secures Epic USD 200 Billion Partnership with Broadcom

In July 2026, Samsung Electronics and Broadcom signed a memorandum of understanding (MoU) to expand their strategic collaboration estimated at over USD 200 billion across memory and foundry technologies, to help the next generation of AI infrastructure. Jinman Han, President and Head of Samsung Electronics’ Foundry Business, Hock Tan, President and CEO of Broadcom, senior executives from both companies, and representatives of the Korean government announced the MOU during the AI Summit, held at The Midway in San Francisco. 

Inside Samsung and Broadcom’s USD 200 B Leap in 2nm and Memory

Samsung and Broadcom are teaming up to offer top-tier memory solutions, such as High Bandwidth Memory (HBM), for Broadcom’s next-gen AI accelerators. Their collaboration will also prioritize Samsung’s 2-nanometer process technologies for Broadcom’s Wireless Broadband Communications (WBC) products, including advanced packaging techniques, and is expected to extend to advanced packaging technologies built on Samsung’s 2nm process to enhance AI performance and energy efficiency.

Young Hyun Jun, Vice Chairman and CEO of Samsung Electronics' Device Solutions (DS) Division, emphasized that AI is driving demand for integrated semiconductor technologies. He emphasized that the expanded partnership will enhance value for customers and advance AI infrastructure. Additionally, Charlie Kawwas, President of Broadcom's Semiconductor Solutions Group, highlighted the importance of collaboration in scaling AI infrastructure, leveraging Samsung’s memory and foundry expertise alongside Broadcom's connectivity leadership to support the next generation of AI infrastructure.

With capabilities encompassing memory, logic, foundry, and advanced packaging, Samsung is uniquely positioned to deliver integrated semiconductor solutions for the AI era. The expanded collaboration with Broadcom reflects Samsung’s continued focus on supporting customers with end-to-end semiconductor technologies across an increasingly diverse range of AI and high-performance computing applications.

Impact on the Semiconductor and Electronics Industry

This MOU positively impacts the semiconductor and electronics industry by integrating Broadcom's custom AI accelerator and ASIC design expertise with Samsung's sub-2nm foundry nodes, High Bandwidth Memory (HBM), and 2.3D/2.5D advanced packaging to scale next-generation AI infrastructure.

This mainly impacts the industry by reducing foundry monopoly power, strengthening contract manufacturing, challenging TSMC's monopoly, supporting custom AI accelerators, and securing HBM supply chains with guarantees of long-term delivery of next-generation memory products for hyperscale data centers.

This also addresses industry limitations by mitigating bottlenecks, which shifts manufacturing away from single-source reliance in Taiwan. It also resolves packaging limits by deploying advanced 2.3D and 2.5D integration to boost thermal efficiency and processing power. It drives production stability that locks in long-term capacity planning through 2030, with high market demand.

Impact on the High-Performance Computing Industry

The global high-performance computing market size is estimated at USD 59.85 billion in 2025 and is predicted to increase from USD 65.42 billion in 2026 to approximately USD 141.62 billion by 2035, expanding at a CAGR of 9.8% from 2026 to 2035.

According to Precedence Research, this MOU will positively impact the industry by integrating Broadcom's custom AI accelerator and ASIC design leadership with Samsung's sub-2nm manufacturing, next-gen High Bandwidth Memory (HBM), and advanced packaging to relieve massive industry supply bottlenecks.

This MOU helps to transform the high-performance computing industry by shifting application-specific integrated circuits away from generic GPUs and accelerating tailored AI and HPC workloads while diversifying the supply chain, with lower dependence on TSMC. Samsung Foundry emerges as a strong competitor in sub-2nm production.

Various industry challenges are further addressed through joint development of next-gen HBM to alleviate data-bandwidth bottlenecks, and innovative packaging improves performance and energy efficiency by ensuring stable hardware availability during global demand surges.

About Samsung Electronics

Samsung Electronics is a global South Korean technology company and is headquartered in Suwon. It leads the globe in consumer electronics, information technology, and semiconductor manufacturing, operating through major divisions spanning mobile devices, home appliances, digital displays, and core memory components. 

Its major offerings include mobile experience (MX), visual display and consumer electronics, digital appliances, device solutions, and ecosystem services. Its major aim is to devote its talent and technology to creating superior products and services that contribute to a better global society, accelerating sustainable development.

About Broadcom Inc.

Broadcom Inc. is a global technology leader headquartered in California. It mainly designs, develops, and supplies critical semiconductor devices and infrastructure software, making it a foundational backbone for modern data centers, cloud computing, and artificial intelligence infrastructure.

These semiconductor solutions including AI and networking, wireless and mobile, broadband and wired, and server storage, along with infrastructure software and enterprise software. Overall, it designs, engineers, and delivers mission-critical, high-performance infrastructure technology at scale for the world's most demanding organizations to power the flow of global data, cloud services, and emerging AI networks.