Covestro Showcases Advanced Material Solutions for AI Infrastructure and Embodied Intelligence at COMPUTEX 2026

In the latest materials innovation showcase at COMPUTEX 2026 in Taipei. Covestro presented a wide range of advanced polymer materials. These can meet the growing demand for cutting-edge technologies to power the fast-changing field of artificial intelligence infrastructure, robotics, and connected electronic devices. Under the theme “The Material Effect” of this company.  The exhibition highlights the capabilities of high-performance engineering plastics and thermoplastic polyurethane (TPU).  These materials help manufacturers tackle today's increasing technical demands in the field of AI computing automation.

The company with the overall industry goals show the close linkage of material innovation. Ensure consistent supply and deliver desirable performance. The company's newest products are made in a way to meet intelligent device changing needs in newly manner. It is now imperative for manufacturers' vision. Furthermore, they utilize materials that also take their environmental impact into account.

The company demonstrated an approach to materials science. Along with the integration of materials into real-world industrial processing applications. The strategy combines the skills of various business segments. Further enabling customers to speed up the development process to prototyping. Such synergy could become even more important in the coming years, when AI technologies would become more widely used in business.

According to Precednece Research the global data center plastics market size accounted for USD 1.50 billion in 2025 and is predicted to increase from USD 1.72 billion in 2026 to approximately USD 5.84 billion by 2035, expanding at a CAGR of 14.55% from 2026 to 2035. The market is expanding due to the adoption of high-performance engineering plastics in next-generation digital infrastructures.

Advanced Polymer Technologies Strengthen AI Computing Infrastructure

The computing power of Artificial Intelligence is steadily driving hardware capabilities to unprecedented levels. To meet these ever-increasing demands, Covestro's new portfolio of solutions has been created. It combines thermal stability, flame retardancy, and mechanical durability in one advanced polymer solution.

The company's polycarbonate materials enable critical infrastructure in AI data centers. High-performance environments such as power distribution units, cooling assemblies, and energy management systems, as well as servers, are some beneficial offerings. Such applications place increasingly tough thermal demands on these types of applications. Material stability is also a crucial attribute to ensure the long-term reliability of these applications. The stronger the heat resistance, the more manufacturers will be able to build equipment to accommodate continually higher densities of computing.

Cooling efficiency is also emerging as a critical factor within the increasing size of AI-optimised facilities. The high density hardware racks often produce significantly more heat than with other enterprise systems. Components that are designed to be thermally stable over extended periods of time are required. The ability of Covestro's engineering materials to meet these challenging requirements. They also play a role in the efficient heat management across contemporary computing infrastructure.

Growing AI Infrastructure Increases Demand for Advanced Material Technologies

The company's COMPUTEX presentation comes at a time of outstanding AI infrastructure growth globally. Given the ongoing significant investments by hyperscale cloud companies in their next-generation data processing infrastructure. Fueling large-scale machine learning, advanced analytics, and generative AI applications. AI server manufacturing has picked up substantial speed. The growth in these trends demands materials. These will sustain themselves over the increasing power density and more demanding operating conditions. The company's overall program also illustrates evolving requirements in the more advanced manufacturing sectors.